公开(公告)号：US09949469B1

公开(公告)日：2018-04-24

申请号：US14882567

申请日：2015-10-14

申请人： William J. Carpenter

发明人： William J. Carpenter

IPC分类号： A01K89/01 ,  A01K89/027

CPC分类号： A01K89/01085 ,  A01K89/0102 ,  A01K89/0117 ,  A01K89/0275

摘要： A line reel apparatus includes an apparatus housing having a fixed housing portion and a rotating housing portion adjacent to the fixed housing portion. A pin magnet is provided on the rotating housing portion. A drive mechanism drivingly engages the rotating housing portion for rotation. A catch pin housing is disposed for rotation in the rotating housing portion. A line annulus is formed between the catch pin housing and the rotating housing portion. A catch pin cavity is provided in the catch pin housing. The catch pin cavity is disposed in aligned or registering relationship to the pin magnet along a longitudinal axis of the rotating housing portion. A magnetic catch pin is disposed in the catch pin cavity and positional between a retracted position clearing the line annulus and an extended position spanning the line annulus upon alignment of the pin magnet with the catch pin cavity responsive to rotation of the rotating housing portion. A bias mechanism biases the catch pin in the retracted position in the catch pin cavity. A spool is provided in the rotating housing portion and a line is wound on the spool and extends through the line annulus from the rotating housing portion.

公开(公告)号：US09262149B2

公开(公告)日：2016-02-16

申请号：US13445011

申请日：2012-04-12

申请人： Kevin B. Bates ,  William J. Carpenter ,  Michael G. Winter

发明人： Kevin B. Bates ,  William J. Carpenter ,  Michael G. Winter

IPC分类号： G06F9/45 ,  G06F9/445

CPC分类号： G06F8/68 ,  G06F8/62 ,  G06F8/65 ,  G06F8/658 ,  G06F9/445

摘要： According to one embodiment of the present invention, a computer system updates a system including a plurality of server instances, and includes at least one processor. The computer system determines a level of configuration for each operating server instance. One or more sets of operational features are added to the system based on a comparison between the determined levels of configuration of the operating server instances and minimum levels of configuration associated with the one or more sets of operational features. Server operations are performed and one or more corresponding sets of operational features are applied to the server operations in response to the addition of those corresponding sets of operational features to the system. Embodiments of the present invention further include a method and computer program product for updating a system including a plurality of server instances in substantially the same manner described above.

摘要翻译： 根据本发明的一个实施例，计算机系统更新包括多个服务器实例的系统，并且包括至少一个处理器。 计算机系统确定每个操作服务器实例的配置级别。 基于所确定的操作服务器实例的配置级别与与一组或多组操作特征相关联的最低配置级别之间的比较，将一组或多组操作特征添加到系统。 执行服务器操作并且响应于向系统添加那些对应的操作特征集合而将一个或多个对应的操作特征集合应用于服务器操作。 本发明的实施例还包括一种用于以与上述基本相同的方式更新包括多个服务器实例的系统的方法和计算机程序产品。

公开(公告)号：US20150380376A1

公开(公告)日：2015-12-31

申请号：US14314260

申请日：2014-06-25

申请人： VARUGHESE MATHEW ,  Burton J. Carpenter ,  Leo M. Higgins, III ,  Chu-Chung Lee ,  Tu-Anh N. Tran

发明人： VARUGHESE MATHEW ,  Burton J. Carpenter ,  Leo M. Higgins, III ,  Chu-Chung Lee ,  Tu-Anh N. Tran

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L24/49 ,  H01L23/49582 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05657 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48482 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85051 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/92247 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01074 ,  H01L2924/01015 ,  H01L2924/01075 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/0665 ,  H01L2924/00

摘要： The present disclosure provides embodiments of package devices and methods for making package devices for a semiconductor die. One embodiment includes a die mounting structure having a finished bond pad that includes a copper bond pad and a cobalt-containing layer over a top surface of the copper bond pad, and a wire bond structure that is bonded to a top surface of the cobalt-containing layer of the finished bond pad, where cobalt-containing material of the cobalt-containing layer is located between a bottom surface of the wire bond structure and the top surface of the copper bond pad such that the cobalt-containing material is present under a center portion of the wire bond structure.

