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    Flexible circuit having overvoltage protection
    1.
    发明授权
    Flexible circuit having overvoltage protection 有权
    柔性电路具有过压保护功能

    公开(公告)号：US07609141B2

    公开(公告)日：2009-10-27

    申请号：US11679061

    申请日：2007-02-26

    申请人： Edwin James Harris ,  Timothy Pachla ,  Tushar Vyas

    发明人： Edwin James Harris ,  Timothy Pachla ,  Tushar Vyas

    IPC分类号： H01C7/10

    CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

    摘要： A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.

    摘要翻译： 第一电压可变材料（“VVM”）包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒和没有保持在绝缘粘合剂中的壳的第二导电颗粒; 第二VVM包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒，没有保持在绝缘粘合剂中的壳的第二导电颗粒和保持在绝缘粘合剂中的芯和壳的半导体颗粒; 第三VVM仅包括具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒。

    Direct application voltage variable material
    2.
    发明授权
    Direct application voltage variable material 有权
    直接施加电压可变材料

    公开(公告)号：US07843308B2

    公开(公告)日：2010-11-30

    申请号：US11679064

    申请日：2007-02-26

    申请人： Timothy Pachla ,  Edwin James Harris ,  Tushar Vyas

    发明人： Timothy Pachla ,  Edwin James Harris ,  Tushar Vyas

    IPC分类号： H01C7/10

    CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

    摘要： A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.

    摘要翻译： 第一电压可变材料（“VVM”）包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒和没有保持在绝缘粘合剂中的壳的第二导电颗粒; 第二VVM包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒，没有保持在绝缘粘合剂中的壳的第二导电颗粒和保持在绝缘粘合剂中的芯和壳的半导体颗粒; 第三VVM仅包括具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒。

    Direct application voltage variable material, devices employing same and methods of manufacturing such devices
    3.
    发明授权
    Direct application voltage variable material, devices employing same and methods of manufacturing such devices 有权
    直接施加电压可变材料，采用其的装置以及制造这种装置的方法

    公开(公告)号：US07183891B2

    公开(公告)日：2007-02-27

    申请号：US10958442

    申请日：2004-10-05

    申请人： Edwin James Harris ,  Tushar Vyas ,  Timothy Pachla ,  James A. Colby

    发明人： Edwin James Harris ,  Tushar Vyas ,  Timothy Pachla ,  James A. Colby

    IPC分类号： H01C7/10

    CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

    摘要： A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.

    摘要翻译： 提供了包括被配制为固有地粘附到导电和非导电表面的绝缘粘合剂的电压可变材料（“VVM”）。 粘合剂，因此VVM是可自我修复的，并且可以在使用前干燥的可涂抹形式使用。 粘合剂消除了将VVM放置在单独的装置中的需要，或者提供用于电连接VVM的单独的印刷电路板焊盘。 粘合剂和因此的VVM可以通过诸如筛网或模版印刷的工艺直接应用于许多不同类型的基材，例如刚性FR-4层压板，聚酰亚胺，聚合物或多层PCB。 在一个实施例中，VVM包括两种类型的导电颗粒，一种具有芯和一个不具有芯。 VVM还可以具有核 - 壳型半导体颗粒。

    FLEXIBLE CIRCUIT HAVING OVERVOLTAGE PROTECTION
    4.
    发明申请
    FLEXIBLE CIRCUIT HAVING OVERVOLTAGE PROTECTION 有权
    具有过电压保护功能的柔性电路

    公开(公告)号：US20070146941A1

    公开(公告)日：2007-06-28

    申请号：US11679061

    申请日：2007-02-26

    申请人： EDWIN HARRIS ,  Tushar Vyas ,  Timothy Pachla

    发明人： EDWIN HARRIS ,  Tushar Vyas ,  Timothy Pachla

    IPC分类号： H02H9/00

    CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

    摘要： A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.

