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公开(公告)号：US11862522B2
公开(公告)日：2024-01-02
申请号：US17179379
申请日：2021-02-18
发明人： Barak Bringoltz , Evgeni Gurevich , Ido Adam , Yoel Feler , Dror Alumot , Yuval Lamhot , Noga Sella , Yaron De Leeuw , Tal Yaziv , Eltsafon Ashwal-Island , Lilach Saltoun , Tom Leviant
CPC分类号： H01L22/20 , G03F7/70633 , G03F9/7003 , H01L22/12
摘要： Methods, metrology modules and target designs are provided, which improve the accuracy of metrology measurements. Methods provide flexible handling of multiple measurement recipes and setups and enable relating them to landscape features that indicate their relation to resonance regions and to flat regions. Clustering of recipes, self-consistency tests, common processing of aggregated measurements, noise reduction, cluster analysis, detailed analysis of the landscape and targets with skewed cells are employed separately or in combination to provide cumulative improvements of measurement accuracy.
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公开(公告)号：US11709433B2
公开(公告)日：2023-07-25
申请号：US17689934
申请日：2022-03-08
发明人： Vladimir Levinski , Amnon Manassen , Eran Amit , Nuriel Amir , Liran Yerushalmi , Amit Shaked
CPC分类号： G03F7/70625 , G03F7/70633 , G03F7/70683
摘要： Metrology targets, production processes and optical systems are provided, which enable metrology of device-like targets. Supplementary structure(s) may be introduced in the target to interact optically with the bottom layer and/or with the top layer of the target and target cells configurations enable deriving measurements of device-characteristic features. For example, supplementary structure(s) may be designed to yield Moiré patterns with one or both layers, and metrology parameters may be derived from these patterns. Device production processes were adapted to enable production of corresponding targets, which may be measured by standard or by provided modified optical systems, configured to enable phase measurements of the Moiré patterns.
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3.发明授权公开(公告)号：US11580398B2
公开(公告)日：2023-02-14
申请号：US15694719
申请日：2017-09-01
发明人： Jing Zhang , Ravi Chandra Donapati , Mark Roulo , Kris Bhaskar
摘要： Methods and systems for performing diagnostic functions for a deep learning model are provided. One system includes one or more components executed by one or more computer subsystems. The one or more components include a deep learning model configured for determining information from an image generated for a specimen by an imaging tool. The one or more components also include a diagnostic component configured for determining one or more causal portions of the image that resulted in the information being determined and for performing one or more functions based on the determined one or more causal portions of the image.
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公开(公告)号：US11569138B2
公开(公告)日：2023-01-31
申请号：US15048676
申请日：2016-02-19
发明人： Mor Azarya , Michael D. Brain , Ami Appelbaum , Shai Mark , Arie Hoffman
IPC分类号： G05B19/418 , H01L21/66 , H01L21/67
摘要： A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included on the one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.
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公开(公告)号：US11551980B2
公开(公告)日：2023-01-10
申请号：US16470886
申请日：2019-05-19
发明人： Roie Volkovich , Anna Golotsvan , Eyal Abend
摘要： A dynamic misregistration measurement amelioration method including taking at least one misregistration measurement at multiple sites on a first semiconductor device wafer, which is selected from a batch of semiconductor device wafers intended to be identical, analyzing each of the misregistration measurements, using data from the analysis of each of the misregistration measurements to determine ameliorated misregistration measurement parameters at each one of the multiple sites, thereafter ameliorating misregistration metrology tool setup for ameliorated misregistration measurement at the each one of the multiple sites, thereby generating an ameliorated misregistration metrology tool setup and thereafter measuring misregistration at multiple sites on a second semiconductor device wafer, which is selected from the batch of semiconductor device wafers intended to be identical, using the ameliorated misregistration metrology tool setup.
