公开(公告)号：US20190207290A1

公开(公告)日：2019-07-04

申请号：US16325351

申请日：2016-09-30

Applicant: Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

Inventor： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

IPC: H01P11/00 ,  H01P3/12 ,  H01P3/14 ,  H01P3/123

CPC classification number: H01P11/002 ,  H01P3/122 ,  H01P3/123 ,  H01P3/14

Abstract: A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.

公开(公告)号：US20170287736A1

公开(公告)日：2017-10-05

申请号：US15085538

申请日：2016-03-30

Applicant: Sasha Oster ,  Adel A. Elsherbini ,  Joshua D. Heppner ,  Shawna M. Liff

Inventor： Sasha Oster ,  Adel A. Elsherbini ,  Joshua D. Heppner ,  Shawna M. Liff

IPC: H01L21/56 ,  H01L23/31

CPC classification number: H01L23/315 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/467 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/81

Abstract: Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial material. The electronics package that includes this sacrificial material is then overmolded, with little or no change needed in the overmolding process. Following overmolding, the sacrificial material is removed such as using a thermal, chemical, optical, or other decomposing process. This proposed use of sacrificial material allows for formation of complex 3-D cavities, and reduces or eliminates the need for precise material removal tolerances. Multiple instances of the sacrificial material may be removed simultaneously, replacing a serial drilling process with a parallel material removal manufacturing process.

公开(公告)号：US09368455B2

公开(公告)日：2016-06-14

申请号：US14229771

申请日：2014-03-28

Applicant: Ravindranath V. Mahajan ,  John S. Guzek ,  Adel A. Elsherbini ,  Nitin Ashok Deshpande

Inventor： Ravindranath V. Mahajan ,  John S. Guzek ,  Adel A. Elsherbini ,  Nitin Ashok Deshpande

IPC: H01L23/00 ,  H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/568 ,  H01L24/16 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/81

Abstract: An electromagnetic interference shield is described for semiconductor chip packages. In some embodiments, a package has a semiconductor die. a redistribution layer, a mold compound over the die, a plurality of vias through the mold compound and outside the die to form a shield, and a metal film over the vias. and over the mold compound.

Abstract translation: 半导体芯片封装描述了电磁干扰屏蔽。 在一些实施例中，封装具有半导体管芯。 再分布层，模具上的模具化合物，通过模具化合物的多个通孔和模具外部以形成屏蔽，以及在通孔上方的金属膜。 并在模具化合物上。

公开(公告)号：US20180084643A1

公开(公告)日：2018-03-22

申请号：US15267872

申请日：2016-09-16

Applicant: Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Adel A. Elsherbini ,  Sasha Oster ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

Inventor： Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Adel A. Elsherbini ,  Sasha Oster ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/147 ,  A61B5/00 ,  A61B5/6833 ,  A61B2562/164 ,  A61B2562/166 ,  H05K1/0283 ,  H05K1/112 ,  H05K1/181 ,  H05K3/365 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/10318

Abstract: A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.

公开(公告)号：US20170093007A1

公开(公告)日：2017-03-30

申请号：US14866693

申请日：2015-09-25

Applicant: Adel A. ELSHERBINI ,  Mathew Manusharow ,  Krishna Bharath ,  Zhichao Zhang ,  Yidnekachew S. Mekonnen ,  Aleksandar Aleksov ,  Henning Braunisch ,  Feras Eid ,  Javier Soto

Inventor： Adel A. ELSHERBINI ,  Mathew Manusharow ,  Krishna Bharath ,  Zhichao Zhang ,  Yidnekachew S. Mekonnen ,  Aleksandar Aleksov ,  Henning Braunisch ,  Feras Eid ,  Javier Soto

IPC: H01P3/08

CPC classification number: H05K1/0245 ,  H01P3/02 ,  H01P3/026 ,  H01P3/08 ,  H01P3/085 ,  H01P3/088

Abstract: Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

公开(公告)号：US20150188218A1

公开(公告)日：2015-07-02

申请号：US14141830

申请日：2013-12-27

Applicant: Adel A. ELSHERBINI ,  Telesphor Kamgaing ,  Sarah K. Haney

Inventor： Adel A. ELSHERBINI ,  Telesphor Kamgaing ,  Sarah K. Haney

IPC: H01Q1/38 ,  H01Q1/50

CPC classification number: H01Q1/38 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01Q1/2283

Abstract: A method including disposing a transmission line or an antenna on dielectric material; and removing a portion of the dielectric material from a region adjoining the transmission line or the antenna where the electromagnetic radiation from the transmission line or the antenna is predetermined to be greater than another portion of the dielectric material. An apparatus including a package substrate including a transmission line coupled to an antenna, the transmission line and the antenna disposed on a dielectric layer including an organic dielectric material having a first dielectric constant and a second material having a dielectric constant less than the first dielectric constant, wherein the second dielectric material adjoins a portion of the transmission line or the antenna.

