公开(公告)号：US08561439B2

公开(公告)日：2013-10-22

申请号：US12708097

申请日：2010-02-18

申请人： Hyuk Soo Lee ,  Tae Hee Lee ,  Young Jong Kim

发明人： Hyuk Soo Lee ,  Tae Hee Lee ,  Young Jong Kim

IPC分类号： D06F37/30

CPC分类号： D06F37/206 ,  D06F37/145 ,  D06F37/267 ,  D06F37/30

摘要： A fabric treating machine according to the present invention comprises a connector which is disposed at an outer tub and is connected to a driving part which is disposed at either the center or the off-center position of the connector optionally. Therefore, not only the direct driving motor but the indirect driving motor can be disposed without change of the outer tub and the connector. Because the common use of the outer tub is possible regardless of the connecting method of the driving part, there are the advantages that the cost is reduced and productivity and assembly are improved.

摘要翻译： 根据本发明的织物处理机包括设置在外桶处的连接器，并且连接到可选地设置在连接器的中心位置或脱离中心位置的驱动部分。 因此，除了外桶和连接器之外，不但可以配置直接驱动电动机，而且可以配置间接驱动电动机。 由于无论驱动部件的连接方式如何，都可以通常使用外桶，因此具有降低成本，提高生产率和组装的优点。

公开(公告)号：US09970145B2

公开(公告)日：2018-05-15

申请号：US13387987

申请日：2010-07-29

申请人： Young Jong Kim ,  Hyuk Soo Lee

发明人： Young Jong Kim ,  Hyuk Soo Lee

IPC分类号： D06F37/20 ,  D06F37/24

CPC分类号： D06F37/24 ,  D06F37/20 ,  D06F37/206

摘要： A fabric treating machine according a present invention comprises a first vibration mitigation part which is disposed between a stator and a bearing unit. Therefore, it can reduce the transfer of the vibration from the driving unit to the bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced. Thus, a reliability of product can be improved. Also, a fabric treating machine according a present invention comprises a vibration mitigation part which is disposed between an upper bearing unit and a lower bearing unit. Therefore, it can reduce the vibration transfer from the lower bearing unit to the upper bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced.

公开(公告)号：US20120144875A1

公开(公告)日：2012-06-14

申请号：US13256183

申请日：2010-03-19

申请人： Young Jong Kim ,  Hyuk Soo Lee ,  Seong No Yoon ,  Dong Yoon Kim ,  Dong Min Kim

发明人： Young Jong Kim ,  Hyuk Soo Lee ,  Seong No Yoon ,  Dong Yoon Kim ,  Dong Min Kim

IPC分类号： D06F37/02 ,  D06F39/00

CPC分类号： F16F15/363 ,  D06F37/206 ,  D06F37/245

摘要： The present invention relates to a laundry processing apparatus. In particular, the laundry processing apparatus comprises: a cabinet; an outer chamber provided within the cabinet and in which wash water is filled; an inner chamber rotatably provided within the outer chamber to hold laundry; an upper balancer disposed at an upper portion of the inner chamber; and a lower balancer disposed at a lower portion of the inner chamber, wherein either the upper balancer or the lower balancer is a liquid balancer filled with liquid, and the other balancer is a ball balancer having a ball therein, such that the advantages of maximized balancing results and an effective reduction in vibration may be achieved.

摘要翻译： 衣物处理装置技术领域本发明涉及一种衣物处理装置。 具体地，衣物处理装置包括：橱柜; 设置在机柜内并且其中填充有洗涤水的外部室; 内室，其可旋转地设置在所述外室内以保持衣物; 设置在所述内腔的上部的上平衡器; 以及下部平衡器，其设置在所述内部室的下部，其中所述上部平衡器或下部平衡器是充满液体的液体平衡器，并且所述另一个平衡器是具有球的球平衡器，使得最大化 可以实现平衡结果和有效的振动降低。

公开(公告)号：US20120186307A1

公开(公告)日：2012-07-26

申请号：US13387987

申请日：2010-07-29

申请人： Young Jong Kim ,  Hyuk Soo Lee

发明人： Young Jong Kim ,  Hyuk Soo Lee

IPC分类号： D06F37/20 ,  D06F37/30 ,  D06F37/02

CPC分类号： D06F37/24 ,  D06F37/20 ,  D06F37/206

摘要： A fabric treating machine according a present invention comprises a first vibration mitigation part which is disposed between a stator and a bearing unit. Therefore, it can reduce the transfer of the vibration from the driving unit to the bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced. Thus, a reliability of product can be improved. Also, a fabric treating machine according a present invention comprises a vibration mitigation part which is disposed between an upper bearing unit and a lower bearing unit. Therefore, it can reduce the vibration transfer from the lower bearing unit to the upper bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced.