摘要翻译： 本公开提供了用于制造用于半导体管芯的封装器件的封装器件和方法的实施例。 一个实施例包括具有完成的接合焊盘的管芯安装结构，该焊接垫在铜焊盘的顶表面上包括铜接合焊盘和含钴层，以及引线键合结构，其结合到钴 - 其中含钴层的含钴材料位于引线键合结构的底表面和铜键合焊盘的顶表面之间，使得含钴材料存在于 引线接合结构的中心部分。

公开(公告)号：US20150311173A1

公开(公告)日：2015-10-29

申请号：US14262381

申请日：2014-04-25

申请人： BURTON J. CARPENTER ,  CHU-CHUNG LEE ,  TU-ANH N. TRAN

发明人： BURTON J. CARPENTER ,  CHU-CHUNG LEE ,  TU-ANH N. TRAN

IPC分类号： H01L23/00

CPC分类号： H01L24/49 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/431 ,  H01L2224/432 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45687 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48451 ,  H01L2224/48456 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85931 ,  H01L2224/85939 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/013 ,  H01L2924/01047 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor structure includes a bond pad and a wire bond coupled to the bond pad. The wire bond includes a bond in contact with the bond pad. The wire bond includes a coating on a surface of the wire bond, and a first exposed portion of the wire bond in a selected location. The wire bond is devoid of the coating over the selected location of the wire bond, and an area of the first exposed portion is at least one square micron.

摘要翻译： 半导体结构包括接合焊盘和耦合到接合焊盘的引线键合。 引线键合包括与接合焊盘接触的键。 引线接合包括在引线键合的表面上的涂层，以及在选定位置的引线键合的第一暴露部分。 引线接合在引线键合的选定位置上没有涂层，并且第一暴露部分的面积为至少一平方微米。

公开(公告)号：US20150118791A1

公开(公告)日：2015-04-30

申请号：US14069103

申请日：2013-10-31

申请人： Varughese Mathew ,  Burton J. Carpenter ,  Leo M. Higgins, III

发明人： Varughese Mathew ,  Burton J. Carpenter ,  Leo M. Higgins, III

IPC分类号： H01L23/00

CPC分类号： H01L24/05 ,  H01L21/4864 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85011 ,  H01L2224/85399 ,  H01L2224/85447 ,  H01L2224/8548 ,  H01L2224/85484 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1531 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a package substrate having a copper bond pad and a location for receiving a semiconductor die having a remnant of one of a group consisting of HEDP and an HEDP derivative on a top surface of the copper bond pad. The semiconductor die is attached to the substrate. A wirebond connection is attached between the remnant and the semiconductor die.

摘要翻译： 一种制造具有铜键合焊盘的封装衬底的方法和用于接收在铜键合焊盘的顶表面上具有由HEDP和HEDP衍生物组成的组中的一种的残留物的半导体管芯的位置。 半导体管芯附着在基板上。 引线接合连接在残余物和半导体管芯之间。

公开(公告)号：US20140213018A1

公开(公告)日：2014-07-31

申请号：US13755904

申请日：2013-01-31

申请人： Leo M. Higgins III ,  Burton J. Carpenter

发明人： Leo M. Higgins III ,  Burton J. Carpenter

IPC分类号： H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/36 ,  H01L23/42 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A method includes providing an integrated circuit (IC) die assembly that includes a substrate and an IC die mounted on a portion of a major surface of the substrate, dispensing an interface material on the IC die, positioning a portion of a heat spreader in contact with the interface material, and dispensing an adhesive between one side of the heat spreader facing the IC die assembly and exposed portions of a major surface of an encapsulant on the substrate.

摘要翻译： 一种方法包括提供集成电路（IC）模具组件，其包括衬底和安装在衬底的主表面的一部分上的IC模具，在IC模具上分配界面材料，将散热器的一部分定位成接触 并且在散热器的面对IC模具组件的一侧和衬底上的密封剂的主表面的暴露部分之间分配粘合剂。

公开(公告)号：US08702499B2

公开(公告)日：2014-04-22

申请号：US13606958

申请日：2012-09-07

申请人： Bradley W. Johnson ,  Linda Trinh ,  Galen Svanas ,  John J. Carpenter ,  J P Cody

发明人： Bradley W. Johnson ,  Linda Trinh ,  Galen Svanas ,  John J. Carpenter ,  J P Cody

IPC分类号： G07F17/32

CPC分类号： G07F17/3276

摘要： A multi-site tournament gaming system and method are disclosed wherein multiple casino operators are engaged to initiate a series of player qualifying events and to hold a multi-session tournament of the qualified players to determine the site winners; and, a final tournament is operated wherein the site winners are provided prizes and compete to be named the ultimate champion.

