Microscope system
    81.
    发明授权

    公开(公告)号:US09977230B2

    公开(公告)日:2018-05-22

    申请号:US14934414

    申请日:2015-11-06

    发明人: Kiyoshi Yuri

    摘要: A microscope system includes a virtual-slide microscope that acquires a virtual-slide image of a specimen when mounted on a first stage, and a fluorescence microscope that acquires a fluorescence image of the specimen when mounted on a second stage. The virtual-slide microscope includes a display and an image-capturing-condition setting portion that sets image capturing conditions, including a fluorescence-image acquisition position, on the virtual-slide image. The fluorescence microscope includes a memory portion that stores coordinate transformation data between the coordinates of the specimen when fixed on the first stage and the coordinates of the specimen when fixed on the second stage, a condition input portion to which the image capturing conditions are input, and a driving-condition setting portion that sets a driving condition on the basis of the image capturing conditions and the coordinate transformation data.

    IMAGING ELEMENT MOUNTING SUBSTRATE, IMAGING DEVICE AND IMAGING MODULE

    公开(公告)号:US20180088296A1

    公开(公告)日:2018-03-29

    申请号:US15714199

    申请日:2017-09-25

    摘要: An imaging element mounting substrate may include an insulating substrate and a metal substrate. The insulating substrate may include a first mounting region for mounting an imaging element on a top surface, and a second mounting region located a distance away from the first mounting region for mounting one or more electronic components. The insulating substrate may include a fixed region for securing a lens housing surrounding the first mounting region. A metal substrate may be bonded to a bottom surface of the insulating substrate. A third mounting region located between the first mounting region and the second mounting region in the fixed region of the insulating substrate may be positioned with respect to the center of the insulating substrate in a plan view. The metal substrate may be located to overlap with the third mounting region and bestride the first mounting region and the second mounting region.

    Methods for clocking an image sensor

    公开(公告)号:US09930276B2

    公开(公告)日:2018-03-27

    申请号:US15149321

    申请日:2016-05-09

    发明人: Christopher Parks

    IPC分类号: H04N5/372 H01L27/148

    摘要: Methods of measuring and calibrating the gain of a CCD imaging system are described. Charge injectors may be present on either side of an image sensor array that provide test charges to respective calibration VCCDs. Test charges may be transferred to upper and lower HCCDs during quad-output read out or to only the lower HCCD during dual-output or single-output read out. In each quadrant of the imaging system, test charges may be transferred to an EMCCD output or to a non-EMCCD output via a charge switch based on the magnitude of the test charges. The gains of all EMCCD outputs and non-EMCCD outputs in the imaging system may be calibrated against one another by adjusting the gain at each output when a discrepancy is detected between any two outputs.

    Apparatus for High-Speed Imaging Sensor Data Transfer

    公开(公告)号:US20180059033A1

    公开(公告)日:2018-03-01

    申请号:US15671729

    申请日:2017-08-08

    摘要: An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.