公开(公告)号：US08625323B2

公开(公告)日：2014-01-07

申请号：US13453333

申请日：2012-04-23

申请人： Gwang-Man Lim

发明人： Gwang-Man Lim

IPC分类号： G11C13/04 ,  G01J1/32

CPC分类号： G06F13/4243 ,  Y02D10/14 ,  Y02D10/151

摘要： A memory module having a high data processing rate and high capacity is provided. The memory module may include a memory chip, a controller controlling an operation of the memory chip, an optical detector converting an external input signal into an internal input signal to transmit the converted signal to the controller, and an optical generator converting an internal output signal received from the controller into an external output signal. The optical detector converts an external input optical signal into an internal input signal to transmit the converted signal to the controller. The optical generator converts an internal output signal received from the controller into an external output optical signal.

摘要翻译： 提供具有高数据处理速率和高容量的存储器模块。 存储器模块可以包括存储器芯片，控制存储器芯片的操作的控制器，将外部输入信号转换为内部输入信号以将转换的信号传输到控制器的光学检测器，以及转换内部输出信号的光学发生器 从控制器接收到外部输出信号。 光学检测器将外部输入光信号转换为内部输入信号，以将转换的信号传送到控制器。 光发生器将从控制器接收的内部输出信号转换为外部输出光信号。

公开(公告)号：US20120206955A1

公开(公告)日：2012-08-16

申请号：US13453333

申请日：2012-04-23

申请人： Gwang-Man LIM

发明人： Gwang-Man LIM

IPC分类号： G11C13/04

CPC分类号： G06F13/4243 ,  Y02D10/14 ,  Y02D10/151

摘要： A memory module having a high data processing rate and high capacity is provided. The memory module may include a memory chip, a controller controlling an operation of the memory chip, an optical detector converting an external input signal into an internal input signal to transmit the converted signal to the controller, and an optical generator converting an internal output signal received from the controller into an external output signal. The optical detector converts an external input optical signal into an internal input signal to transmit the converted signal to the controller. The optical generator converts an internal output signal received from the controller into an external output optical signal.

摘要翻译： 提供具有高数据处理速率和高容量的存储器模块。 存储器模块可以包括存储器芯片，控制存储器芯片的操作的控制器，将外部输入信号转换为内部输入信号以将转换的信号传输到控制器的光学检测器，以及转换内部输出信号的光学发生器 从控制器接收到外部输出信号。 光学检测器将外部输入光信号转换为内部输入信号，以将转换的信号传送到控制器。 光发生器将从控制器接收的内部输出信号转换为外部输出光信号。

公开(公告)号：US07916512B2

公开(公告)日：2011-03-29

申请号：US11871913

申请日：2007-10-12

申请人： Gwang-Man Lim

发明人： Gwang-Man Lim

IPC分类号： G11C13/04 ,  G01J1/32

CPC分类号： G06F13/4243 ,  Y02D10/14 ,  Y02D10/151

摘要： A memory module having a high data processing rate and high capacity is provided. The memory module may include a memory chip, a controller controlling an operation of the memory chip, an optical detector converting an external input signal into an internal input signal to transmit the converted signal to the controller, and an optical generator converting an internal output signal received from the controller into an external output signal. The optical detector converts an external input optical signal into an internal input signal to transmit the converted signal to the controller. The optical generator converts an internal output signal received from the controller into an external output optical signal.

摘要翻译： 提供具有高数据处理速率和高容量的存储器模块。 存储器模块可以包括存储器芯片，控制存储器芯片的操作的控制器，将外部输入信号转换为内部输入信号以将转换的信号传输到控制器的光学检测器，以及转换内部输出信号的光学发生器 从控制器接收到外部输出信号。 光学检测器将外部输入光信号转换为内部输入信号，以将转换的信号传送到控制器。 光发生器将从控制器接收的内部输出信号转换为外部输出光信号。

公开(公告)号：US20080201519A1

公开(公告)日：2008-08-21

申请号：US11938432

申请日：2007-11-12

申请人： Jin-Young JUNG ,  Gwang-Man LIM

发明人： Jin-Young JUNG ,  Gwang-Man LIM

IPC分类号： G06F12/02 ,  G06F12/00

CPC分类号： G06F12/0284 ,  G06F12/0246

摘要： A memory card is structured to support a variety of applications by dividing a storage region into a plurality of sub storage regions, each sub storage region being assigned a particular data format associated with each of a plurality of application programs stored in a controller of the memory card. The data stored in each of the sub storage regions co-exists compatibly in the memory card. This allows for a multiplicity of applications, which can be made available through the use of a single memory card.

摘要翻译： 存储卡被构造为通过将存储区域划分为多个子存储区域来支持各种应用，每个子存储区域被分配与存储在存储器的控制器中的多个应用程序中的每一个相关联的特定数据格式 卡。 存储在每个子存储区域中的数据在存储卡中兼容地共存。 这允许可以通过使用单个存储卡来提供多种应用。

公开(公告)号：US20080189475A1

公开(公告)日：2008-08-07

申请号：US11871913

申请日：2007-10-12

申请人： Gwang-Man LIM

发明人： Gwang-Man LIM

IPC分类号： G06F12/00

CPC分类号： G06F13/4243 ,  Y02D10/14 ,  Y02D10/151

摘要： A memory module having a high data processing rate and high capacity is provided. The memory module may include a memory chip, a controller controlling an operation of the memory chip, an optical detector converting an external input signal into an internal input signal to transmit the converted signal to the controller, and an optical generator converting an internal output signal received from the controller into an external output signal. The optical detector converts an external input optical signal into an internal input signal to transmit the converted signal to the controller. The optical generator converts an internal output signal received from the controller into an external output optical signal.

