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公开(公告)号：US4876656A
公开(公告)日：1989-10-24
申请号：US90997
申请日：1987-08-28
IPC分类号： G05B19/408 , H05K13/08
CPC分类号： G05B19/4083 , H05K13/08 , G05B2219/36417 , G05B2219/37572 , G05B2219/41104 , G05B2219/45035
摘要： Unique circuit location sensing apparatus for component placement robots (100) utilizes a high-resolution optical reflective sensor (110) for detecting the location of selected circuit runners (300, 301) on a printed circuit board (350). The sensor (110) is mounted to the robot arm (106) and coupled by A/D converting circuitry (104) to the robot computer (102). The robot computer (102) positions sensor (110) over a selected runner (300, 301) and steps sensor (110) across the selected runner (300, 301), storing the digitized sensor output for each step. The robot computer (102) processes the digitized sensor outputs to determine the actual location of the selected runner (300, 301) and then calculates location offsets for the component placement program to be subsequently run on the robot computer (102). As a result, variations in actual location of circuitry on different printed circuit boards (350) are automatically compensated for and components are more accurately placed thereon. The unique circuit location sensing apparatus of the present invention may be advantageously utilized in any component placement robot for accurately detecting the location of circuitry prior to placement of components on the printed circuit board.
摘要翻译： 用于元件放置机器人（100）的唯一电路位置检测装置利用高分辨率光学反射传感器（110）来检测在印刷电路板（350）上所选择的电路板（300,301）的位置。 传感器（110）安装到机器人手臂（106）上并由A / D转换电路（104）耦合到机器人计算机（102）。 机器人计算机（102）将传感器（110）定位在所选择的转轮（300,301）上方，并且跨越所选择的转轮（300,301）上的步进传感器（110），为每个步骤存储数字化的传感器输出。 机器人计算机（102）处理数字化传感器输出以确定所选择的跑步者（300,301）的实际位置，然后计算随后在机器人计算机（102）上运行的组件放置程序的位置偏移。 因此，不同印刷电路板（350）上的电路的实际位置的变化被自动补偿并且组件更准确地放置在其上。 本发明的独特的电路位置检测装置可以有利地用于任何部件放置机器人，用于在将部件放置在印刷电路板上之前准确地检测电路的位置。
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公开(公告)号：US4636406A
公开(公告)日：1987-01-13
申请号：US687886
申请日：1984-12-31
申请人： John L. Leicht
发明人： John L. Leicht
CPC分类号： B23K3/06 , H05K3/1225 , H05K3/1233 , H05K2203/0126 , Y10T29/49124 , Y10T29/49144
摘要： A solder paste dispensing assembly provides for the controlled application of a predetermined solder paste pattern to a surface. The surface can be on a printed circuit board, prior to or after the board is mounted onto an assembled product or it can be a portion of the product itself. The surface can be a planar or non-planar surface.
摘要翻译： 焊膏分配组件提供对表面的预定焊膏图案的受控应用。 在将板安装到组装的产品之前或之后，表面可以在印刷电路板上，或者它可以是产品本身的一部分。 表面可以是平面或非平面表面。
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公开(公告)号：US5551627A
公开(公告)日：1996-09-03
申请号：US314833
申请日：1994-09-29
CPC分类号： B23K35/26 , B23K35/001 , H05K3/3436 , H05K3/3478 , B23K35/004 , B23K35/005 , B23K35/007 , B23K35/262 , B23K35/268 , H01L2224/11334 , H01L2224/13109 , H01L2224/8181 , H01L2224/81815 , H01L2924/01327 , H05K2201/10992 , H05K2203/041 , H05K3/3463 , Y02P70/613 , Y10T29/49144
摘要： An electronic assembly (100) includes multiple solder connections (101) coupling faying surfaces (202, 204) of two substrates (106, 108). A solder connection (201) is fabricated by reflow heating of a first, less compliant solder paste (312, 314) and a compliant preform (210) so as to cause compliant material of the preform (210) to dissolve into the solder paste (312, 314). Upon solidification of the solder paste (312, 314), blended regions (520, 522), having a gradual, changing concentration of compliant material form between resulting fillets (212, 214) and the preform (210). The blended regions (520, 522) transfer temperature induced shear stresses, caused by thermal cycling of the electronic assembly (100), from the fillets (212, 214) into the compliant preform (210).
