公开(公告)号：US20090052178A1

公开(公告)日：2009-02-26

申请号：US12288376

申请日：2008-10-20

申请人： Werner Marchl ,  Werner Spath ,  Gunter Waitl

发明人： Werner Marchl ,  Werner Spath ,  Gunter Waitl

IPC分类号： F21V29/00

CPC分类号： H01L25/0753 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00012

摘要： A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

摘要翻译： 包括多个LED模块的多个LED模块的配置，每个LED模块各自包含具有第一主区域，第二主区域和至少一个半导体层的载体，其中第一主区域具有平面配置。 LED模块还包括施加在载体的第一主区域上的多个LED半导体体。 此外，多个LED模块包括公共散热器，其中每种情况下LED模块的载体连接到第二主区域上的公共散热器。

公开(公告)号：US20070290383A1

公开(公告)日：2007-12-20

申请号：US11894569

申请日：2007-08-20

申请人： Georg Bogner ,  Wolfgang Gramann ,  Patrick Kromotis ,  Werner Marchl ,  Werner Spath ,  Gunter Waitl

发明人： Georg Bogner ,  Wolfgang Gramann ,  Patrick Kromotis ,  Werner Marchl ,  Werner Spath ,  Gunter Waitl

IPC分类号： B29D11/00

CPC分类号： G02B3/0031 ,  B29D11/00278 ,  B29D11/00365 ,  F21V5/04 ,  F21Y2115/10 ,  G02B3/0056 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for producing a lens mold suitable for manufacturing a field of micro-lenses is disclosed. The method includes the step of molding the lens mold from a sheaf of closely-packed balls held by a hexagonal mounting.

摘要翻译： 公开了一种用于制造适于制造微透镜领域的透镜模具的方法。 该方法包括从由六边形安装件保持的紧密包装的球的一组模制模制透镜模具的步骤。

公开(公告)号：US08511855B2

公开(公告)日：2013-08-20

申请号：US13364551

申请日：2012-02-02

申请人： Werner Marchl ,  Werner Spath ,  Gunter Waitl

发明人： Werner Marchl ,  Werner Spath ,  Gunter Waitl

IPC分类号： F21V21/00

CPC分类号： H01L25/0753 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00012

摘要： A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

摘要翻译： 具有多个LED模块的多个LED模块的配置，每个LED模块各自包含具有第一主区域，第二主区域和至少一个半导体层的载体。 第一个主要区域具有平面配置。 LED模块还包括施加在载体的第一主区域上的多个LED半导体体。 此外，多个LED模块包括公共散热器，其中每种情况下LED模块的载体连接到第二主区域上的公共散热器。

公开(公告)号：US08113688B2

公开(公告)日：2012-02-14

申请号：US12984351

申请日：2011-01-04

申请人： Werner Marchl ,  Werner Spath ,  Gunter Waitl

发明人： Werner Marchl ,  Werner Spath ,  Gunter Waitl

IPC分类号： F21V21/00

CPC分类号： H01L25/0753 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00012

摘要： A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

摘要翻译： 具有多个LED模块的多个LED模块的配置，每个LED模块各自包含具有第一主区域，第二主区域和至少一个半导体层的载体。 第一个主要区域具有平面配置。 LED模块还包括施加在载体的第一主区域上的多个LED半导体体。 此外，多个LED模块包括公共散热器，其中每种情况下LED模块的载体连接到第二主区域上的公共散热器。

公开(公告)号：US07696590B2

公开(公告)日：2010-04-13

申请号：US12055863

申请日：2008-03-26

申请人： Gunter Waitl ,  Herbert Brunner

发明人： Gunter Waitl ,  Herbert Brunner

IPC分类号： H01L31/02 ,  H01L21/50

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

摘要翻译： 设置容纳半导体芯片的壳体。 外壳和芯片可用于发送和/或接收辐射。 外壳的热门应用可能在发光二极管中。 壳体包括被冲压成两个电隔离部分的导体条。 壳体还包括从壳体的顶部向内延伸的腔体。 导体部分包括暴露在空腔底部的相应区域。 半导体芯片被接合到一个暴露区域，并且引线将芯片连接到第二暴露区域。 导体部分也终止在暴露的电极中，这允许芯片与外部装置的电连接。 在空腔中形成窗口，并且形成空腔的壳体的壁可以由反射材料制成。 电极保持未暴露于窗口，但是对于芯片周围的任何残留区域以及在第一和第二暴露区域内的接合线。 通过使暴露于窗户的导体的面积最小化，窗口和导体的不同热膨胀引起的分层被最小化和/或消除。 类似地，通过覆盖容纳窗口的空腔的基部的反射壳体，内部辐射反射增加超过用暴露的导体实现的内部辐射反射。

公开(公告)号：US20080315227A1

公开(公告)日：2008-12-25

申请号：US11631058

申请日：2005-05-18

申请人： Georg Bogner ,  Stefan Grotsch ,  Gunter Waitl ,  Mario Wanninger

发明人： Georg Bogner ,  Stefan Grotsch ,  Gunter Waitl ,  Mario Wanninger

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/58 ,  H01L33/60 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.

