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1.发明授权Method of manufacture of ceramic composite wiring structures for semiconductor devices 失效半导体器件陶瓷复合布线结构的制造方法公开(公告)号：US07047637B2
公开(公告)日：2006-05-23
申请号：US10824723
申请日：2004-04-15
CPC分类号： H01L21/4807 , B32B15/00 , H01L21/4857 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49833 , H01L23/642 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68377 , H01L2224/16 , H01L2224/16225 , H01L2224/45147 , H01L2224/48472 , H01L2224/49175 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K1/0207 , H05K1/0271 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K3/4007 , H05K3/46 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/09118 , H05K2203/0369 , H05K2203/1476 , Y10S428/901 , Y10T29/43 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T29/49171 , Y10T428/24917 , H01L2924/00 , H01L2924/00014
摘要： Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.
摘要翻译： 一种与至少一个半导体器件一起使用的复合布线结构的制造方法，该结构具有第一导电部件，半导体器件可以安装在该第一导电部件上以与其电连接。 由陶瓷或有机陶瓷复合材料制成的电介质构件被结合到第一导电构件并且包含嵌入其中的导电网络和热分配网络。 第二导电构件可以与复合布线结构结合，电容器电连接在导电网络和第二导电构件之间。 电介质构件和导电构件之间的接合可以是在不足以不利地影响导电网络和热分布网络的结构完整性的温度下形成的直接共价键的形式。
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2.发明授权Ceramic composite wiring structures for semiconductor devices and method of manufacture 失效用于半导体器件的陶瓷复合布线结构及其制造方法公开(公告)号：US06323549B1
公开(公告)日：2001-11-27
申请号：US09344682
申请日：1999-06-25
IPC分类号： H01L2306
CPC分类号： H01L21/4807 , B32B15/00 , H01L21/4857 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49833 , H01L23/642 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68377 , H01L2224/16 , H01L2224/16225 , H01L2224/45147 , H01L2224/48472 , H01L2224/49175 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K1/0207 , H05K1/0271 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K3/4007 , H05K3/46 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/09118 , H05K2203/0369 , H05K2203/1476 , Y10S428/901 , Y10T29/43 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T29/49171 , Y10T428/24917 , H01L2924/00 , H01L2924/00014
摘要： A composite wiring structure (10) for use with at least one semiconductor device (16). The composite wiring structure having a first conductive member (12) upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member (20), made of ceramic or organo-ceramic composite material, is bonded to the first conductive member (12) and contains embedded therein a conductive network (24) and a thermal distribution network (26). A second conductive member (32) may be incorporated with the composite wiring structure, with a capacitor (64) being electrically connected between the conductive network (24) and the second conductive member (32). Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.
摘要翻译： 一种与至少一个半导体器件（16）一起使用的复合布线结构（10）。 复合布线结构具有第一导电构件（12），半导体器件可以安装在其上以与其电连接。 由陶瓷或有机陶瓷复合材料制成的电介质构件（20）被结合到第一导电构件（12）上并且包含嵌入其中的导电网络（24）和热分布网络（26）。 第二导电构件（32）可以与复合布线结构结合，电容器（64）电连接在导电网络（24）和第二导电构件（32）之间。 电介质构件和导电构件之间的接合可以是在不足以不利地影响导电网络和热分布网络的结构完整性的温度下形成的直接共价键的形式。
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3.发明授权Metal ceramic composites with improved interfacial properties and methods to make such composites 失效具有改进的界面性质的金属陶瓷复合材料和制备这种复合材料的方法
公开(公告)号：US5707715A
公开(公告)日：1998-01-13
申请号：US697739
申请日：1996-08-29
IPC分类号： H01L23/14 , H01L23/373 , H05K1/02 , H05K1/03 , H05K3/00 , H05K3/38 , B32B3/00 , B32B15/00 , H01L29/12
CPC分类号： H05K1/0271 , H01L23/142 , H01L23/3735 , H05K3/38 , H01L2221/68377 , H01L2224/45124 , H01L2224/48472 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/01025 , H01L2924/01077 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/3025 , H05K1/0272 , H05K1/0306 , H05K3/0061 , Y10S428/901 , Y10T428/12493 , Y10T428/12528 , Y10T428/24917 , Y10T428/24926
摘要： A metal-ceramic composite comprised of a metal member bonded to a ceramic oxide member through a covalent bond formed at temperatures less than 880.degree. C., and metal-ceramic composites that are so constructed that to control internal stress or increase crack-resistance within the ceramic member under applied thermal or mechanical loads to the composite, such composite with ferrite or alumina bonded sets of such metal-ceramic computers and end use devices including printed circuit boards, EMI shields and higher level assemblies including such devices.
摘要翻译： 金属陶瓷复合材料是通过在低于880℃的温度下形成的共价键结合到陶瓷氧化物构件上的金属陶瓷复合材料，以及金属陶瓷复合材料，其结构使得能够控制内部应力或增加抗裂性 陶瓷构件在对复合材料施加热或机械载荷的情况下，这种复合材料具有这种金属陶瓷计算机的铁氧体或氧化铝粘结的组以及包括印刷电路板，EMI屏蔽和包括这种装置的更高级组件的最终用途装置。
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4.发明申请Method of manufacture of ceramic composite wiring structures for semiconductor devices 失效半导体器件陶瓷复合布线结构的制造方法公开(公告)号：US20020031918A1
公开(公告)日：2002-03-14
申请号：US09990615
申请日：2001-11-21
IPC分类号： H01L021/31
CPC分类号： H01L21/4807 , B32B15/00 , H01L21/4857 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49833 , H01L23/642 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68377 , H01L2224/16 , H01L2224/16225 , H01L2224/45147 , H01L2224/48472 , H01L2224/49175 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K1/0207 , H05K1/0271 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K3/4007 , H05K3/46 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/09118 , H05K2203/0369 , H05K2203/1476 , Y10S428/901 , Y10T29/43 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T29/49171 , Y10T428/24917 , H01L2924/00 , H01L2924/00014
摘要： A method of manufacture of a composite wiring structure for use with at least one semiconductor device. The composite wiring structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member (may be incorporated with the composite wiring structure, with a capacitor being electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.
