CARBON NANOTUBE SEMICONDUCTOR DEVICES AND DETERMINISTIC NANOFABRICATION METHODS
    1.
    发明申请
    CARBON NANOTUBE SEMICONDUCTOR DEVICES AND DETERMINISTIC NANOFABRICATION METHODS 有权
    碳纳米管半导体器件和测定纳米方法

    公开(公告)号:US20140034906A1

    公开(公告)日:2014-02-06

    申请号:US13977219

    申请日:2011-12-27

    IPC分类号: H01L51/00 H01L51/05

    摘要: Embodiments of the invention provide transistor structures and interconnect structures that employ carbon nanotubes (CNTs). Further embodiments of the invention provide methods of fabricating transistor structures and interconnect structures that employ carbon nanotubes. Deterministic nanofabrication techniques according to embodiments of the invention can provide efficient routes for the large-scale manufacture of transistor and interconnect structures for use, for example, in random logic and memory circuit applications.

    摘要翻译: 本发明的实施例提供采用碳纳米管(CNT)的晶体管结构和互连结构。 本发明的其他实施例提供制造使用碳纳米管的晶体管结构和互连结构的方法。 根据本发明的实施例的确定性纳米制造技术可以提供用于大规模制造用于例如随机逻辑和存储器电路应用的晶体管和互连结构的有效途径。

    DIELECTRIC LAYERS HAVING ORDERED ELONGATE PORES
    4.
    发明申请
    DIELECTRIC LAYERS HAVING ORDERED ELONGATE PORES 审中-公开
    具有订购的ELONGATE PORES的电介质层

    公开(公告)号:US20150170926A1

    公开(公告)日:2015-06-18

    申请号:US14108255

    申请日:2013-12-16

    摘要: Embodiments of the present disclosure describe dielectric layers and methods for their fabrication and use. In some embodiments, a dielectric layer may include a dielectric material and a plurality of elongate pores. The dielectric material may have a first surface and an opposing second surface spaced away from the first surface in a direction defined by an axis, and may have a Young's modulus (E0) in the direction defined by the axis. Individual elongate pores of the plurality of elongate pores may extend from the second surface with a longitudinal axis substantially parallel to the axis. The plurality of elongate pores may provide the dielectric layer with a porosity, p, greater than approximately 30%, and the dielectric layer may have a Young's modulus approximately equal to E0*(1−p) in the direction defined by the axis. Other embodiments may be described and/or claimed.

    摘要翻译: 本公开的实施例描述了用于其制造和使用的电介质层及其方法。 在一些实施例中,电介质层可以包括电介质材料和多个细长孔。 电介质材料可以具有在由轴线限定的方向上与第一表面隔开的第一表面和相对的第二表面,并且可以在由轴限定的方向上具有杨氏模量(E0)。 多个细长孔中的单个细长孔可以从第二表面延伸,其纵轴基本上平行于该轴。 多个细长的孔可以提供介电层具有大于约30%的孔隙率p,并且电介质层可以具有在由轴限定的方向上大约等于E0 *(1-p)的杨氏模量。 可以描述和/或要求保护其他实施例。

    CHEMICALLY ALTERED CARBOSILANES FOR PORE SEALING APPLICATIONS
    8.
    发明申请
    CHEMICALLY ALTERED CARBOSILANES FOR PORE SEALING APPLICATIONS 有权
    用于密封应用的化学改性碳化硅

    公开(公告)号:US20130320520A1

    公开(公告)日:2013-12-05

    申请号:US13995905

    申请日:2011-12-22

    IPC分类号: H01L23/485 H01L21/768

    摘要: A method including forming a dielectric material including a surface porosity on a circuit substrate including a plurality of devices; chemically modifying a portion of the surface of the dielectric material with a first reactant; reacting the chemically modified portion of the surface with a molecule that, once reacted, will be thermally stable; and forming a film including the molecule. An apparatus including a circuit substrate including a plurality of devices; a plurality of interconnect lines disposed in a plurality of layers coupled to the plurality of devices; and a plurality of dielectric layers disposed between the plurality of interconnect lines, wherein at least one of the dielectric layers comprises a porous material surface relative to the plurality of devices and the surface comprises a pore obstructing material.

    摘要翻译: 一种包括在包括多个器件的电路基板上形成包括表面孔隙率的介电材料的方法; 用第一反应物化学改性电介质材料表面的一部分; 使表面的化学改性部分与一旦反应后将是热稳定的分子反应; 并形成包含该分子的膜。 一种装置,包括:包括多个装置的电路基板; 布置在耦合到所述多个装置的多个层中的多个互连线; 以及设置在所述多个互连线之间的多个电介质层,其中所述电介质层中的至少一个相对于所述多个器件包括多孔材料表面,并且所述表面包括孔阻塞材料。

    Communication system
    9.
    发明授权
    Communication system 失效
    通讯系统

    公开(公告)号:US4947420A

    公开(公告)日:1990-08-07

    申请号:US345056

    申请日:1989-04-28

    IPC分类号: H04W68/00 H04W88/18

    CPC分类号: H04W88/185 H04W68/00

    摘要: A selective call communication system for use by an untrained person is provided. The communication system includes a number of telephones located in different locations, connected to a central switching unit. A number of selective call radios, each having an address, are assigned to the central switching unit. Upon the use of the telephone, the central unit identifies the telephone in use, and initiates an alerting call to the corresponding selective call radio automatically. The selective call radios may be pagers or two-way radios. Other features such as radio to radio communication, and radio to telephone network communication may be incorporated into the system.

    摘要翻译: 提供了由未经训练的人使用的选择性呼叫通信系统。 通信系统包括位于不同位置的多个电话,连接到中央交换单元。 每个具有地址的多个选呼接收机被分配给中央交换单元。 在使用电话时,中央单元识别正在使用的电话,并且自动发起对相应的选呼接收机的告警呼叫。 选择性呼叫无线电可以是寻呼机或双向无线电。 诸如无线电到无线电通信和无线电到电话网络通信的其他特征可以被并入到系统中。

    Chemically altered carbosilanes for pore sealing applications
    10.
    发明授权
    Chemically altered carbosilanes for pore sealing applications 有权
    用于孔封的化学改性碳硅烷应用

    公开(公告)号:US09269652B2

    公开(公告)日:2016-02-23

    申请号:US13995905

    申请日:2011-12-22

    摘要: A method including forming a dielectric material including a surface porosity on a circuit substrate including a plurality of devices; chemically modifying a portion of the surface of the dielectric material with a first reactant; reacting the chemically modified portion of the surface with a molecule that, once reacted, will be thermally stable; and forming a film including the molecule. An apparatus including a circuit substrate including a plurality of devices; a plurality of interconnect lines disposed in a plurality of layers coupled to the plurality of devices; and a plurality of dielectric layers disposed between the plurality of interconnect lines, wherein at least one of the dielectric layers comprises a porous material surface relative to the plurality of devices and the surface comprises a pore obstructing material.

    摘要翻译: 一种包括在包括多个器件的电路基板上形成包括表面孔隙率的介电材料的方法; 用第一反应物化学改性电介质材料表面的一部分; 使表面的化学改性部分与一旦反应后将是热稳定的分子反应; 并形成包含该分子的膜。 一种装置,包括:包括多个装置的电路基板; 布置在耦合到所述多个装置的多个层中的多个互连线; 以及设置在所述多个互连线之间的多个电介质层,其中所述电介质层中的至少一个相对于所述多个器件包括多孔材料表面,并且所述表面包括孔阻塞材料。