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公开(公告)号：US11537043B2
公开(公告)日：2022-12-27
申请号：US17161645
申请日：2021-01-28
发明人： Yoel Feler , Vladimir Levinski , Roel Gronheid , Sharon Aharon , Evgeni Gurevich , Anna Golotsvan , Mark Ghinovker
摘要： Metrology methods and targets are provided for reducing or eliminating a difference between a device pattern position and a target pattern position while maintaining target printability, process compatibility and optical contrast—in both imaging and scatterometry metrology. Pattern placement discrepancies may be reduced by using sub-resolved assist features in the mask design which have a same periodicity (fine pitch) as the periodic structure and/or by calibrating the measurement results using PPE (pattern placement error) correction factors derived by applying learning procedures to specific calibration terms, in measurements and/or simulations. Metrology targets are disclosed with multiple periodic structures at the same layer (in addition to regular target structures), e.g., in one or two layers, which are used to calibrate and remove PPE, especially when related to asymmetric effects such as scanner aberrations, off-axis illumination and other error sources.
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公开(公告)号：US11536940B2
公开(公告)日：2022-12-27
申请号：US17109528
申请日：2020-12-02
发明人： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
摘要： A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).
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8.发明授权公开(公告)号：US11410830B1
公开(公告)日：2022-08-09
申请号：US16421004
申请日：2019-05-23
发明人： Hong Xiao , Lawrence Muray , Nick Petrone , John Gerling , Abdurrahman Sezginer , Alan D. Brodie , Kuljit Virk , Qiang Q. Zhang , Grace Hsiu-Ling Chen
IPC分类号： H01J37/244 , H01J37/22 , H01J37/28
摘要： A system is disclosed. In one embodiment, the system includes a scanning electron microscopy sub-system including an electron source configured to generate an electron beam and an electron-optical assembly including one or more electron-optical elements configured to direct the electron beam to the specimen. In another embodiment, the system includes one or more grounding paths coupled to the specimen, the one or more grounding paths configured to generate one or more transmission signals based on one or more received electron beam-induced transmission currents. In another embodiment, the system includes a controller configured to: generate control signals configured to cause the scanning electron microscopy sub-system to scan the portion of the electron beam across a portion of the specimen; receive the transmission signals via the one or more grounding paths; and generate transmission current images based on the transmission signals.
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公开(公告)号：US11353493B2
公开(公告)日：2022-06-07
申请号：US16619847
申请日：2019-07-10
发明人： Shlomit Katz , Roie Volkovich , Anna Golotsvan , Raviv Yohanan
摘要： A data-driven misregistration parameter configuration and measurement system and method including simulating a plurality of measurement simulations of at least one multilayered semiconductor device, selected from a batch of multilayered semiconductor devices intended to be identical, using sets of measurement parameter configurations, generating simulation data for the device, identifying recommended measurement parameter configurations selected from sets of measurement parameter configurations, providing a multilayered semiconductor device selected from the batch, providing the at least one recommended set of measurement parameter configurations to a misregistration metrology tool having multiple possible sets of measurement parameter configurations, measuring at least one multilayered semiconductor device, selected from the batch, using the recommended set, thereby generating measurement data for the device, thereafter identifying a final recommended set of measurement parameter configurations and measuring misregistration of at least one multilayered semiconductor device, selected from the batch, using the final recommended set.
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公开(公告)号：US11314173B2
公开(公告)日：2022-04-26
申请号：US16672483
申请日：2019-11-03
发明人： Vladimir Levinski , Yuri Paskover , Amnon Manassen , Yoni Shalibo
摘要： Metrology tools and methods are provided, which estimate the effect of topographic phases corresponding to different diffraction orders, which result from light scattering on periodic targets, and adjust the measurement conditions to improve measurement accuracy. In imaging, overlay error magnification may be reduced by choosing appropriate measurement conditions based on analysis of contrast function behavior, changing illumination conditions (reducing spectrum width and illumination NA), using polarizing targets and/or optical systems, using multiple defocusing positions etc. On-the-fly calibration of measurement results may be carried out in imaging or scatterometry using additional measurements or additional target cells.
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