摘要翻译： 提供具有高数据处理速率和高容量的存储器模块。 存储器模块可以包括存储器芯片，控制存储器芯片的操作的控制器，将外部输入信号转换为内部输入信号以将转换的信号传输到控制器的光学检测器，以及转换内部输出信号的光学发生器 从控制器接收到外部输出信号。 光学检测器将外部输入光信号转换为内部输入信号，以将转换的信号传送到控制器。 光发生器将从控制器接收的内部输出信号转换为外部输出光信号。

公开(公告)号：US20080145971A1

公开(公告)日：2008-06-19

申请号：US12071232

申请日：2008-02-19

申请人： Gwang-Man Lim

发明人： Gwang-Man Lim

IPC分类号： H01L21/60

CPC分类号： H01L24/91 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/05 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05548 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A package may include a lower unit package and an upper unit package. Each of the unit packages may include a circuit substrate having a lower surface and an upper surface. Wire bonding pads may be provided of the lower surface of the circuit substrate, and chip bonding pads may be provided on the upper surface of the circuit substrate. An IC chip may be provided on the lower surface of the circuit substrate. The IC chip may have an active surface with wire lands and bump lands. Chip bumps may be provided on the bump land. The wire bonding pads of the circuit substrate may be connected to the wire lands of the IC chip using bonding wires. The chip bumps of the upper unit package may be connected to the chip bonding pads of the lower unit package. An IC chip may include a substrate. A conductive layer may be provided on the substrate. The conductive layer may define a bump land for supporting a chip bump and a wire land for connecting to a bonding wire. The bump land and the wire land may be spaced apart from each other on an active surface of the IC chip.

公开(公告)号：US20070187806A1

公开(公告)日：2007-08-16

申请号：US11505323

申请日：2006-08-17

申请人： Min-Woo Kim ,  Sung-Wook Hwang ,  Gwang-Man Lim

发明人： Min-Woo Kim ,  Sung-Wook Hwang ,  Gwang-Man Lim

IPC分类号： H01L23/495

CPC分类号： H05K1/147 ,  H01L2224/16225 ,  H05K1/141 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/10689 ,  H05K2201/10734

摘要： A semiconductor chip package mounting structure may mount a semiconductor chip package on a module board by implementing a flexible circuit board. The semiconductor chip package may be electrically connected to a first surface of the flexible circuit board and the module board may be electrically connected to a second surface of the flexible circuit board.

摘要翻译： 半导体芯片封装安装结构可以通过实现柔性电路板将半导体芯片封装安装在模块板上。 半导体芯片封装可以电连接到柔性电路板的第一表面，并且模块板可以电连接到柔性电路板的第二表面。

公开(公告)号：US20120217656A1

公开(公告)日：2012-08-30

申请号：US13465387

申请日：2012-05-07

申请人： Chul Park ,  Hysong-seob Kim ,  Kun-dae Yeom ,  Gwang-man Lim

发明人： Chul Park ,  Hysong-seob Kim ,  Kun-dae Yeom ,  Gwang-man Lim

IPC分类号： H01L23/52

CPC分类号： H01L23/49541 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/535 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01075 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48175 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.

摘要翻译： 提供了包括多个半导体芯片的半导体封装以及连接到半导体芯片的分离的引线组。 引线暴露于半导体封装的外部。 多个引线可以包括用于第一芯片组的第一引线组和用于第二芯片组的第二引线组。 第一和第二芯片组是封装的一部分。

公开(公告)号：US08193626B2

公开(公告)日：2012-06-05

申请号：US12630363

申请日：2009-12-03

申请人： Chul Park ,  Hysong-seob Kim ,  Kun-dae Yeom ,  Gwang-man Lim

发明人： Chul Park ,  Hysong-seob Kim ,  Kun-dae Yeom ,  Gwang-man Lim

IPC分类号： H01L23/02

CPC分类号： H01L23/49541 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/535 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01075 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48175 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.

摘要翻译： 提供了包括多个半导体芯片的半导体封装以及连接到半导体芯片的分离的引线组。 引线暴露于半导体封装的外部。 多个引线可以包括用于第一芯片组的第一引线组和用于第二芯片组的第二引线组。 第一和第二芯片组是封装的一部分。

公开(公告)号：US20110141790A1

公开(公告)日：2011-06-16

申请号：US13034972

申请日：2011-02-25

申请人： Gwang-Man LIM

发明人： Gwang-Man LIM

IPC分类号： G11C13/04

CPC分类号： G06F13/4243 ,  Y02D10/14 ,  Y02D10/151

摘要： A memory module having a high data processing rate and high capacity is provided. The memory module may include a memory chip, a controller controlling an operation of the memory chip, an optical detector converting an external input signal into an internal input signal to transmit the converted signal to the controller, and an optical generator converting an internal output signal received from the controller into an external output signal. The optical detector converts an external input optical signal into an internal input signal to transmit the converted signal to the controller. The optical generator converts an internal output signal received from the controller into an external output optical signal.

摘要翻译： 提供具有高数据处理速率和高容量的存储器模块。 存储器模块可以包括存储器芯片，控制存储器芯片的操作的控制器，将外部输入信号转换为内部输入信号以将转换的信号传输到控制器的光学检测器，以及转换内部输出信号的光学发生器 从控制器接收到外部输出信号。 光学检测器将外部输入光信号转换为内部输入信号，以将转换的信号传送到控制器。 光发生器将从控制器接收的内部输出信号转换为外部输出光信号。