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1.发明授权公开(公告)号：US09412720B2
公开(公告)日：2016-08-09
申请号：US14184951
申请日：2014-02-20
申请人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
发明人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
IPC分类号： H01L25/065 , H01L25/00 , H01L23/31 , H01L23/00 , H01L25/18
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/18 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2924/01013 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.
摘要翻译： 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。
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2.发明申请SEMICONDUCTOR PACKAGE HAVING SUPPORTING PLATE AND METHOD OF FORMING THE SAME 审中-公开具有支撑板的半导体封装及其形成方法公开(公告)号：US20140167291A1
公开(公告)日：2014-06-19
申请号：US14184951
申请日：2014-02-20
申请人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
发明人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
IPC分类号： H01L25/065
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/18 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2924/01013 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.
摘要翻译： 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。
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3.发明申请公开(公告)号：US20130049228A1
公开(公告)日：2013-02-28
申请号：US13564309
申请日：2012-08-01
申请人： Tae-Duk NAM , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
发明人： Tae-Duk NAM , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
IPC分类号： H01L25/07
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/18 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2924/01013 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.
摘要翻译： 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。
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公开(公告)号：US09349684B2
公开(公告)日：2016-05-24
申请号：US14810430
申请日：2015-07-27
申请人： Hyuk-su Kim , Tae-ho Kang , Tae-hee Song , Won-cheol Lee
发明人： Hyuk-su Kim , Tae-ho Kang , Tae-hee Song , Won-cheol Lee
IPC分类号： H01L23/498 , H01L27/088 , H05K1/02 , H01L23/31 , H01L25/065 , H01L23/04
CPC分类号： H01L23/4985 , H01L23/04 , H01L23/3121 , H01L23/49844 , H01L23/552 , H01L25/0655 , H01L27/088 , H01L2224/16146 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2924/15156 , H01L2924/15311 , H01L2924/15313 , H05K1/0277 , H05K1/0281 , H05K1/189 , H05K3/284 , H05K2203/1316 , H05K2203/1327 , H01L2924/00012 , H01L2924/00
摘要： Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.
摘要翻译： 提供了一种弯曲的半导体封装以及包括半导体封装的器件。 半导体封装包括：柔性印刷电路板（PCB），包括形成为拱形的固定弯曲部分，并且包括面向第一方向的第一表面和与第一表面相对的第二表面; 至少一个半导体芯片附接到柔性PCB的固定弯曲部分的第二表面; 以及具有刚性的模具层，并且形成在柔性PCB的固定弯曲部分的第二表面上，同时围绕至少一个半导体芯片。
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公开(公告)号：US20160056091A1
公开(公告)日：2016-02-25
申请号：US14810430
申请日：2015-07-27
申请人： Hyuk-su KIM , Tae-ho KANG , Tae-hee SONG , Won-cheol LEE
发明人： Hyuk-su KIM , Tae-ho KANG , Tae-hee SONG , Won-cheol LEE
IPC分类号： H01L23/498 , H01L23/04 , H01L23/31 , H01L25/065 , H01L27/088 , H05K1/02
CPC分类号： H01L23/4985 , H01L23/04 , H01L23/3121 , H01L23/49844 , H01L23/552 , H01L25/0655 , H01L27/088 , H01L2224/16146 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2924/15156 , H01L2924/15311 , H01L2924/15313 , H05K1/0277 , H05K1/0281 , H05K1/189 , H05K3/284 , H05K2203/1316 , H05K2203/1327 , H01L2924/00012 , H01L2924/00
摘要： Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.
摘要翻译： 提供了一种弯曲的半导体封装以及包括半导体封装的器件。 半导体封装包括：柔性印刷电路板（PCB），包括形成为拱形的固定弯曲部分，并且包括面向第一方向的第一表面和与第一表面相对的第二表面; 至少一个半导体芯片附接到柔性PCB的固定弯曲部分的第二表面; 以及具有刚性的模具层，并且形成在柔性PCB的固定弯曲部分的第二表面上，同时围绕至少一个半导体芯片。
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6.发明授权公开(公告)号：US08674494B2
公开(公告)日：2014-03-18
申请号：US13564309
申请日：2012-08-01
申请人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
发明人： Tae-Duk Nam , Jin-Ho Kim , Hyuk-Su Kim , Hyoung-Suk Kim , Tae-Young Lee
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/18 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2924/01013 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/014 , H01L2224/85 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.
摘要翻译： 半导体封装可以包括封装衬底，封装衬底上的第一半导体芯片，以及封装衬底上的支撑板。 支撑板可以在相对于包装基板的表面平行的方向上与第一半导体芯片间隔开。 可以在第一半导体芯片和支撑板上设置第二半导体芯片，使得第一半导体芯片在第二半导体芯片和封装基板之间，并且支撑板位于第二半导体芯片和封装基板之间。 粘合层可以将第二半导体芯片接合到第一半导体芯片，并且可以将第二半导体芯片接合到支撑板。 此外，可以在第一半导体芯片和封装基板之间设置电耦合。
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