公开(公告)号：US09601406B2

公开(公告)日：2017-03-21

申请号：US13782893

申请日：2013-03-01

申请人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

发明人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

IPC分类号： H01L23/34 ,  H01L21/8238 ,  H01L23/373 ,  H01L23/00 ,  H01L23/433

CPC分类号： H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1133 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/3511 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

摘要： A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.

公开(公告)号：US20140246770A1

公开(公告)日：2014-09-04

申请号：US13782893

申请日：2013-03-01

申请人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

发明人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

IPC分类号： H01L23/373

CPC分类号： H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1133 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/3511 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

摘要： A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.

摘要翻译： 描述了铜纳米棒热界面材料（TIM）。 铜纳米棒TIM包括多个铜纳米棒，其具有与第一表面热耦合的第一端和朝向第二表面延伸的第二端。 在第二端形成多个铜纳米棒分支。 铜纳米棒分支冶金结合到第二表面。 第一表面可以是模具的背面。 第二表面可以是热扩散或第二模具。 TIM可以包括围绕铜纳米棒的基质材料。 在一个实施方案中，铜纳米棒以簇形成。

公开(公告)号：US20190214328A1

公开(公告)日：2019-07-11

申请号：US15866793

申请日：2018-01-10

申请人： Feras Eid ,  Shrenik Kothari ,  Chandra M. Jha ,  Johanna M. Swan ,  Michael J. Baker ,  Shawna M. Liff ,  Thomas L. Sounart ,  Betsegaw K. Gebrehiwot ,  Shankar Devasenathipathy ,  Taylor Gaines ,  Digvijay Ashokkumar Raorane

发明人： Feras Eid ,  Shrenik Kothari ,  Chandra M. Jha ,  Johanna M. Swan ,  Michael J. Baker ,  Shawna M. Liff ,  Thomas L. Sounart ,  Betsegaw K. Gebrehiwot ,  Shankar Devasenathipathy ,  Taylor Gaines ,  Digvijay Ashokkumar Raorane

IPC分类号： H01L23/433 ,  H01L25/00 ,  H01L21/56 ,  H01L23/29 ,  H01L25/18

CPC分类号： H01L23/4334 ,  H01L21/56 ,  H01L23/04 ,  H01L23/16 ,  H01L23/295 ,  H01L23/367 ,  H01L23/42 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06589

摘要： A semiconductor device that has a semiconductor die coupled to a substrate. A mold compound encapsulates the semiconductor die, and at least one thermal conductive material section extends from adjacent the semiconductor die through the mold compound. The at least one conductive material section thus conveys heat from the semiconductor die through the mold compound.

公开(公告)号：US20180026393A1

公开(公告)日：2018-01-25

申请号：US15215531

申请日：2016-07-20

申请人： Feras Eid ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar

发明人： Feras Eid ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar

IPC分类号： H01R13/62 ,  H01R13/631 ,  H01R13/627

CPC分类号： H01R13/6205 ,  H01R11/30 ,  H01R13/627 ,  H01R13/631

摘要： Discussed generally herein are methods and devices including or providing a magnetic, detachable, conductive connector to provide an electrical and mechanical connection between parts. A device can include a first substrate, at least one electric component on or at least partially in a first surface of the first substrate, an adhesive on the first surface of the first substrate to temporarily attached the device to skin of a user, a contact pad electrically coupled to an electric component of the at least one electric component, the contact pad on or at least partially in a second surface of the substrate, the first surface opposite the second surface, and a conductive magnetic connector electrically and mechanically connected to the contact pad through a first conductive adhesive.

公开(公告)号：US20180084643A1

公开(公告)日：2018-03-22

申请号：US15267872

申请日：2016-09-16

申请人： Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Adel A. Elsherbini ,  Sasha Oster ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

发明人： Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Adel A. Elsherbini ,  Sasha Oster ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC分类号： H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC分类号： H05K1/147 ,  A61B5/00 ,  A61B5/6833 ,  A61B2562/164 ,  A61B2562/166 ,  H05K1/0283 ,  H05K1/112 ,  H05K1/181 ,  H05K3/365 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/10318

摘要： A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.

公开(公告)号：US09429427B2

公开(公告)日：2016-08-30

申请号：US13720876

申请日：2012-12-19

申请人： Qing Ma ,  Feras Eid ,  Kevin Lin ,  Johanna M. Swan ,  Weng Hong Teh ,  Valluri R. Rao

发明人： Qing Ma ,  Feras Eid ,  Kevin Lin ,  Johanna M. Swan ,  Weng Hong Teh ,  Valluri R. Rao

IPC分类号： G01C19/00 ,  G01C19/56 ,  G01C19/5776

CPC分类号： G01C19/56 ,  G01C19/5776

摘要： This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.

