Abstract:
The present invention relates to a method for forming graphene at a low temperature, to a method for direct transfer of graphene using same, and to a graphene sheet. The method for forming graphene at a low temperature comprises supplying a carbon-source-containing gas to a metal catalyst layer for graphene growth formed on a substrate, and forming graphene at a low temperature of 500° C. or less by means of inductively coupled plasma-chemical vapor deposition (ICP-CVD).
Abstract:
A thin film solar cell, includes: a first electrode; a light absorption layer including a first light absorption layer including a group I element-group III element-group VI element compound, a second light absorption layer including a group I element-group III element-group VI element compound, and a third light absorption layer including a group I element-group III element-group VI element compound; and a second electrode, wherein the first light absorption layer has a band gap, which is less a band gap of the second light absorption layer, the band gap of the second light absorption layer is less than a band gap of the third light absorption layer, and the second light absorption layer has a band gap gradient, which increases in a direction from the first light absorption layer to the third light absorption layer.
Abstract:
A method of manufacturing a dispersion type inorganic electroluminescence device and a dispersion type inorganic electroluminescence device including a light-emitting layer and a dielectric layer, which are integrated, are disclosed. The method is directed to the manufacture of a dispersion type inorganic electroluminescence device, in which phosphor particles are coated with a metal oxide precursor using ultrasonic waves, after which the phosphor particles coated with the metal oxide precursor are disposed between a transparent electrode and an upper electrode, forming a light-emitting layer and a dielectric layer, which are integrated. The dispersion type inorganic electroluminescence device includes a plurality of phosphor particles coated with a metal oxide precursor, disposed between a transparent electrode and an upper electrode, thereby providing a light-emitting layer and a dielectric layer, which are integrated.
Abstract:
A field emitter device including carbon nanotubes each of which has a protective membrane is provided. The protective membrane is formed of a nitride, a carbide, or an oxide. Suitable nitrides for the protective membrane include boron nitride, aluminum nitride, boron carbon nitride, and gallium nitride. The protective membrane protects the carbon nanotubes from damage due to arcing or an unnecessary remaining gas and thus improves field emission characteristics and stability of the field emitter device.
Abstract:
The present invention relates to a method for forming graphene at a low temperature, to a method for direct transfer of graphene using same, and to a graphene sheet. The method for forming graphene at a low temperature comprises supplying a carbon-source-containing gas to a metal catalyst layer for graphene growth formed on a substrate, and forming graphene at a low temperature of 500° C. or less by means of inductively coupled plasma-chemical vapor deposition (ICP-CVD).
Abstract:
Disclosed is a method for a making cathode substrate for a flat panel display device including coating a cathode electrode composition on a substrate to produce a cathode electrode, coating a conductive composition including a Si-included material on the cathode electrode to prepare a conductive layer on the cathode electrode and applying an electron emission composition including a material such as carbon nano tube on the conductive layer.
Abstract:
An inorganic electroluminescence device including a first electrode and a second electrode disposed apart from each other, and a dielectric material layer disposed between the first and second electrodes. The dielectric material layer has a micro-tubular shape, and a light emitting layer is filled in the dielectric material layer.
Abstract:
An inorganic electroluminescence device including a first electrode and a second electrode disposed apart from each other, and a dielectric material layer disposed between the first and second electrodes. The dielectric material layer has a micro-tubular shape, and a light emitting layer is filled in the dielectric material layer.
Abstract:
A method for manufacturing the semiconductor laser device comprising the steps of sequentially forming an active layer, a photo-waveguide layer, a cladding layer, and an ohmic contact layer on an upper surface of an InP substrate; forming a first patterned dielectric layer on the ohmic contact layer; depositing a patterned photoresist on the ohmic contact layer to define a p- electrode stripe layer; forming the p- electrode stripe layer only on a part of the ohmic contact layer; performing an annealing process; etching back the layers until the photo-waveguide layer is exposed, using the first patterned dielectric layer and the p- electrode stripe layer as an etching mask, to form a ridge; depositing a second dielectric layer on the substrate formed thus; selectively removing the second dielectric layer to form a contact hole on the p- electrode stripe layer; coating a bonding pad metal layer on the second dielectric layer and in the contact hole; and coating an n- electrode metal layer on bottom surface of the substrate. Since ohmic contact resistance is lowered, thermal generation and threshold current of oscillation are decreased. As a result, operating characteristics of the laser device can be largely improved.
Abstract:
An avalanche photodiode in which a strained superlattice structure is used as a multiplication layer, comprising: an n.sup.+ type InP substrate; an n.sup.+ type InP epitaxial layer formed on a main surface of the substrate; an N type In.sub.1-x Al.sub.x As layer formed on the epitaxial layer; an n.sup.+ type In.sub.1-x Al.sub.x As layer formed on the N type In.sub.1-x Al.sub.x As layer, the n.sup.+ type In.sub.1-x Al.sub.x As layer having a relatively high impurity concentration more than the N type In.sub.1-x Al.sub.x As layer; the multiplication layer deposited on the n.sup.+ type In.sub.1-x Al.sub.x As layer, the multiplication layer having an In.sub.0.53 Ga.sub.0.47 As/In.sub.1-x Al.sub.x As superlattice structure; first and second p.sup.+ type In.sub.1-x Al.sub.x As layers laminated sequentially on the multiplication layer; an absorbing layer formed on the second p.sup.+ type In.sub.1-x Al.sub.x As layer, the absorbing layer being made of an In.sub.0.53 Ga.sub.0.47 As; a P type InP layer formed on the absorbing layer to reduce a surface leakage current; an In.sub.0.53 Ga.sub.0.47 As layer formed on the P type InP layer to be provided for an ohmic contact, and metal layers formed on an upper surface of the In.sub.0.53 Ga.sub.0.47 As layer and the other surface of the substrate, respectively.
Abstract translation:使用应变超晶格结构作为倍增层的雪崩光电二极管,包括:n +型InP衬底; 在衬底的主表面上形成的n +型InP外延层; 形成在外延层上的N型In 1-x Al x As层; 形成在N型In 1-x Al x As层上的n +型In 1-x Al x As层,n +型In 1-x Al x As层具有比N型In 1-x Al x As层更高的杂质浓度; 所述乘法层沉积在n +型In1-xAlxAs层上,所述乘法层具有In0.53Ga0.47As / In1-xAlxAs超晶格结构; 第一和第二p +型In1-xAlxAs层依次层叠在乘法层上; 形成在所述第二p +型In 1-x Al x As层上的吸收层,所述吸收层由In 0.53 Ga 0.47 As制成; 形成在吸收层上的P型InP层,以减少表面泄漏电流; 形成在用于欧姆接触的P型InP层上形成的In0.53Ga0.47As层,以及分别形成在In0.53Ga0.47As层的上表面和衬底的另一表面上的金属层。