公开(公告)号：US07223981B1

公开(公告)日：2007-05-29

申请号：US10725442

申请日：2003-12-03

Applicant: M. Albert Capote ,  Howard A. Lenos

Inventor： M. Albert Capote ,  Howard A. Lenos

IPC: H01L25/00

CPC classification number: H01L27/14634 ,  H01L27/14636 ,  H01L27/14658 ,  H01L27/1469 ,  H01L31/0296

Abstract: A radiation detector assembly has a semiconductor detector array substrate of CdZnTe or CdTe, having a plurality of detector cell pads on a first surface thereof, the pads having a contact metallization and a solder barrier metallization. An interposer card has planar dimensions no larger than planar dimensions of the semiconductor detector array substrate, a plurality of interconnect pads on a first surface thereof, at least one readout semiconductor chip and at least one connector on a second surface thereof, each having planar dimensions no larger than the planar dimensions of the interposer card. Solder columns extend from contacts on the interposer first surface to the plurality of pads on the semiconductor detector array substrate first surface, the solder columns having at least one solder having a melting point or liquidus less than 120 degrees C. An encapsulant is disposed between the interposer circuit card first surface and the semiconductor detector array substrate first surface, encapsulating the solder columns, the encapsulant curing at a temperature no greater than 120 degrees C.

Abstract translation: 辐射检测器组件具有CdZnTe或CdTe的半导体检测器阵列基板，其在其第一表面上具有多个检测器单元焊盘，该焊盘具有接触金属化和阻焊金属化。 插入卡具有不大于半导体检测器阵列基板的平面尺寸的平面尺寸，在其第一表面上的多个互连焊盘，至少一个读出半导体芯片和在其第二表面上的至少一个连接器，每个具有平面尺寸 不大于插入卡的平面尺寸。 焊料柱从插入器第一表面上的触点延伸到半导体检测器阵列基板第一表面上的多个焊盘，焊料柱具有至少一种焊点，其熔点或液相线小于120℃。密封剂设置在 内插器电路卡第一表面和半导体检测器阵列基板第一表面，封装焊料柱，密封剂固化在不超过120摄氏度的温度。

公开(公告)号：US6017634A

公开(公告)日：2000-01-25

申请号：US012382

申请日：1998-01-23

Applicant: M. Albert Capote ,  Liqui Zhou ,  Xioqui Zhu

Inventor： M. Albert Capote ,  Liqui Zhou ,  Xioqui Zhu

IPC: B23K35/34 ,  B23K35/02 ,  B23K35/36 ,  B32B7/12 ,  C08G59/40 ,  C09D11/10 ,  C09J4/00 ,  C09J4/02 ,  H01B1/02 ,  H01B1/06 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H05K1/09 ,  H05K3/32 ,  B32B27/04 ,  B32B27/38 ,  C08L63/10

CPC classification number: C09J4/00 ,  B23K35/025 ,  B23K35/3613 ,  B23K35/3618 ,  B32B7/12 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/095 ,  H05K3/321 ,  Y10S428/901 ,  Y10T428/31515 ,  Y10T428/31522

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces. Alternatively, a solder paste, comprising solder powder mixed with the fluxing agent of the present invention can be used. During the reflow step, the fluxing agent promotes wetting of the solder to the metallization patterns and, simultaneously, the fluxing agent itself crosslinks to mechanically bond and encapsulate the surfaces and their metallizations. The compositions can also be used to formulate sinterable conductive ink.

Abstract translation: 本发明提供一种包含还可作为粘合剂使用的助熔剂的热固性粘合剂组合物。 组合物包括：（a）由式RCOOH表示的助熔剂，其中R包含具有两个或更多个碳 - 碳双键的部分，其中在一个实施方案中，至少一个在丙烯酸酯或甲基丙烯酸酯基团内，并且其还可以进一步 含有至少一个芳族部分; （b）羧酸中和剂; （c）任选地，可交联的稀释剂; （d）任选的自由基引发剂源; 和（e）任选的树脂。 组合物可以直接施加到要电连接和机械连接的装置的表面上。 这些装置包括印刷电路基板，连接器，部件，电缆以及具有通过在一个或两个表面上通过焊料凸起图案焊接在一起的金属化图案的其它电气装置。 或者，可以使用包含与本发明的助熔剂混合的焊料粉末的焊膏。 在回流步骤期间，助熔剂促进焊料对金属化图案的润湿，同时，助熔剂本身交联以机械地结合并包封表面及其金属化。 组合物也可用于配制可烧结导电油墨。

公开(公告)号：US5853622A

公开(公告)日：1998-12-29

申请号：US704467

申请日：1996-08-28

Applicant: Catherine Gallagher ,  Goran Matijasevic ,  M. Albert Capote

Inventor： Catherine Gallagher ,  Goran Matijasevic ,  M. Albert Capote

IPC: B23K35/02 ,  B23K35/36 ,  H01B1/22 ,  H01L23/498 ,  H01L23/538 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  C21B3/02