Abstract translation: 一种包括在电介质材料上布置传输线或天线的方法; 以及从邻近传输线或天线的区域去除电介质材料的一部分，其中来自传输线或天线的电磁辐射被预定为大于电介质材料的另一部分。 一种包括包括耦合到天线的传输线的封装衬底的装置，所述传输线和天线设置在包括具有第一介电常数的有机介电材料和介电常数小于所述第一介电常数的第二材料的电介质层上 ，其中所述第二电介质材料邻接所述传输线或所述天线的一部分。

公开(公告)号：US20140266902A1

公开(公告)日：2014-09-18

申请号：US13799645

申请日：2013-03-13

Applicant: Telesphor Kamgaing ,  Adel A. Elsherbini

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini

IPC: H01Q21/29 ,  H01P11/00 ,  H01Q21/06 ,  H01Q3/24 ,  H01Q1/50 ,  H01Q15/08

CPC classification number: H01Q21/293 ,  H01L2224/16225 ,  H01P11/00 ,  H01Q1/36 ,  H01Q1/50 ,  H01Q3/24 ,  H01Q3/26 ,  H01Q15/08 ,  H01Q21/061 ,  H01Q21/065 ,  H01Q23/00 ,  H01Q25/00 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.

Abstract translation: 本公开的实施例涉及一种单包装通信设备，其包括具有多个可独立选择的天线元件阵列的天线模块。 不同阵列的天线元件可以在不同的信号角度范围上发送和/或接收数据信号。 通信设备还可以包括用于单独地激活各个阵列的交换机模块。 在一些实施例中，射频（RF）通信模块可以包括在通信设备的包中。 在一些实施例中，RF通信模块可以被配置为使用多个天线元件阵列在毫米波（mm波）网络上进行通信。

公开(公告)号：US20230207436A1

公开(公告)日：2023-06-29

申请号：US17561531

申请日：2021-12-23

Applicant: Adel A. ELSHERBINI ,  Telesphor KAMGAING

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING

IPC: H01L23/498 ,  H01L23/15 ,  H01L25/065

CPC classification number: H01L23/49827 ,  H01L23/15 ,  H01L25/0655 ,  H01L23/49838

Abstract: Embodiments disclosed herein include die modules, electronic packages, and systems. In an embodiment, a die module comprises a first substrate and a first die over the first substrate. In an embodiment, the die module further comprises a second die over the first substrate adjacent to the first die. In an embodiment, the die module further comprises a via module through the first substrate. In an embodiment, the via module comprises a second substrate, where the second substrate comprises glass, and a via through the second substrate.

公开(公告)号：US10468737B2

公开(公告)日：2019-11-05

申请号：US15859482

申请日：2017-12-30

Applicant: Georgios C. Dogiamis ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Telesphor Kamgaing

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Telesphor Kamgaing

IPC: H01P5/10 ,  H01P5/107 ,  H01P3/02 ,  H01Q13/08 ,  H01Q13/10

Abstract: Embodiments include waveguide launchers and connectors (WLCs), and a method of forming a WLC. The WLC has a waveguide connector with a waveguide launcher, a taper, and a slot-line signal converter; and a balun structure on the slot-line signal converter, where the taper is on the slot-line signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The WLC may have the waveguide connector disposed on the package, and a waveguide coupled to waveguide connector. The WLC may include assembly pads and external walls of the waveguide connector electrically coupled to package. The WLC may have the balun structure convert a signal to a slot-line signal, and the waveguide launcher converts the slot-line signal to a closed waveguide mode signal, and emits the closed signal along channel and propagates the closed signal along taper slot to the waveguide coupled to waveguide connector.

公开(公告)号：US10057796B2

公开(公告)日：2018-08-21

申请号：US14552587

申请日：2014-11-25

Applicant: Adel A. Elsherbini ,  Telesphor Kamgaing ,  Pablo Herrero ,  Bernhard Raaf

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Pablo Herrero ,  Bernhard Raaf

IPC: H04W24/08 ,  H04B7/04 ,  H01Q1/24

CPC classification number: H04W24/08 ,  H01Q1/245 ,  H04B7/04

Abstract: Described herein are architectures, platforms and methods for implementing an antenna array with a dynamic polarization adjustment in a portable device.