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    Autofocus system and method in digital holography
    1.
    发明授权
    Autofocus system and method in digital holography 有权

    公开(公告)号：US10241471B2

    公开(公告)日：2019-03-26

    申请号：US15528202

    申请日：2015-11-30

    Applicant: IMEC TAIWAN CO. ,  IMEC VZW

    Inventor： Ching-Chun Hsiao ,  Ting-Ting Chang ,  Chao-Kang Liao

    IPC: G03H1/04 ,  G03H1/08 ,  G06T7/11 ,  G06T7/13 ,  G06T7/136 ,  G06T7/187

    Abstract: At least one embodiment relates to an autofocus method for determining a focal plane for at least one object. The method includes reconstructing a holographic image of the at least one object such as to provide a reconstructed image at a plurality of different focal depths. The reconstructed image includes a real component and an imaginary component. The method also include performing a first edge detection on the real component for at least two depths of the plurality of different focal depths and a second edge detection on the imaginary component for the at least two depths. Further, the method includes obtaining a first measure of clarity for each of the at least two depths based on a first measure of statistical dispersion with respect to the first edge detection and a second measure of clarity.

    Using MEMS fabrication incorporating into LED device mounting and assembly
    2.
    发明授权
    Using MEMS fabrication incorporating into LED device mounting and assembly 有权

    公开(公告)号：US10026882B2

    公开(公告)日：2018-07-17

    申请号：US14507862

    申请日：2014-10-07

    Applicant: Epistar Corporation ,  IMEC Taiwan Co.

    Inventor： Guan Ru He ,  Jui-Hung Yeh ,  Kevin T. Y. Huang ,  Chih Chung Chen

    IPC: H01L33/62 ,  H01L25/075 ,  H01L21/683 ,  H01L33/48 ,  H01L33/36 ,  H01L27/15 ,  H01L23/00

    Abstract: LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.

    Apparatus and Method of Batch Assembly
    3.
    发明申请
    Apparatus and Method of Batch Assembly 有权
    批量装配的装置和方法

    公开(公告)号：US20140241845A1

    公开(公告)日：2014-08-28

    申请号：US13776235

    申请日：2013-02-25

    Applicant: IMEC TAIWAN CO.

    Inventor： Kevin Huang ,  Chihchung (Gary) Chen

    IPC: B25J11/00

    CPC classification number: H05K13/0478

    Abstract: The present disclosure is directed to an apparatus and method of batch assembly. The apparatus for batch assembly may include a plurality of spring units, a plurality of handling units, and a control unit. The method of batch assembly may include aligning an array of devices with a plurality of handling units, attaching the array of devices onto the handling units, expanding the handling units so as to expand the array of devices from a first area to a second area, and transferring the array of devices to a destination.

    Abstract translation: 本公开涉及一种批量组装的装置和方法。 用于批量组装的装置可以包括多个弹簧单元，多个处理单元和控制单元。 批量组装的方法可以包括将设备阵列与多个处理单元对准，将设备阵列附接到处理单元上，扩展处理单元以便将设备阵列从第一区域扩展到第二区域， 并将设备阵列传送到目的地。

    Smart Packaging and Display System
    4.
    发明申请
    Smart Packaging and Display System 审中-公开

    公开(公告)号：US20190326954A1

    公开(公告)日：2019-10-24

    申请号：US16388402

    申请日：2019-04-18

    Applicant: R. J. Reynolds Tobacco Company ,  IMEC Taiwan Co.

    Inventor： Andries Don Sebastian ,  Rajesh Sur ,  Percy Phillips ,  Chung-Hsuan Yeh

    IPC: H04B5/00 ,  G06K7/10 ,  G06K19/07 ,  H01Q1/22 ,  G06F3/0484

    Abstract: A smart packaging system and a smart display system and methods relating thereto are disclosed herein. In various embodiments, the packaging system may include an inner package, an outer package, and an identification tag disposed between said inner package and said outer package. Said identification tag may be a radio-frequency identification (RFID) tag, a near-field communication (NFC) identification tag, or any variation thereof. In various embodiments, the display system may include a display shelf for positively positioning a plurality of product packages, at least one near-field communication antenna, and a control system. Each of said plurality of product packages may include said identification tag. Said control system may transmit and receive product information data to and from said identification tag for each of said plurality of product packages.

    Apparatus and method of batch assembly
    9.
    发明授权
    Apparatus and method of batch assembly 有权

    公开(公告)号：US09918420B2

    公开(公告)日：2018-03-13

    申请号：US13776235

    申请日：2013-02-25

    Applicant: IMEC Taiwan CO.

    Inventor： Kevin Huang ,  Chihchung (Gary) Chen ,  Wei-Lun Sung

    IPC: H05K13/04

    CPC classification number: H05K13/0478

    Abstract: The present disclosure is directed to an apparatus and method of batch assembly. The apparatus for batch assembly may include a plurality of spring units, a plurality of handling units, and a control unit. The method of batch assembly may include aligning an array of devices with a plurality of handling units, attaching the array of devices onto the handling units, expanding the handling units so as to expand the array of devices from a first area to a second area, and transferring the array of devices to a destination.

    Compliable Units and Compliable Network Having the Same
    10.
    发明申请
    Compliable Units and Compliable Network Having the Same 有权
    兼容单位和兼容网络相同

    公开(公告)号：US20140043775A1

    公开(公告)日：2014-02-13

    申请号：US13763010

    申请日：2013-02-08

    Applicant: IMEC TAIWAN CO.

    Inventor： Kevin Huang ,  Chihchung (Gary) Chen

    IPC: H05K7/02

    CPC classification number: H05K7/02 ,  H01L23/5386 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A compliable unit in an compliable network comprises a first layer including at least one device component at a first region of the first layer, and a second layer including at least one compliable element at a first region of the second layer to transfer the at least one device component to a desired location. The first layer and the second layer are arranged in a stack.

    Abstract translation: 可并发网络中的可并行单元包括在第一层的第一区域包括至少一个器件部件的第一层和在第二层的第一区域包括至少一个可复制元件的第二层，以将至少一个 设备组件到所需位置。 第一层和第二层被布置成堆叠。

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