摘要翻译： 公开了一种多站点比赛游戏系统和方法，其中多个赌场运营商参与启动一系列玩家合格事件并且持有合格玩家的多场比赛来确定场地获胜者; 并且进行最终的比赛，其中获奖者获得奖品并且竞争被命名为终极冠军。

公开(公告)号：US20140001632A1

公开(公告)日：2014-01-02

申请号：US13537388

申请日：2012-06-29

申请人： Trent S. Uehling ,  Burton J. Carpenter ,  Brett P. Wilkerson

发明人： Trent S. Uehling ,  Burton J. Carpenter ,  Brett P. Wilkerson

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83002 ,  H01L2224/85002 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1811 ,  H01L2924/18165 ,  H01L2924/182 ,  H01L2924/183 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A package structure includes a package substrate having a top surface and a bottom surface. A semiconductor die having a top surface and a bottom surface. The semiconductor die is mounted to the package substrate. The bottom surface of the semiconductor die is adjacent to the top surface of the package substrate. An air gap is between the bottom surface of the package substrate and the bottom surface of semiconductor die.

摘要翻译： 封装结构包括具有顶表面和底表面的封装衬底。 一种具有顶表面和底表面的半导体管芯。 将半导体管芯安装到封装衬底。 半导体管芯的底表面与封装衬底的顶表面相邻。 在封装衬底的底表面和半导体管芯的底表面之间存在气隙。

公开(公告)号：US20130275741A1

公开(公告)日：2013-10-17

申请号：US13445011

申请日：2012-04-12

申请人： Kevin B. Bates ,  William J. Carpenter ,  Michael G. Winter

发明人： Kevin B. Bates ,  William J. Carpenter ,  Michael G. Winter

IPC分类号： G06F9/00

CPC分类号： G06F8/68 ,  G06F8/62 ,  G06F8/65 ,  G06F8/658 ,  G06F9/445

摘要： According to one embodiment of the present invention, a computer system updates a system including a plurality of sever instances, and includes at least one processor. The computer system determines a level of configuration for each operating server instance. One or more sets of operational features are added to the system based on a comparison between the determined levels of configuration of the operating server instances and minimum levels of configuration associated with the one or more sets of operational features. Server operations are performed and one or more corresponding sets of operational features are applied to the server operations in response to the addition of those corresponding sets of operational features to the system. Embodiments of the present invention further include a method and computer program product for updating a system including a plurality of server instances in substantially the same manner described above.

摘要翻译： 根据本发明的一个实施例，计算机系统更新包括多个服务器实例的系统，并且包括至少一个处理器。 计算机系统确定每个操作服务器实例的配置级别。 基于所确定的操作服务器实例的配置级别与与一组或多组操作特征相关联的最低配置级别之间的比较，将一组或多组操作特征添加到系统。 执行服务器操作并且响应于向系统添加那些对应的操作特征集合而将一个或多个对应的操作特征集合应用于服务器操作。 本发明的实施例还包括一种用于以与上述基本相同的方式更新包括多个服务器实例的系统的方法和计算机程序产品。

公开(公告)号：US08469788B2

公开(公告)日：2013-06-25

申请号：US13241043

申请日：2011-09-22

申请人： John J. Carpenter ,  Keith Riggs ,  Allison Pope ,  Michael D. Conway ,  Clint Owen ,  Bradley W. Johnson ,  Jp Cody

发明人： John J. Carpenter ,  Keith Riggs ,  Allison Pope ,  Michael D. Conway ,  Clint Owen ,  Bradley W. Johnson ,  Jp Cody

IPC分类号： A63F9/24

CPC分类号： G07F17/3276 ,  G07F17/3209 ,  G07F17/3211 ,  G07F17/3225 ,  G07F17/323 ,  G07F17/3244 ,  G07F17/3286

摘要： A convertible in-revenue and out-of-revenue gaming system is disclosed that includes a server connected to automatically convert operating modes and control in-revenue and out-of-revenue operation of one or more banks of gaming machines. Additionally disclosed are gaming machines with video cameras connected to provide live video feed to one or more displays, such as during tournament play when live video feed of the players and the player tournament positions may be driven in real-time to an overhead display by the server operating in a tournament controller mode.

摘要翻译： 披露了可转换的收入和收入不足的游戏系统，其包括连接到自动转换操作模式并控制一个或多个游戏机组的收入和收入外操作的服务器。 另外公开了具有摄像机的游戏机，其连接到向一个或多个显示器提供实时视频馈送，诸如在比赛期间，当玩家的实时视频馈送和玩家比赛位置可以被实时地驱动到高架显示时 服务器在比赛控制器模式下运行。