公开(公告)号：US20140069705A1

公开(公告)日：2014-03-13

申请号：US13997464

申请日：2011-12-23

Applicant: Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

Inventor： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

IPC: H05K1/02 ,  H05K3/38 ,  H05K3/42 ,  H05K3/06

CPC classification number: H05K1/0298 ,  H05K3/064 ,  H05K3/388 ,  H05K3/428 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0341 ,  H05K2203/0376

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括芯绝缘层，至少一个通过芯绝缘层形成的通孔，埋在芯绝缘层中的内电路层，以及在芯绝缘层的顶表面或底表面上的外电路层 ，其中所述通孔包括第一部分，在所述第一部分下方的第二部分，所述第一部分和所述第二部分之间的第三部分以及包含不同于所述第一至第三部分的金属的金属的至少一个阻挡层。 同时形成内部电路层和通孔，从而减少工艺步骤。 由于设置了奇数电路层，所以印刷电路板具有轻薄的结构。

公开(公告)号：US08658471B2

公开(公告)日：2014-02-25

申请号：US13142172

申请日：2009-12-23

Applicant: Hyun A. Chun ,  Jae Bong Choi ,  Sung Won Lee ,  Sung Wuk Ryu ,  Hyuk Soo Lee ,  Sai Ran Eom

Inventor： Hyun A. Chun ,  Jae Bong Choi ,  Sung Won Lee ,  Sung Wuk Ryu ,  Hyuk Soo Lee ,  Sai Ran Eom

IPC: H01L21/00 ,  H01L23/495

Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

公开(公告)号：US07849705B2

公开(公告)日：2010-12-14

申请号：US11730921

申请日：2007-04-04

Applicant: Hyuk Soo Lee ,  Young Hwan Ko ,  Byung Soon Kim

Inventor： Hyuk Soo Lee ,  Young Hwan Ko ,  Byung Soon Kim

IPC: F25D19/00 ,  F01N1/10 ,  F01N1/00

CPC classification number: F25B43/003 ,  C22C1/08 ,  F25B2500/01 ,  F25B2500/12

Abstract: An air conditioning system, comprising: a channel to carry a flow of refrigerant, and a first noise reducer to change at least one property of the refrigerant as the refrigerant flows through the channel.

Abstract translation: 一种空调系统，包括：用于承载制冷剂流动的通道，以及第一降噪器，用于当制冷剂流过通道时改变制冷剂的至少一个特性。

公开(公告)号：US20100275624A1

公开(公告)日：2010-11-04

申请号：US12223163

申请日：2007-02-15

Applicant: Hyuk Soo Lee ,  Young Hwan Ko ,  Byung Soon Kim

Inventor： Hyuk Soo Lee ,  Young Hwan Ko ,  Byung Soon Kim

IPC: F25B1/00 ,  F25B43/00 ,  F25B41/04

CPC classification number: F25B49/02 ,  F24F11/83 ,  F25B1/10 ,  F25B13/00 ,  F25B2313/02741 ,  F25B2341/0662 ,  F25B2400/13 ,  F25B2400/23 ,  F25B2500/19 ,  F25B2600/0253 ,  F25B2600/2509 ,  F25B2600/2513 ,  F25B2700/19 ,  F25B2700/2104 ,  F25B2700/2106 ,  F25B2700/2109 ,  Y02B30/741

Abstract: An air-conditioning system and a controlling method for the same that is capable of improving the operational efficiency of the air-conditioning system are disclosed. The air-conditioning system includes a phase separator (500) for separating a flowing refrigerant into a gas-phase refrigerant and a liquid-phase refrigerant, an evaporator (600) for evaporating the liquid-phase refrigerant separated by the phase separator (500), a compressor (100) having a first compression part into which the refrigerant having passed through the evaporator (600) is introduced and a second compression part into which both the gas-phase refrigerant separated by the phase separator (500) and the refrigerant having passed through the first compression part are introduced, and a control unit for simultaneously or selectively controlling the amount of the refrigerant introduced into the phase separator (500) and the amount of the refrigerant discharged from the phase separator (500).

Abstract translation: 公开了一种能够提高空调系统的运行效率的空调系统及其控制方法。 空调系统包括用于将流动的制冷剂分离成气相制冷剂和液相制冷剂的相分离器（500），用于蒸发由相分离器（500）分离的液相制冷剂的蒸发器（600） ，具有通过蒸发器（600）的制冷剂被引入到其中的第一压缩部的压缩机（100）和由所述相分离器（500）分离的所述气相制冷剂与所述制冷剂分离的第二压缩部， 引入通过第一压缩部的控制单元，以及用于同时或选择性地控制引入相分离器（500）的制冷剂量和从相分离器（500）排出的制冷剂量的控制单元。

公开(公告)号：US20100131115A1

公开(公告)日：2010-05-27

申请号：US12312457

申请日：2007-10-23

Applicant: Bum Suk Kim ,  Sang Kyoung Park ,  Young Hwan Ko ,  Hyuk Soo Lee

Inventor： Bum Suk Kim ,  Sang Kyoung Park ,  Young Hwan Ko ,  Hyuk Soo Lee

IPC: G05D7/00

CPC classification number: F25B13/00 ,  F25B1/10 ,  F25B2313/02741 ,  F25B2341/0662 ,  F25B2400/13 ,  F25B2400/23 ,  F25B2500/19 ,  F25B2500/28 ,  F25B2600/21 ,  F25B2600/2513 ,  F25B2700/197 ,  F25B2700/21151 ,  F25B2700/21175

Abstract: The present invention relates to a controlling method of an air conditioner. The controlling method of an air conditioner having a phase separator, an expansion valve, a control valve, an evaporator, a multistage compressor, and a condenser, includes the steps of sensing an order to operate the air conditioner, stabilizing the air conditioner, setting a degree of superheat of refrigerant in the air conditioner, and setting an optimum intermediate pressure of the refrigerant of the air conditioner.