摘要翻译： 电子组件（100）包括耦合两个基板（106,108）的接合表面（202,204）的多个焊接连接（101）。 焊料连接（201）通过回流加热第一较少顺应性焊膏（312,314）和柔顺预制件（210）来制造，以便使预成型件（210）的顺应性材料溶解到焊膏中 312,314）。 在焊锡膏（312,314）固化后，在所得到的圆角（212,214）和预成型件（210）之间形成具有逐渐变化的柔性材料浓度的混合区域（520,522）。 混合区域（520,522）将由电子组件（100）的热循环引起的温度引起的剪切应力从圆角（212,214）转移到柔性预制件（210）中。
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4.发明授权
公开(公告)号：US5045820A
公开(公告)日：1991-09-03
申请号：US624946
申请日：1990-12-10
申请人： John L. Leicht , Hugh R. Malone , Douglas J. Mathews , James E. Mitzlaff , Scott D. Munier , Michele G. Oehlerking , Vernon R. Scott
发明人： John L. Leicht , Hugh R. Malone , Douglas J. Mathews , James E. Mitzlaff , Scott D. Munier , Michele G. Oehlerking , Vernon R. Scott
CPC分类号： H01P5/107 , H05K1/024 , H05K1/119 , H01L2223/6633 , H01L2223/6683 , H01L2224/32245 , H01L2224/48227 , H01L2224/73265 , H05K1/0237 , H05K1/0284 , H05K1/182 , H05K2201/0715 , H05K2201/09045 , H05K2201/09118 , H05K2201/0999 , H05K2201/10371 , H05K3/42
摘要： A non-hermetic, three-dimensional, microwave semiconductor device carrier with integral waveguide couplers is disclosed. A molded plastic substrate having a suitable dielectric constant and varying thicknesses comprises plated conductors and locations for receiving GaAs MMIC's. MMIC's are mounted to a metal backplate and die bonded to the plated conductors. The waveguide couplers are integrally molded as part of the carrier substrate, and comprise plated through cylindrical members. Signals from a waveguide cavity are coupled to the MMIC's by inserting the waveguide couplers into a waveguide port. The carrier and integral waveguide coupler together with a plated molded cover forms a non-hermetic package providing pseudo-shielding cavities about the resident multiple semiconductor GaAs die. Transmission line impedance control is enhanced varying the substrate thickness on a per conductor basis. Frequency of operation exceeds 12 gigahertz.
摘要翻译： 公开了一种具有集成波导耦合器的非密封，三维微波半导体器件载体。 具有适当介电常数和变化厚度的模制塑料基板包括电镀导体和用于接收GaAs MMIC的位置。 MMIC安装在金属背板上，并与导体接合。 波导耦合器被一体地模制成承载基板的一部分，并且包括通过圆柱形构件的电镀。 通过将波导耦合器插入到波导端口中，来自波导腔的信号耦合到MMIC。 载体和整体波导耦合器与镀覆的模制盖一起形成非密封封装，在驻留的多个半导体GaAs裸片周围提供伪屏蔽腔。 增加传输线路阻抗控制，以每导体为基础改变衬底厚度。 工作频率超过12千兆赫兹。
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公开(公告)号：US5136135A
公开(公告)日：1992-08-04
申请号：US587206
申请日：1990-09-24
IPC分类号： B23K11/20
CPC分类号： B23K11/20
摘要： A method of welding two dissimilar metals of substantially different melting temperatures by passing an electric current through an interface created by biasing a projection located on the higher melting point metal into intimate contact with a surface located on the lower melting point material. The electrical current substantially liquifies a portion of only the second metal so that the projection is not substantially deformed by the welding operation.
摘要翻译： 通过使电流通过通过偏置位于较高熔点金属上的突起而形成的界面的电流来熔化具有实质上不同熔融温度的两种异种金属的方法，该位置与位于较低熔点材料上的表面紧密接触。 电流基本上液化仅第二金属的一部分，使得突起通过焊接操作基本上不变形。
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公开(公告)号：US4693209A
公开(公告)日：1987-09-15
申请号：US886462
申请日：1986-07-17
申请人： John L. Leicht
发明人： John L. Leicht
CPC分类号： H05K3/1233 , B23K3/06 , H05K3/1225 , H05K2203/0126
摘要： A solder paste dispensing assembly provides for the controlled application of a predetermined solder paste pattern to a surface. The surface can be on a printed circuit board, prior to or after the board is mounted onto an assembled product or it can be a portion of the product itself. The surface can be a planar or non-planar surface.
摘要翻译： 焊膏分配组件提供对表面的预定焊膏图案的受控应用。 在将板安装到组装的产品之前或之后，表面可以在印刷电路板上，或者它可以是产品本身的一部分。 表面可以是平面或非平面表面。
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