公开(公告)号：US07502831B1

公开(公告)日：2009-03-10

申请号：US12045415

申请日：2008-03-10

申请人： Mike V. Macias ,  Salil Pradeep Gandhi ,  Saidas Tukaram Kottawar ,  Dhaval K. Shah ,  Sandip Dnyaneshwar Mahajan

发明人： Mike V. Macias ,  Salil Pradeep Gandhi ,  Saidas Tukaram Kottawar ,  Dhaval K. Shah ,  Sandip Dnyaneshwar Mahajan

IPC分类号： G06F15/16

CPC分类号： H04L51/04

摘要： An embodiment provides a flexible way to categorize instant messages (IM) or instant data by segmenting them. The default category would be viewable and/or readable as currently is with no change. However, those categories which are categorized as CONFIDENTIAL and/or PERSONAL would be displayed in a hidden form. The invention is demonstrated using a CONFIDENTIAL category; however, the invention is not limited to just CONFIDENTIAL category as it can be applied to other categories as well, such as INFORMATIONAL. An embodiment of the invention allows users to view CONFIDENTIAL informational in private and data would be hidden on the receiving end until a request to un-hide is made by the receiver.

摘要翻译： 实施例提供了通过分割即时消息（IM）或即时数据来分类的灵活方式。 默认类别是可视的和/或可读的，因为当前没有变化。 但是，分类为机密和/或个人的类别将以隐藏的形式显示。 本发明使用机密类别进行演示; 然而，本发明不仅限于机密类别，因为它也可以应用于其他类别，例如INFORMATIONAL。 本发明的一个实施例允许用户私有地查看保密信息，并且数据将被隐藏在接收端，直到接收者进行不隐藏的请求。

公开(公告)号：US07502830B1

公开(公告)日：2009-03-10

申请号：US12045367

申请日：2008-03-10

申请人： Mike V. Macias ,  Sandip Dnyaneshwar Mahajan ,  Salil Pradeep Gandhi ,  Saidas Tukaram Kottawar

发明人： Mike V. Macias ,  Sandip Dnyaneshwar Mahajan ,  Salil Pradeep Gandhi ,  Saidas Tukaram Kottawar

IPC分类号： G06F15/16 ,  G06F15/173

CPC分类号： H04L51/04 ,  H04L51/24

摘要： One example of this system provides the ability to setup a two-way alert notification within an IM system. All parties can negotiate on how they set up the alert and what to do when it sets off. One of the approaches presented in this invention is to modify the basic functionality of existing alert notifications, in such a way that it allows the targeted remote user to become aware that an alert has been set to report the change in his/her availability status, and enables this remote user to respond. A popup message on the targeted user's side notifies the user of this alert event.

摘要翻译： 该系统的一个示例提供了在IM系统内设置双向警报通知的能力。 所有各方都可以就如何设置警报进行协商，以及在起飞时该做什么。 本发明中提出的方法之一是修改现有警报通知的基本功能，使得其允许目标远程用户意识到已经设置警报以报告他/她的可用性状态的改变， 并使此远程用户能够响应。 目标用户端的弹出消息通知用户此警报事件。

公开(公告)号：US5922397A

公开(公告)日：1999-07-13

申请号：US816401

申请日：1997-03-03

申请人： Lutz Brandt ,  Pradeep Gandhi ,  Bryan Shearer

发明人： Lutz Brandt ,  Pradeep Gandhi ,  Bryan Shearer

IPC分类号： C23C18/16 ,  C25D5/54 ,  H05K1/09 ,  H05K3/24 ,  B05D5/12

CPC分类号： H05K3/246 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1651 ,  C25D5/54 ,  H05K1/095

摘要： In accordance with the present invention, it has been discovered that conductive traces made from transient liquid phase sintering (TLPS) pastes, plated by electroless or electrolytic means, result in improved solderability, adhesion and conductivity of the circuitry. Transient liquid phase sintering pastes employed in the practice of the present invention differ from conventional metal loaded polymer thick film (PTF) inks in that they contain, in addition to a binder, they also contain both a relatively high melting metal powder and a relatively low melting solder powder capable of forming a continuous intermetallic/metallic phase after sintering. The present invention is particularly useful, for example, for the fabrication of single and multi-layer printed circuit boards, providing horizontal and vertical conductive interconnects, metallized through-holes, and conductive pads for electronic component attachment.

摘要翻译： 根据本发明，已经发现，由通过无电解或电解方法电镀的瞬态液相烧结（TLPS）糊料制成的导电迹线导致电路的可焊性，粘附性和导电性的改善。 在本发明的实践中使用的瞬态液相烧结浆料与常规的金属负载聚合物厚膜（PTF）油墨不同之处在于，除了粘合剂之外，它们还含有相对较高的熔融金属粉末和相对低的 能够在烧结后形成连续的金属间/金属相的熔融焊料粉末。 本发明特别有用，例如用于制造单层和多层印刷电路板，提供水平和垂直导电互连，金属化通孔和用于电子元件连接的导电焊盘。

公开(公告)号：US5948533A

公开(公告)日：1999-09-07

申请号：US813809

申请日：1997-03-06

申请人： Catherine A. Gallagher ,  Goran S. Matijasevic ,  Pradeep Gandhi ,  M. Albert Capote

发明人： Catherine A. Gallagher ,  Goran S. Matijasevic ,  Pradeep Gandhi ,  M. Albert Capote

IPC分类号： H05K1/11 ,  B23K35/02 ,  H01B1/22 ,  H01L23/498 ,  H01L23/538 ,  H05K1/09 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H01B1/02

CPC分类号： H05K3/462 ,  B23K35/0222 ,  H01L23/49827 ,  H01L23/49883 ,  H01L23/5384 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H01L2224/293 ,  H01L2924/01079 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1105 ,  H05K3/3489 ,  H05K3/4623 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31681

摘要： In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.

