Abstract:
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer terminating in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.
Abstract:
A method of forming a printed circuit board or circuit card is provided with a metal layer which serves as a power plane sandwiched between a pair of photoimageable dielectric layers. Photoformed metal filled vias and photoformed plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials and connected to the vias and plated through holes. A border may be around the board or card including a metal layer terminating in from the edge of one of the dielectric layers. A copper foil is provided with clearance holes. First and second layers of photoimageable curable dielectric material is disposed on opposite sides of the copper which are photoimageable material. The patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. At the clearance holes in the copper, through holes are developed where holes were patterned in both dielectric layers. Thereafter, the surfaces of the photoimageable material, vias and through holes are metalized by copper plating. This is preferably done by protecting the remainder of the circuitry with photoresist and utilizing photolithographic techniques. The photoresist is thereafter removed, leaving a circuit board or card having metalization on both sides, vias extending from both sides to the copper layer in the center, plated through holes connecting the two outer circuitized copper layers.
Abstract:
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer termination in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.
Abstract:
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer terminating in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.
Abstract:
An invention that automatically reports and collects security surveillance problems, device problems, device status, device diagnostics and device state information from cameras and security detection equipment. Devices may be attached to a computer network or attached through a device controller on a computer network but are not limited to only that topology. The device or the controller monitors the operation of devices and tracks any status, failures, intrusions or operational irregularities. Each detected occurrence is either recorded at the device or controller for later reporting or reported immediately to network administration centers. As much diagnostic information as possible is collected, recorded and reported. The device or the controller may also keep track of trend information and report that as well. The administration center collects the information and produces alerts and notifications as configured. These alerts and notifications may not be related to a single problem or intrusion but may be based on trend or diagnostic information. In addition the administration center analyzes the collected information and reports on intrusions, problems or other information of interest to a security system. Special charts, graphs, histogram and other reports are produced by the system to aid in proactive diagnosis, problem prediction and behavior patterns. The system produces predictive information based on trend and periodic information to alert operators of potential upcoming problems and behavior. The data and reports are available for viewing from a range of display devices that includes desktop computers (workstations and servers), laptops computers, notebook computers, cell phones, handhelds, PDAs, etc.
Abstract:
An invention that enables the use of human speech to remotely access, interrogate, control and obtain real time information from security devices in a facility or location. Wireless, or other network connectivity, mobile devices are used as the voice recognition system. These devices interface to a management system located at the facility or location under surveillance. The user is able to view the mobile display device and command the system using human voice. The system supports detecting and tracking security intrusions, controlling the security devices at the location, requesting changes to the display, obtaining status information of the system or any device, and communicating to others that may be accessing the system jointly. The invention also uses hierarchical maps to quickly identify security problems within an enterprise. The system uses real-time altered icons or element pictures that identify the status of that element at a quick glance. The organized use of hierarchical maps to quickly traverse to and identify particular security problems to include intrusions, alarms, failures, pending failures, etc. Intruder movement is also automatically tracked on or between maps.
Abstract:
A method of forming a printed circuit board or circuit card is provided with a metal layer which serves as a power plane sandwiched between a pair of photoimageable dielectric layers. Photoformed metal filled vias and photoformed plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials and connected to the vias and plated through holes. A border may be around the board or card including a metal layer terminating in from the edge of one of the dielectric layers. A copper foil is provided with clearance holes. First and second layers of photoimageable curable dielectric material is disposed on opposite sides of the copper which are photoimageable material. The patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. At the clearance holes in the copper, through holes are developed where holes were patterned in both dielectric layers. Thereafter, the surfaces of the photoimageable material, vias and through holes are metalized by copper plating. This is preferably done by protecting the remainder of the circuitry with photoresist and utilizing photolithographic techniques. The photoresist is thereafter removed, leaving a circuit board or card having metalization on both sides, vias extending from both sides to the copper layer in the center, plated through holes connecting the two outer circuitized copper layers.