公开(公告)号：US20100059870A1

公开(公告)日：2010-03-11

申请号：US12491096

申请日：2009-06-24

申请人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

发明人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3735 ,  H01L23/49531 ,  H01L23/49586 ,  H01L23/62 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.

摘要翻译： 提供了包括基板，至少一个芯片，多个引线，散热装置，模塑料和至少一个绝缘片的芯片封装结构。 芯片设置在基板上。 引线电连接到基板。 具有顶表面的模制化合物封装芯片，衬底和引线的一部分。 散热装置设置在模塑料的顶表面上。 布置在散热装置与至少一个引线之间的绝缘片具有将绝缘片划分为设置在模制化合物上的主体和从主体延伸的弯曲部的弯曲线。

公开(公告)号：US20080303125A1

公开(公告)日：2008-12-11

申请号：US11847351

申请日：2007-08-30

申请人： DA-JUNG CHEN ,  Chun-Tiao Liu ,  Chau-Chun Wen

发明人： DA-JUNG CHEN ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.

摘要翻译： 三维封装结构包括能量存储元件，半导体封装体和屏蔽层。 半导体封装主体具有多个第二导电元件和至少一个控制装置。 储能元件设置在半导体封装主体上。 包括磁性体的能量存储元件电连接到第二导电元件。 半导体封装体或能量存储元件具有多个第一导电元件以与外部器件电连接。 屏蔽层设置在控制部件和磁体的至少一部分之间以抑制或减少来自能量存储元件的EMI（电磁干扰）并获得微小的封装结构。 三维封装结构适用于POL（负载点）转换器。

公开(公告)号：US20080179722A1

公开(公告)日：2008-07-31

申请号：US11930183

申请日：2007-10-31

申请人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

IPC分类号： H01L23/495

CPC分类号： H05K1/141 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0262 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10924 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first electronic element is disposed on the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The encapsulant at least covers the first electronic element, the second electronic element, and a part of the first carrier. The space utilization rate of the first carrier of the electronic package structure is higher.

摘要翻译： 提供了包括第一载体，至少一个第一电子元件，至少一个第二电子元件和密封剂的电子封装结构。 第一载体具有与第一载体表面相对的第一载体表面和第二载体表面。 第一电子元件设置在第一承载表面上并电连接到第一载体。 第二电子元件设置在第二承载表面上并电连接到第一载体。 密封剂至少覆盖第一电子元件，第二电子元件和第一载体的一部分。 电子封装结构的第一载体的空间利用率更高。

公开(公告)号：US09601412B2

公开(公告)日：2017-03-21

申请号：US13612852

申请日：2012-09-13

申请人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC分类号： H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L25/162 ,  H01L23/04 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L23/552 ,  H01L23/645 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.

公开(公告)号：US08338928B2

公开(公告)日：2012-12-25

申请号：US11847351

申请日：2007-08-30

申请人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC分类号： H01L23/02

CPC分类号： H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.

公开(公告)号：US20120014079A1

公开(公告)日：2012-01-19

申请号：US13185573

申请日：2011-07-19

申请人： Da-Jung CHEN ,  Chau-Chun WEN ,  Chun-Tiao LIU

发明人： Da-Jung CHEN ,  Chau-Chun WEN ,  Chun-Tiao LIU

IPC分类号： H05K7/00 ,  H05K7/18

CPC分类号： H05K1/181 ,  H01F27/027 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

摘要翻译： 提供了包括至少一个第一电子元件，第二电子元件和引线框架的电子封装结构。 第二电子元件包括具有空腔的主体。 第一电子元件设置在空腔中。 引线框架具有多个引线。 每个引线具有第一端和第二端。 至少一个引线的第一端延伸到腔体以电连接第一电子元件。

公开(公告)号：US20090207574A1

公开(公告)日：2009-08-20

申请号：US12143143

申请日：2008-06-20

申请人： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

发明人： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC分类号： H05K1/18

CPC分类号： H05K1/18 ,  H01F27/027 ,  H01F27/29 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H05K3/30 ,  H05K3/3421 ,  H05K9/00 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49071 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

摘要翻译： 提供了包括至少一个第一电子元件，第二电子元件和引线框架的电子封装结构。 第二电子元件包括具有空腔的主体。 第一电子元件设置在空腔中。 引线框架具有多个引线。 每个引线具有第一端和第二端。 至少一个引线的第一端延伸到腔体以电连接第一电子元件。

公开(公告)号：US07411278B2

公开(公告)日：2008-08-12

申请号：US11336973

申请日：2006-01-23

申请人： Chau Chun Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

发明人： Chau Chun Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

IPC分类号： H01L23/552

CPC分类号： H01L23/3107 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.

摘要翻译： 本发明提供了一种用于减小电磁/射频干扰的封装装置，其包括在第一基板的下表面上具有屏蔽结构的第一基板和屏蔽结构上的绝缘层。 第一基板包括在其中填充有导体的通孔。 位于第一基板的底表面上的多个引线框架。 位于两个引线框之间的第二基板。 然后，封装以覆盖上述结构的模塑料形成包装装置。 因此，封装器件的屏蔽路径由多个引线框架，第一基板内的导体，屏蔽结构构成，并且接地以将电磁/射频放出封装器件，因此，电磁 可以减少封装器件的射频干扰。

公开(公告)号：US06388897B1

公开(公告)日：2002-05-14

申请号：US09865220

申请日：2001-05-25

申请人： Jianping Ying ,  Chau-Chun Wen ,  Hai Geng ,  Jianhong Zeng

发明人： Jianping Ying ,  Chau-Chun Wen ,  Hai Geng ,  Jianhong Zeng

IPC分类号： H02M3335

CPC分类号： H02M3/33576

摘要： A DC-to-DC converter and a method thereof is provided. The DC-to-DC converter includes a power supply for providing a first direct current, a first capacitor, a first switch assembly for converting the first direct current into a first alternating current, a transformer for converting the first alternating current to a second alternating current, a rectifying circuit for converting and rectifying the second alternating current to a second direct current, a filtering circuit, and a range winding assembly for adjusting the output voltage of the second direct current in response to the voltage drop of the first direct current.

摘要翻译： 提供DC-DC转换器及其方法。 DC-DC转换器包括用于提供第一直流电的电源，第一电容器，用于将第一直流转换成第一交流电的第一开关组件，用于将第一交流电转换为第二交流电的变压器 电流，用于将第二交流电转换和整流为第二直流电流的整流电路，滤波电路和范围绕组组件，用于响应于第一直流电压的下降来调节第二直流的输出电压。

公开(公告)号：US08824165B2

公开(公告)日：2014-09-02

申请号：US13185573

申请日：2011-07-19

申请人： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

发明人： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC分类号： H05K5/02

CPC分类号： H05K1/181 ,  H01F27/027 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

摘要翻译： 提供了包括至少一个第一电子元件，第二电子元件和引线框架的电子封装结构。 第二电子元件包括具有空腔的主体。 第一电子元件设置在空腔中。 引线框架具有多个引线。 每个引线具有第一端和第二端。 至少一个引线的第一端延伸到腔体以电连接第一电子元件。