CPC classification number: B22F3/1035 ,  B23K35/0222 ,  B23K35/36 ,  H01B1/22 ,  H01L23/49827 ,  H01L23/49883 ,  H01L23/5384 ,  H05K3/321 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K3/3489 ,  H05K3/4069 ,  H05K3/4623

Abstract: An inventive method for electrical and thermal electronic component attachment is disclosed. The combination of transient liquid phase sintering (TLPS) and a permanent adhesive flux binder provides the advantages of both conventional soldering technology and conductive adhesives. This hybrid approach delivers electrical and thermal conduction through sintered metal joints and mechanical properties based on a tailorable polymer matrix. These transient liquid phase sintering conductive adhesives can utilize conventional dispensing, placement, and processing equipment. During the reflow process, metal powders in the composition undergo interparticle sintering as well as alloying to the contact pads. This process produces a strong mechanical, thermal, and electrical interconnect which ensures good conductivity that is also resistant to humidity and temperature cycling.

Abstract translation: 公开了用于电气和热电子部件附接的创新方法。 瞬态液相烧结（TLPS）和永久粘合剂粘合剂的组合提供了常规焊接技术和导电粘合剂的优点。 这种混合方法通过烧结金属接头和基于可裁剪聚合物基体的机械性能提供电和热传导。 这些瞬态液相烧结导电粘合剂可以利用常规的分配，放置和加工设备。 在回流工艺期间，组合物中的金属粉末经过颗粒间烧结以及与接触焊盘的合金化。 该过程产生强大的机械，热和电互连，确保良好的导电性，同时也耐湿度和温度循环。

公开(公告)号：US5948533A

公开(公告)日：1999-09-07

申请号：US813809

申请日：1997-03-06

Applicant: Catherine A. Gallagher ,  Goran S. Matijasevic ,  Pradeep Gandhi ,  M. Albert Capote

Inventor： Catherine A. Gallagher ,  Goran S. Matijasevic ,  Pradeep Gandhi ,  M. Albert Capote

IPC: H05K1/11 ,  B23K35/02 ,  H01B1/22 ,  H01L23/498 ,  H01L23/538 ,  H05K1/09 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H01B1/02

CPC classification number: H05K3/462 ,  B23K35/0222 ,  H01L23/49827 ,  H01L23/49883 ,  H01L23/5384 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H01L2224/293 ,  H01L2924/01079 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K3/3489 ,  H05K3/4623 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31681

Abstract: In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.

Abstract translation: 根据本发明，提供了因此有用的新颖的垂直互连组件和组合物。 本发明组件包括具有多层电子组件的基板。 多层包括由选择性地涂覆和/或填充有瞬态液相烧结（TLPS）材料的电介质材料分离和粘附的各层电路。 TLPS被配制为导电的，从而用于在电路层之间传送电流。 此外，TLPS易于工作，因此它可以自动化，逐步构建多层电路，而无需劳动密集型钻孔和填充导电通孔。

公开(公告)号：US07531809B2

公开(公告)日：2009-05-12

申请号：US11783505

申请日：2007-04-10

Applicant: M. Albert Capote ,  Howard A. Lenos

Inventor： M. Albert Capote ,  Howard A. Lenos

IPC: H01L25/00

CPC classification number: H01L27/14634 ,  H01L27/14636 ,  H01L27/14658 ,  H01L27/1469 ,  H01L31/0296

Abstract: A radiation detector assembly has a semiconductor detector array substrate of CdZnTe or CdTe, having a plurality of detector cell pads on a first surface thereof, the pads having a contact metallization and a solder barrier metallization. An interposer card has planar dimensions no larger than planar dimensions of the semiconductor detector array substrate, a plurality of interconnect pads on a first surface thereof, at least one readout semiconductor chip and at least one connector on a second surface thereof, each having planar dimensions no larger than the planar dimensions of the interposer card. Solder columns extend from contacts on the interposer first surface to the plurality of pads on the semiconductor detector array substrate first surface, the solder columns having at least one solder having a melting point or liquidus less than 120 degrees C. An encapsulant is disposed between the interposer circuit card first surface and the semiconductor detector array substrate first surface, encapsulating the solder columns, the encapsulant curing at a temperature no greater than 120 degrees C.

Abstract translation: 辐射检测器组件具有CdZnTe或CdTe的半导体检测器阵列基板，其在其第一表面上具有多个检测器单元焊盘，该焊盘具有接触金属化和阻焊金属化。 插入卡具有不大于半导体检测器阵列基板的平面尺寸的平面尺寸，在其第一表面上的多个互连焊盘，至少一个读出半导体芯片和在其第二表面上的至少一个连接器，每个具有平面尺寸 不大于插入卡的平面尺寸。 焊料柱从插入器第一表面上的触点延伸到半导体检测器阵列基板第一表面上的多个焊盘，焊料柱具有至少一种焊点，其熔点或液相线小于120℃。密封剂设置在 内插器电路卡第一表面和半导体检测器阵列基板第一表面，封装焊料柱，密封剂固化在不超过120摄氏度的温度。