ORGANIC EL DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
    1.
    发明申请
    ORGANIC EL DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
    有机EL显示装置及其制造方法

    公开(公告)号:US20080164810A1

    公开(公告)日:2008-07-10

    申请号:US11968836

    申请日:2008-01-03

    IPC分类号: H01L51/54 H01L51/56

    摘要: An organic EL display device includes a glass substrate and a flattening film arranged above the glass substrate. A plurality of anodes are arranged on a surface of the flattening film. A plurality of organic EL layers are arranged on a surface of the anodes. The flattening film has irregularities formed in at least a partial surface in a region outside a region where the plurality of organic EL layers are arranged. According to such a structure, an organic EL display device in which remaining of moisture in an insulating film is suppressed can be provided.

    摘要翻译: 有机EL显示装置包括玻璃基板和布置在玻璃基板上方的平坦化膜。 多个阳极布置在平坦化膜的表面上。 多个有机EL层布置在阳极的表面上。 平坦化膜在布置多个有机EL层的区域外的区域中的至少部分表面中形成有凹凸。 根据这样的结构,可以提供抑制绝缘膜中的水分残留的有机EL显示装置。

    Method of manufacturing semiconductor device
    2.
    发明授权
    Method of manufacturing semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US06544904B1

    公开(公告)日:2003-04-08

    申请号:US10157882

    申请日:2002-05-31

    IPC分类号: H01L2131

    摘要: A method of manufacturing a semiconductor device is provided, which prevents a polyimide film from coming unstuck from a film to be subjected to isotropic etching, and further prevents deposits adhered to respective side faces of the films from coming off, during a heat treatment for imidizing the polyimide film. Isotropic etching is performed on a silicon nitride film 4 using, as a mask, a polyimide film 5 having a predetermined pattern formed therein. Next, a heat treatment is carried out to imidize the polyimide film 5 prior to performing anisotropic etching on a silicon oxide film 3. During the heat treatment for imidizing the polyimide film 5, since deposits, which are to be generated by anisotropic etching, are not yet adhered to the respective side faces of the films, the polyimide film 5 does not come unstuck from the silicon nitride film 4. Further, the deposits which are adhered to the respective side face of the films after the heat treatment will not come off.

    摘要翻译: 提供一种制造半导体器件的方法,其防止聚酰亚胺膜从薄膜脱落以进行各向同性蚀刻,并且进一步防止在用于酰亚胺化的热处理期间粘附到膜的各个侧面的沉积物脱落 聚酰亚胺薄膜。 在氮化硅膜4上进行各向同性蚀刻,使用形成有预定图案的聚酰亚胺膜5作为掩模。 接下来,在对氧化硅膜3进行各向异性蚀刻之前,进行热处理以对聚酰亚胺膜5进行酰亚胺化。在酰亚胺化聚酰亚胺膜5的热处理中,由于通过各向异性蚀刻产生的沉积物为 还没有粘附到膜的各个侧面,聚酰亚胺膜5不会从氮化硅膜4脱落。此外,附着在热处理后的膜的相应侧面的沉积物将不会脱落 。

    Semiconductor device and manufacturing method thereof
    5.
    发明授权
    Semiconductor device and manufacturing method thereof 失效
    半导体装置及其制造方法

    公开(公告)号:US06645859B1

    公开(公告)日:2003-11-11

    申请号:US10170579

    申请日:2002-06-14

    IPC分类号: H01L2144

    摘要: A manufacturing method of a semiconductor device allowing successful filling of an insulating film by HDP-CVD (High Density Plasma-Chemical Vapor Deposition) in a gap or valley between densely placed interconnections is provided. The method includes the steps of forming semiconductor elements on a semiconductor substrate, forming on the semiconductor elements a plurality of interconnections with top protective layers side by side to electrically connect the semiconductor elements, forming a protective insulating film by CVD other than HDP-CVD to cover top and side surfaces of the interconnections and a bottom surface of a gap between the interconnections, and forming an insulating film by HDP-CVD to cover the protective insulating film and to fill in the gap between the interconnections covered with the protective insulating film.

    摘要翻译: 提供了通过HDP-CVD(高密度等离子体 - 化学气相沉积)在密集布置的互连之间的间隙或谷中成功地填充绝缘膜的半导体器件的制造方法。 该方法包括以下步骤:在半导体衬底上形成半导体元件,在半导体元件上形成与顶部保护层并排的多个互连以电连接半导体元件,通过除HDP-CVD之外的CVD形成保护绝缘膜以形成保护绝缘膜 互连的顶盖和侧表面以及互连之间的间隙的底表面,并且通过HDP-CVD形成绝缘膜以覆盖保护绝缘膜并填充被保护绝缘膜覆盖的互连之间的间隙。

    Method of controlling electrode force of spot welding gun
    6.
    发明授权
    Method of controlling electrode force of spot welding gun 失效
    控制点焊枪电极力的方法

    公开(公告)号:US5988486A

    公开(公告)日:1999-11-23

    申请号:US28459

    申请日:1998-02-24

    摘要: In a spot welding gun which is made up of a gun main body which is operated for equalization by a driving source, a stationary electrode tip which is immovable relative to the gun main body, and a movable electrode tip which is connected to a pressing source, both electrode tips are pressed to a workpiece with an even force, to thereby perform a high quality spot welding. The driving source is controlled such that the electrode force of the stationary electrode tip, by the driving source, to the workpiece becomes substantially zero. In this manner, there occurs no difference in the electrode forces by both the electrode tips to the workpiece.

    摘要翻译: 在由用于由驱动源均衡的枪主体构成的点焊枪中,相对于枪主体不动的固定电极头和与压力源连接的可动电极头 两个电极头以均匀的力压在工件上,从而进行高质量的点焊。 驱动源受到控制,使得固定电极头的驱动源对工件的电极力基本上为零。 以这种方式,电极尖端与工件的电极力没有差别。