摘要翻译： 根据本发明的织物处理机包括设置在定子和轴承单元之间的第一减振部件。 因此，能够减少振动从驱动单元向轴承单元的传递，能够减轻内筒和外桶的振动，能够降低噪音。 因此，可以提高产品的可靠性。 而且，根据本发明的织物处理机包括设置在上轴承单元和下轴承单元之间的减振部件。 因此，能够减少从下轴承单元向上轴承单元的振动传递，能够减少内筒和外筒的振动，能够降低噪音。

公开(公告)号：US09844142B2

公开(公告)日：2017-12-12

申请号：US13811365

申请日：2011-07-15

申请人： In Hee Cho ,  Yun Ho An ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Hyun Gyu Park ,  Hyuk Soo Lee

发明人： In Hee Cho ,  Yun Ho An ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Hyun Gyu Park ,  Hyuk Soo Lee

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K1/03 ,  H05K1/09 ,  H01L23/367

CPC分类号： H05K1/181 ,  H01L23/3677 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K1/03 ,  H05K1/09 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2203/0369

摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

公开(公告)号：US09307675B2

公开(公告)日：2016-04-05

申请号：US13878637

申请日：2011-10-10

申请人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

发明人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC分类号： F21V29/00 ,  H05K7/20 ,  H01L23/367 ,  H01L25/075 ,  H01L33/64 ,  H05K3/30 ,  H05K13/00 ,  G02F1/1335 ,  H05K1/02 ,  H05K3/46 ,  F21V29/70 ,  H05K1/05 ,  H05K1/11

CPC分类号： H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US08659131B2

公开(公告)日：2014-02-25

申请号：US13121018

申请日：2009-09-25

申请人： Ji Yun Kim ,  Hyun Sub Shin ,  Sung Won Lee ,  Hyung Eui Lee ,  Yeong Uk Seo ,  Sung Wuk Ryu ,  Hyuk Soo Lee

发明人： Ji Yun Kim ,  Hyun Sub Shin ,  Sung Won Lee ,  Hyung Eui Lee ,  Yeong Uk Seo ,  Sung Wuk Ryu ,  Hyuk Soo Lee

IPC分类号： H01L23/495

CPC分类号： H01L21/4832 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/95 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85457 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.

摘要翻译： 本发明涉及多排引线框架和半导体封装的结构和制造方法，其特征在于在金属材料上形成焊盘部分（第一步骤）; 在第一图案形成之后执行表面电镀工艺或有机材料涂层（第二步骤）; 在金属材料上形成第二图案（第三步骤）; 并且在第二图案形成之后封装半导体芯片（第四步骤），由此通过施加渐进蚀刻来最小化底切现象。

公开(公告)号：US09549458B2

公开(公告)日：2017-01-17

申请号：US13878319

申请日：2011-10-05

申请人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

发明人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC分类号： H05K1/02 ,  H01L25/075 ,  H05K1/05 ,  H01L23/367 ,  H01L23/498 ,  H01L33/64

CPC分类号： H05K1/021 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/73203 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US09497853B2

公开(公告)日：2016-11-15

申请号：US13997544

申请日：2011-12-23

申请人： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

发明人： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

IPC分类号： H01B13/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K3/20

CPC分类号： H05K1/0298 ,  H05K3/202 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/098 ,  H05K2203/0323 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板包括芯绝缘层，至少一个通过芯绝缘层形成的通孔，埋在芯绝缘层中的内电路层，以及在芯绝缘层的顶表面或底表面上的外电路层 其中所述通孔包括具有第一宽度的中心部分和具有第二宽度的接触部分，所述接触部分与所述芯绝缘层的表面接触，并且所述第一宽度大于所述第二宽度。 同时形成内部电路层和通孔，从而减少工艺步骤。 由于设置了奇数电路层，所以印刷电路板具有轻薄的结构。

公开(公告)号：US20130188359A1

公开(公告)日：2013-07-25

申请号：US13878637

申请日：2011-10-10

申请人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

发明人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC分类号： H05K7/20 ,  H05K13/00 ,  H05K3/30 ,  F21V29/00

CPC分类号： H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。