    摘要翻译： 第一电压可变材料（“VVM”）包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒和没有保持在绝缘粘合剂中的壳的第二导电颗粒; 第二VVM包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒，没有保持在绝缘粘合剂中的壳的第二导电颗粒和保持在绝缘粘合剂中的芯和壳的半导体颗粒; 第三VVM仅包括具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒。

    DIRECT APPLICATION VOLTAGE VARIABLE MATERIAL
    6.
    发明申请
    DIRECT APPLICATION VOLTAGE VARIABLE MATERIAL 有权
    直接应用电压可变材料

    公开(公告)号：US20070139848A1

    公开(公告)日：2007-06-21

    申请号：US11679064

    申请日：2007-02-26

    申请人： Edwin Harris ,  Tushar Vyas ,  Timothy Pachla

    发明人： Edwin Harris ,  Tushar Vyas ,  Timothy Pachla

    IPC分类号： H02H9/06

    CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

    摘要： A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.

    摘要翻译： 第一电压可变材料（“VVM”）包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒和没有保持在绝缘粘合剂中的壳的第二导电颗粒; 第二VVM包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒，没有保持在绝缘粘合剂中的壳的第二导电颗粒和保持在绝缘粘合剂中的芯和壳的半导体颗粒; 第三VVM仅包括具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒。

    Direct application voltage variable material, devices employing same and methods of manufacturing such devices
    7.
    发明申请
    Direct application voltage variable material, devices employing same and methods of manufacturing such devices 有权
    直接施加电压可变材料，采用其的装置以及制造这种装置的方法

    公开(公告)号：US20050057867A1

    公开(公告)日：2005-03-17

    申请号：US10958442

    申请日：2004-10-05

    申请人： Edwin Harris ,  Tushar Vyas ,  Timothy Pachla ,  James Colby

    发明人： Edwin Harris ,  Tushar Vyas ,  Timothy Pachla ,  James Colby

    IPC分类号： H02H9/04 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H02H9/00

    CPC分类号： H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

    摘要： A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.

    摘要翻译： 提供了包括被配制为固有地粘附到导电和非导电表面的绝缘粘合剂的电压可变材料（“VVM”）。 粘合剂和因此VVM是自固化型和适用在使用前，其干燥可涂抹的形式。 粘合剂消除了将VVM放置在单独的装置中的需要，或者提供用于电连接VVM的单独的印刷电路板焊盘。 粘合剂和因此的VVM可以通过诸如筛网或模版印刷的工艺直接应用于许多不同类型的基材，例如刚性FR-4层压板，聚酰亚胺，聚合物或多层PCB。 在一个实施例中，VVM包括两种类型的导电颗粒，其中一个芯和一个没有芯。 VVM还可以具有核 - 壳型半导体颗粒。

    Direct application voltage variable material, components thereof and devices employing same
    8.
    发明授权
    Direct application voltage variable material, components thereof and devices employing same 有权
    直接施加电压可变材料，其组件和使用其的装置

    公开(公告)号：US07132922B2

    公开(公告)日：2006-11-07

    申请号：US10746020

    申请日：2003-12-23

    申请人： Edwin James Harris ,  Tushar Vyas ,  Stephen J. Whitney

    发明人： Edwin James Harris ,  Tushar Vyas ,  Stephen J. Whitney

    IPC分类号： H01C7/10

    CPC分类号： H01L23/62 ,  H01C17/06513 ,  H01C17/06553 ,  H01C17/0656 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0224 ,  H05K2201/0272 ,  H05K2201/0738 ,  H01L2924/00

    摘要： A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.

    摘要翻译： 提供了包括被配制为固有地粘附到导电和非导电表面的绝缘粘合剂的电压可变材料（“VVM”）。 粘合剂，因此VVM是可自我修复的，并且可以在使用前干燥的可涂抹形式使用。 粘合剂消除了将VVM放置在单独的装置中的需要，或者提供用于电连接VVM的单独的印刷电路板焊盘。 粘合剂，因此VVM可以直接应用于许多不同类型的基材，例如刚性（FR-4）层压材料，聚酰亚胺或聚合物。 VVM也可以直接应用于放置在设备内部的不同类型的基板。 在一个实施例中，VVM包括具有芯的掺杂的半导体颗粒，其可以是硅，以及可以是氧化物的惰性涂层。 颗粒在粘合剂中与导电颗粒混合。