摘要翻译： 公开了一种发光二极管装置，其包括具有辐射去耦表面的至少一个发光二极管（LED）芯片，通过该发光二极管芯片，在LED芯片中产生的大部分电磁辐射沿主要发射方向排出; 横向围绕LED芯片的壳体; 以及设置在主发射方向上的辐射去耦表面之后的反射光学器件。 LED布置特别适用于诸如配备相机的手机，数码相机或摄像机等设备。

公开(公告)号：US20060011928A1

公开(公告)日：2006-01-19

申请号：US10519347

申请日：2003-06-04

申请人： Jorg Sorg ,  Georg Bogner ,  Gunter Waitl ,  Reinhold Brunner

发明人： Jorg Sorg ,  Georg Bogner ,  Gunter Waitl ,  Reinhold Brunner

IPC分类号： H01L31/0203 ,  H01L33/00 ,  H01L31/0232

CPC分类号： H01L33/62 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/12041 ,  H05K1/0203 ,  H05K3/3442 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface-mountable miniature luminescent diode with a chip package which has a leadframe (16) and a semiconductor chip (22) which is arranged on the leadframe (16) and is in electrical contact with it and which contains an active, radiation-emitting region. The leadframe (16) is formed by a flexible multi-layered sheet (12, 14).

摘要翻译： 一种具有芯片封装的表面贴装微型发光二极管，其具有引线框架（16）和半导体芯片（22），所述引线框架和半导体芯片（22）布置在所述引线框架（16）上并且与所述引线框架（16）电接触并且包含有源辐射 地区。 引线框架（16）由柔性多层板（12,14）形成。

公开(公告)号：US20050245018A1

公开(公告)日：2005-11-03

申请号：US10494160

申请日：2002-10-28

申请人： Georg Bogner ,  Herbert Brunner ,  Gertrud Krauter ,  Gunter Waitl

发明人： Georg Bogner ,  Herbert Brunner ,  Gertrud Krauter ,  Gunter Waitl

IPC分类号： H01L33/48 ,  H01L33/60 ,  H01L21/8238

CPC分类号： H01L33/486 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

摘要翻译： 具有壳体（2）的光电子部件，布置在壳体的凹部（6）中的光电子半导体芯片（3），并且具有电端子（1A，1B），所述半导体芯片导电地连接到 引线框的电气端子。 壳体（2）由封装材料形成，其中填充物在从UV范围的波长范围内具有高反射度。

公开(公告)号：US20050212098A1

公开(公告)日：2005-09-29

申请号：US11052712

申请日：2005-01-31

申请人： Georg Bogner ,  Jorg Sorg ,  Gunter Waitl

发明人： Georg Bogner ,  Jorg Sorg ,  Gunter Waitl

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/498 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip (1), and an encapsulation material (50). The two external electrical connections are arranged at a film (2) having a thickness of less than or equal to 100 μm. The semiconductor chip (1) is fixed at a first main surface (22) of the film (2) and the encapsulation material (50) is applied on the first surface (22).

摘要翻译： 具有半导体芯片（1）的表面安装半导体部件，至少两个外部电连接（31/314/41,32/324/42），其导电地连接到半导体芯片（1）的至少两个电触头 ）和封装材料（50）。 两个外部电连接被布置在厚度小于或等于100μm的膜（2）上。 半导体芯片（1）固定在膜（2）的第一主表面（22）上，并且封装材料（50）被施加在第一表面（22）上。

公开(公告)号：US20050116238A1

公开(公告)日：2005-06-02

申请号：US11002959

申请日：2004-12-02

申请人： Karlheinz Arndt ,  Herbert Brunner ,  Franz Schellhorn ,  Gunter Waitl

发明人： Karlheinz Arndt ,  Herbert Brunner ,  Franz Schellhorn ,  Gunter Waitl

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/48 ,  H01L33/60 ,  H01L33/64 ,  H01L27/15

CPC分类号： H01L33/486 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

摘要翻译： 辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。 芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。