摘要翻译： 一种制造与至少一个半导体器件一起使用的复合布线结构的方法。 复合布线结构具有第一导电构件，半导体器件可以安装在第一导电构件上以与其电连接。 由陶瓷或有机陶瓷复合材料制成的电介质构件被结合到第一导电构件并且包含嵌入其中的导电网络和热分配网络。 第二导电构件（可以与复合布线结构结合，电容器电连接在导电网络和第二导电构件之间）。电介质构件和导电构件之间的结合可以是形成直接共价键的形式 在不足以不利地影响导电网络和热分布网络的结构完整性的温度下。
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公开(公告)号：US08350657B2
公开(公告)日：2013-01-08
申请号：US11620042
申请日：2007-01-04
CPC分类号： H01F27/2804 , B82Y30/00 , C04B2235/768 , C04B2235/781 , H01C7/003 , H01C17/003 , H01C17/06533 , H01F3/00 , H01F5/003 , H01F27/24 , H01F27/29 , H01F27/40 , H01F41/041 , H01F2027/2809 , H01G4/10 , H01G4/33 , H01L23/64 , H01L28/10 , H01L2224/16 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01037 , H01L2924/01057 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/3011 , H01L2924/3025 , H05K1/0298 , H05K1/092 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/207 , H05K2201/017 , H05K2201/0175 , H05K2201/09763 , H05K2203/016 , H05K2203/0338 , H05K2203/121 , Y10T29/49021
摘要： A power management module, provides an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element including one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout the ceramic element.
摘要翻译： 电源管理模块提供一种电感器，其包括设置在铁磁性陶瓷元件周围的一个或多个电导体，所述铁磁陶瓷元件包括在整个陶瓷元件中具有小于或等于1.50摩尔％的金属氧化物组成均匀性波动的一种或多种金属氧化物。
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6.发明申请Method of manufacture of ceramic composite wiring structures for semiconductor devices 失效半导体器件陶瓷复合布线结构的制造方法公开(公告)号：US20040194305A1
公开(公告)日：2004-10-07
申请号：US10824723
申请日：2004-04-15
IPC分类号： H01L023/06 , H05K003/30
CPC分类号： H01L21/4807 , B32B15/00 , H01L21/4857 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49833 , H01L23/642 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68377 , H01L2224/16 , H01L2224/16225 , H01L2224/45147 , H01L2224/48472 , H01L2224/49175 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K1/0207 , H05K1/0271 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K3/4007 , H05K3/46 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/09118 , H05K2203/0369 , H05K2203/1476 , Y10S428/901 , Y10T29/43 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T29/49171 , Y10T428/24917 , H01L2924/00 , H01L2924/00014
摘要： Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member (may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.
摘要翻译： 一种与至少一个半导体器件一起使用的复合布线结构的制造方法，该结构具有第一导电部件，半导体器件可以安装在该第一导电部件上以与其电连接。 由陶瓷或有机陶瓷复合材料制成的电介质构件被结合到第一导电构件并且包含嵌入其中的导电网络和热分配网络。 第二导电构件（可以与复合布线结构结合，电容器电连接在导电网络和第二导电构件之间）。电介质构件和导电构件之间的接合可以是直接共价键的形式，形成在 温度不足以不利地影响导电网络和热分布网络的结构完整性。
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7.发明授权Method of manufacture of ceramic composite wiring structures for semiconductor devices 失效半导体器件陶瓷复合布线结构的制造方法公开(公告)号：US06742249B2
公开(公告)日：2004-06-01
申请号：US09990615
申请日：2001-11-21
IPC分类号： H05K330
CPC分类号： H01L21/4807 , B32B15/00 , H01L21/4857 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L23/49822 , H01L23/49833 , H01L23/642 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68377 , H01L2224/16 , H01L2224/16225 , H01L2224/45147 , H01L2224/48472 , H01L2224/49175 , H01L2924/01039 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/3025 , H01L2924/3511 , H05K1/0207 , H05K1/0271 , H05K1/0272 , H05K1/0306 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K3/4007 , H05K3/46 , H05K3/4629 , H05K3/4641 , H05K2201/0355 , H05K2201/09118 , H05K2203/0369 , H05K2203/1476 , Y10S428/901 , Y10T29/43 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T29/49171 , Y10T428/24917 , H01L2924/00 , H01L2924/00014
摘要： Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.
摘要翻译： 一种与至少一个半导体器件一起使用的复合布线结构的制造方法，该结构具有第一导电部件，半导体器件可以安装在该第一导电部件上以与其电连接。 由陶瓷或有机陶瓷复合材料制成的电介质构件被结合到第一导电构件并且包含嵌入其中的导电网络和热分配网络。 第二导电构件可以与复合布线结构结合，电容器电连接在导电网络和第二导电构件之间。 电介质构件和导电构件之间的接合可以是在不足以不利地影响导电网络和热分布网络的结构完整性的温度下形成的直接共价键的形式。
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