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公开(公告)号：US20140151096A1
公开(公告)日：2014-06-05
申请号：US13693403
申请日：2012-12-04
CPC分类号： H05K3/3436 , H01L23/488 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/131 , H01L2224/13562 , H01L2224/13564 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2924/01322 , H01L2924/15311 , H01L2924/301 , H01L2924/3511 , H01L2924/3841 , H05K3/3463 , H05K3/3494 , H05K2203/041 , Y02P70/613 , Y10T29/49144 , H01L2924/0665 , H01L2924/014 , H01L2224/136 , H01L2924/00
摘要： Embodiments of the present description relate to the field of fabricating microelectronic structures, wherein a microelectronic package may be attached to a microelectronic substrate with a hybrid solder interconnect. The hybrid solder interconnect may comprise a homogenous mixture of low temperature solder and a high temperature solder extending between at least one bond pad on a microelectronic package and at least one bond pad on a microelectronic substrate, wherein the relatively low reflow temperature used during the formation of the hybrid solder interconnect may prevent solder defects caused by warpage which may occur during the attachment of the microelectronic package to the microelectronic substrate.
摘要翻译： 本说明书的实施例涉及制造微电子结构的领域，其中微电子封装可以用混合焊料互连连接到微电子衬底。 混合焊料互连可以包括低温焊料和在微电子封装上的至少一个焊盘和微电子衬底上的至少一个焊盘之间延伸的高温焊料的均匀混合物，其中在形成期间使用的相对低的回流温度 的混合焊料互连可以防止在微电子封装附着到微电子衬底期间可能发生的翘曲引起的焊料缺陷。
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公开(公告)号：US08920934B2
公开(公告)日：2014-12-30
申请号：US13853982
申请日：2013-03-29
IPC分类号： B32B5/18 , H01L23/498 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/13101 , H01L2224/16225 , H01L2224/1703 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/01322 , H01L2924/15311 , H01L2924/16235 , H01L2924/16251 , H01L2924/3511 , H05K3/3436 , H05K3/3478 , H05K3/3484 , H05K3/3494 , H05K2201/066 , H05K2201/068 , H05K2201/1056 , H05K2203/041 , H05K2203/0435 , H05K2203/047 , Y10S428/929 , Y10T428/12181 , Y10T428/12479 , H01L2924/014 , H01L2924/00 , H01L2224/81805
摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.
摘要翻译： 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附接到微电子衬底以形成混合焊料 互连。
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公开(公告)号：US20140091457A1
公开(公告)日：2014-04-03
申请号：US13631939
申请日：2012-09-29
申请人： Hongjin JIANG , Arun Kumar C. NALLANI , Wei TAN
发明人： Hongjin JIANG , Arun Kumar C. NALLANI , Wei TAN
IPC分类号： H01L23/498 , H01L21/48 , H01L23/48
CPC分类号： H01L23/49811 , H01L21/4853 , H01L23/48 , H01L23/49816 , H01L2224/1403 , H01L2224/14051 , H01L2924/0002 , H01L2924/15311 , H01L2924/3511 , H01L2924/00
摘要： An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom. A first of the bonding pads in a first location on the substrate surface includes the solder extending a first distance outward therefrom. A second of the bonding pads in a second location on the substrate surface includes the solder extending a second distance outward therefrom. The first distance is different than the second distance. Other embodiments are described and claimed.
摘要翻译： 一种装置包括：基板，其包括表面和位于表面上的多个接合焊盘。 该装置还包括一种材料，其包括位于接合焊盘上的焊料，并从其向外延伸一段距离。 衬底表面上的第一位置中的第一接合焊盘包括从其向外延伸第一距离的焊料。 衬底表面上的第二位置中的第二焊盘包括从其向外延伸第二距离的焊料。 第一距离不同于第二距离。 描述和要求保护其他实施例。
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公开(公告)号：US20140291843A1
公开(公告)日：2014-10-02
申请号：US13853982
申请日：2013-03-29
IPC分类号： H01L23/498 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/49833 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/13101 , H01L2224/16225 , H01L2224/1703 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/01322 , H01L2924/15311 , H01L2924/16235 , H01L2924/16251 , H01L2924/3511 , H05K3/3436 , H05K3/3478 , H05K3/3484 , H05K3/3494 , H05K2201/066 , H05K2201/068 , H05K2201/1056 , H05K2203/041 , H05K2203/0435 , H05K2203/047 , Y10S428/929 , Y10T428/12181 , Y10T428/12479 , H01L2924/014 , H01L2924/00 , H01L2224/81805
摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.
摘要翻译： 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附着到微电子衬底以形成混合焊料 互连。
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