Abstract translation: 本发明涉及空调的控制方法。 具有相分离器，膨胀阀，控制阀，蒸发器，多级压缩机和冷凝器的空调的控制方法包括以下步骤：感测空调的操作顺序，稳定空调，设定 空气调节器中的制冷剂的过热度，并且设定空气调节器的制冷剂的最佳中间压力。

公开(公告)号：US09907164B2

公开(公告)日：2018-02-27

申请号：US13997569

申请日：2011-12-23

Applicant: Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

Inventor： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

IPC: H05K1/09 ,  H05K1/16 ,  H01B13/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K3/46 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2203/0376

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed.

公开(公告)号：US08806888B2

公开(公告)日：2014-08-19

申请号：US12160097

申请日：2007-01-03

Applicant: Young Hwan Ko ,  Hyuk Soo Lee ,  Bum Suk Kim ,  Sang Kyoung Park ,  Byung Soon Kim

Inventor： Young Hwan Ko ,  Hyuk Soo Lee ,  Bum Suk Kim ,  Sang Kyoung Park ,  Byung Soon Kim

IPC: F25B1/10 ,  F25B13/00 ,  F25B43/00 ,  F25B31/00

CPC classification number: F25B13/00 ,  F25B1/10 ,  F25B31/004 ,  F25B43/00 ,  F25B43/006 ,  F25B2313/02741 ,  F25B2341/0662 ,  F25B2400/075 ,  F25B2400/0751 ,  F25B2400/13 ,  F25B2400/23 ,  F25B2500/01 ,  F25B2600/0253 ,  F25B2600/2509 ,  F25B2600/2519 ,  Y02B30/741

Abstract: An air conditioning system includes a phase separator separating a gaseous refrigerant and a liquid refrigerant from a flowing refrigerant, an evaporator evaporating the liquid refrigerant separated by the phase separator, and at least one compressor including a first compressing part receiving the refrigerant via the evaporator and a second compressing part receiving both of the gaseous refrigerant separated by the phase separator and the refrigerant via the first compressing part.

Abstract translation: 一种空调系统，包括从流动的制冷剂分离气态制冷剂和液体制冷剂的相分离器，蒸发由相分离器分离的液体制冷剂的蒸发器和至少一个压缩机，该压缩机包括经由蒸发器接收制冷剂的第一压缩部， 第二压缩部件，其接收由相分离器分离的气态制冷剂和经由第一压缩部件的制冷剂。

公开(公告)号：US20140054069A1

公开(公告)日：2014-02-27

申请号：US13997544

申请日：2011-12-23

Applicant: Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

Inventor： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

IPC: H05K1/02 ,  H05K3/20

CPC classification number: H05K1/0298 ,  H05K3/202 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/098 ,  H05K2203/0323 ,  H05K2203/0376

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括芯绝缘层，至少一个通过芯绝缘层形成的通孔，埋在芯绝缘层中的内电路层，以及在芯绝缘层的顶表面或底表面上的外电路层 其中所述通孔包括具有第一宽度的中心部分和具有第二宽度的接触部分，所述接触部分与所述芯绝缘层的表面接触，并且所述第一宽度大于所述第二宽度。 同时形成内部电路层和通孔，从而减少工艺步骤。 由于设置了奇数电路层，所以印刷电路板具有轻薄的结构。

公开(公告)号：US08561439B2

公开(公告)日：2013-10-22

申请号：US12708097

申请日：2010-02-18

Applicant: Hyuk Soo Lee ,  Tae Hee Lee ,  Young Jong Kim

Inventor： Hyuk Soo Lee ,  Tae Hee Lee ,  Young Jong Kim

IPC: D06F37/30

CPC classification number: D06F37/206 ,  D06F37/145 ,  D06F37/267 ,  D06F37/30

Abstract: A fabric treating machine according to the present invention comprises a connector which is disposed at an outer tub and is connected to a driving part which is disposed at either the center or the off-center position of the connector optionally. Therefore, not only the direct driving motor but the indirect driving motor can be disposed without change of the outer tub and the connector. Because the common use of the outer tub is possible regardless of the connecting method of the driving part, there are the advantages that the cost is reduced and productivity and assembly are improved.

Abstract translation: 根据本发明的织物处理机包括设置在外桶处的连接器，并且连接到可选地设置在连接器的中心位置或脱离中心位置的驱动部分。 因此，除了外桶和连接器之外，不但可以配置直接驱动电动机，而且可以配置间接驱动电动机。 由于无论驱动部件的连接方式如何，都可以通常使用外桶，因此具有降低成本，提高生产率和组装的优点。

公开(公告)号：US20130206459A1

公开(公告)日：2013-08-15

申请号：US13878319

申请日：2011-10-05

Applicant: Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

Inventor： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC: H05K1/02

CPC classification number: H05K1/021 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/73203 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

Abstract translation: 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。