摘要翻译： 本发明涉及采用磁驱动和/或感测架构的感应惯性传感器。 在实施例中，平移陀螺仪利用在第一维度中制成的导电线圈作为在存在磁场的情况下驱动通过线圈的时变电流的函数。 感应线圈记录在第二维度上作为角速度的函数变化的电感。 在实施例中，振动线圈使得感测线圈中的第一和第二互感器作为角速度的函数彼此偏离。 在实施例中，与一对曲折线圈相关联的自感量作为第二维度中的角速度的函数而变化。 在实施例中，使用封装积层来制造感应惯性传感器，使得能够在诸如移动设备的小尺寸计算平台中有利的封装级集成惯性感测。

公开(公告)号：US20190003854A1

公开(公告)日：2019-01-03

申请号：US15636599

申请日：2017-06-28

申请人： Sasha Oster ,  Feras Eid ,  Thomas L. Sounart ,  Georgios C. Dogiamis

发明人： Sasha Oster ,  Feras Eid ,  Thomas L. Sounart ,  Georgios C. Dogiamis

IPC分类号： G01C25/00 ,  G01C19/5656

CPC分类号： G01C25/005 ,  G01C19/5656 ,  G01P1/00 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/097 ,  G01P15/18 ,  G01P21/00 ,  G01P2015/084

摘要： An apparatus is provided which comprises: a substrate; a sensor including a sensing element, wherein the sensor is integrated within the substrate; and a calibration structure integrated within the substrate, wherein the calibration structure is to exhibit one or more physical or chemical properties same as the sensor but without the sensing element.

公开(公告)号：US20140083858A1

公开(公告)日：2014-03-27

申请号：US13624288

申请日：2012-09-21

申请人： Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

发明人： Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

IPC分类号： B01D43/00 ,  H05K3/30

CPC分类号： H05K1/0272 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/1815 ,  H01L2924/18162 ,  H05K1/0212 ,  H05K1/185 ,  H05K3/0097 ,  H05K2201/097 ,  H05K2203/1536 ,  H05K2203/308 ,  Y10T29/4913

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.

摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法可以包括将微流体管芯附接到封装结构，其中微流体管芯包括可以与设置在封装结构内的信号焊盘耦合的多个不对称电极。

公开(公告)号：US20170094749A1

公开(公告)日：2017-03-30

申请号：US14866625

申请日：2015-09-25

申请人： Adel Elsherbini ,  Sasha Oster ,  Nadine L. Dabby ,  Aleksandar Aleksov ,  Braxton Lathrop ,  Feras Eid

发明人： Adel Elsherbini ,  Sasha Oster ,  Nadine L. Dabby ,  Aleksandar Aleksov ,  Braxton Lathrop ,  Feras Eid

IPC分类号： H05B33/28 ,  A42B1/00 ,  A41D1/00 ,  F21V33/00 ,  H05B33/06 ,  A41B1/08 ,  H05B33/04

CPC分类号： H05B33/28 ,  A41B1/08 ,  A41D1/002 ,  A42B1/004 ,  A42B1/242 ,  F21V33/0008 ,  H05B33/04 ,  H05B33/06

摘要： Some forms relate to a stretchable computing display device. The stretchable computing display device includes a stretchable base; a patterned conductive section mounted on the stretchable base, wherein the patterned conductive section includes a first portion and a second portion that is electrically isolated from the first portion; an electroluminescent material mounted on the stretchable base such that the electroluminescent material is between the first portion and the second portion of the patterned conductive section; an encapsulant that covers at least a portion of the patterned conductive section; and a textile such that the stretchable base is mounted on the textile, wherein the textile is part of a garment.

公开(公告)号：US20170093007A1

公开(公告)日：2017-03-30

申请号：US14866693

申请日：2015-09-25

申请人： Adel A. ELSHERBINI ,  Mathew Manusharow ,  Krishna Bharath ,  Zhichao Zhang ,  Yidnekachew S. Mekonnen ,  Aleksandar Aleksov ,  Henning Braunisch ,  Feras Eid ,  Javier Soto

发明人： Adel A. ELSHERBINI ,  Mathew Manusharow ,  Krishna Bharath ,  Zhichao Zhang ,  Yidnekachew S. Mekonnen ,  Aleksandar Aleksov ,  Henning Braunisch ,  Feras Eid ,  Javier Soto

IPC分类号： H01P3/08

CPC分类号： H05K1/0245 ,  H01P3/02 ,  H01P3/026 ,  H01P3/08 ,  H01P3/085 ,  H01P3/088

摘要： Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.