METHOD FOR MANUFACTURING DEVICE FABRICATION WAFER

    公开(公告)号:US20220002905A1

    公开(公告)日:2022-01-06

    申请号:US17277378

    申请日:2019-09-19

    摘要: In a method for manufacturing a device fabrication wafer, an SiC epitaxial wafer that is an SiC wafer 40 having a monocrystalline SiC epitaxial layer formed thereon is subjected to a basal plane dislocation density reduction step of reducing the density of basal plane dislocations existing in the epitaxial layer of the SiC epitaxial wafer, to thereby manufacture the device fabrication wafer for use to fabricate a semiconductor device. In the basal plane dislocation density reduction step, the SiC epitaxial wafer is heated under Si vapor pressure for a predetermined time necessary to reduce the density of basal plane dislocations, without formation of a cap layer on the SiC epitaxial wafer, so that the density of basal plane dislocations is reduced with suppression of surface roughening.

    Expanded-graphite sheet
    4.
    发明授权

    公开(公告)号:US10538691B2

    公开(公告)日:2020-01-21

    申请号:US15400822

    申请日:2017-01-06

    发明人: Yoshiaki Hirose

    IPC分类号: C09K5/14 H05K7/20 H05K9/00

    摘要: An expanded-graphite sheet whose thermal conductivity in its surfacewise directions is relatively uniform and higher than its thermal conductivity in its perpendicular direction can be produced efficiently at relatively low cost. Because the expanded-graphite sheet is made of expanded graphite alone and has thermal conductivity in parallel direction of 350 W/(m·K) or more, its thermal conductivity in parallel direction is much higher than its thermal conductivity in a perpendicular direction; therefore, it is suitable for the conduction and diffusion of heat. Besides, the expanded-graphite sheet can be produced easily, in a short time, efficiently, at relatively low cost.

    HEAT TREATMENT VESSEL FOR SINGLE-CRYSTAL SILICON CARBIDE SUBSTRATE AND ETCHING METHOD

    公开(公告)号:US20180301359A1

    公开(公告)日:2018-10-18

    申请号:US15766191

    申请日:2016-10-06

    摘要: A heat treatment container (1) is provided with support members (6) for supporting a disc-shaped SiC substrate (2), which is an object, at a time of an etching treatment of the SiC substrate (2). Each of the support members (6) has an inclined surface (6F) for supporting a lower surface end (2E) of the SiC substrate (2), the inclined surface being inclined so as to increasingly approach the centerline of the SiC substrate (2) going downward. More specifically, each of the support members (6) is formed in a conical shape with a diameter that increases going downward, and a conical surface which is the peripheral surface of each supporting member forms the inclined surface (6F). A vertically-middle section of the inclined surface (6F) contacts the lower surface end (2E) of the SiC substrate (2).