摘要翻译： 根据本发明，提供了因此有用的新颖的垂直互连组件和组合物。 本发明组件包括具有多层电子组件的基板。 多层包括由选择性地涂覆和/或填充有瞬态液相烧结（TLPS）材料的电介质材料分离和粘附的各层电路。 TLPS被配制为导电的，从而用于在电路层之间传送电流。 此外，TLPS易于工作，因此它可以自动化，逐步构建多层电路，而无需劳动密集型钻孔和填充导电通孔。

公开(公告)号：US06716036B2

公开(公告)日：2004-04-06

申请号：US10147371

申请日：2002-05-15

申请人： Pradeep Gandhi

发明人： Pradeep Gandhi

IPC分类号： H01R1200

CPC分类号： H01R13/665 ,  H01R13/035 ,  H05K1/0284 ,  H05K1/095 ,  H05K1/119 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/09118 ,  H05K2201/10303 ,  H05K2201/10977

摘要： Disclosed are electrical connector devices with integrated electronic components, including magnetic devices. The electronic components integrated into the connector are electrically connected to one another and the connector pins by an electrically conductive circuit formed directly on the connector housing. Formation of the electrically conductive circuit directly on the connector housing substantially reduces the number of assembly steps required to manufacture the connector.

摘要翻译： 公开了具有集成电子部件的电连接器装置，包括磁性装置。 集成到连接器中的电子部件通过直接形成在连接器壳体上的导电电路彼此电连接并且连接器引脚。 直接在连接器外壳上形成导电电路大大减少了制造连接器所需的组装步骤数量。

公开(公告)号：US6085415A

公开(公告)日：2000-07-11

申请号：US123563

申请日：1998-07-27

申请人： Pradeep Gandhi ,  Samuel Fu ,  Gary E. Legerton ,  Daniel E. Baxter ,  William C. Robinette

发明人： Pradeep Gandhi ,  Samuel Fu ,  Gary E. Legerton ,  Daniel E. Baxter ,  William C. Robinette

IPC分类号： H01L21/48 ,  H05K3/06 ,  H05K3/44 ,  H05K3/46 ,  H01K3/10

CPC分类号： H01L21/486 ,  H05K3/445 ,  H05K2201/0215 ,  H05K2201/0281 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/1476 ,  H05K3/06 ,  H05K3/4608 ,  Y10T156/1057 ,  Y10T29/49126 ,  Y10T29/49165

摘要： Methods for the production of insulated, conductive through-features in conductive core materials for electronics packaging are disclosed. Invention methods employ protective mask technology in order to facilitate the selective removal of material from planar conductive core material that has been encapsulated in electrically insulated materials. By filling the cavity in the conductive core material with an electrically insulated material, the through-feature is electrically isolated from the remainder of the core material. In this manner, a conductive through-feature that completely transverses the core of the substrate board is created. Also provided are planar substrates for multilayer printed circuit boards, or chip carriers, comprising the conductive through-features produced by invention methods.

摘要翻译： 公开了用于生产用于电子封装的导电芯材料中的绝缘导电通孔的方法。 本发明的方法采用保护掩模技术，以便于材料从已被封装在电绝缘材料中的平面导电芯材料中选择性地去除。 通过用电绝缘材料将导电芯材料中的空腔填充，通孔特征与芯材料的其余部分电隔离。 以这种方式，产生完全横穿基板的芯的导电贯穿特征。 还提供了用于多层印刷电路板或芯片载体的平面基板，其包括通过发明方法产生的导电通孔。

公开(公告)号：US5980785A

公开(公告)日：1999-11-09

申请号：US942368

申请日：1997-10-02

申请人： Xiaomei Xi ,  Sam Fu ,  Goran Matijavesic ,  Lutz Brandt ,  Catharine Gallagher ,  Pradeep Gandhi

发明人： Xiaomei Xi ,  Sam Fu ,  Goran Matijavesic ,  Lutz Brandt ,  Catharine Gallagher ,  Pradeep Gandhi

IPC分类号： C08K3/00 ,  H01B1/02 ,  H01B1/00 ,  C08J3/00 ,  C08K3/08

CPC分类号： C08K3/0008

摘要： In accordance with the present invention, there are provided novel metal-containing compositions useful for the preparation of electrical resistance devices (e.g., resistors and thermistor elements). Compositions according to the invention comprise at least one low melting point metal material, and optionally a higher melting point metal material, with the further presence of a binder system also being optional. Compositions according to the invention exhibit a wide range of resistivity and a wide range of values for temperature coefficient of resistance (TCR). Compositions with low values for TCR are useful for resistor applications while compositions with large values for TCR are useful for thermistor applications. Resistor or thermistor elements can be produced by applying compositions according to the invention onto suitable substrates and subsequently alloying (i.e., curing and/or sintering) the compositions. During curing/sintering, the metal or metal alloy powders undergo transient liquid phase sintering to form a continuous metallurgical network. The electrical conduction of the resulting resistor and/or thermistor elements is achieved as a result of the continuous metallurgical network. Resistance and values for TCR of resistors and/or thermistors prepared employing compositions according to the invention are dependent on the intermetallic compounds formed as a result of the alloying/sintering process. Resistors and thermistor elements formed employing compositions according to the invention are stable up to approximately 250.degree. C. and can be used in the temperature range of about -50.degree. C. up to about 200.degree. C. These metal-containing compositions are compatible with polymer, metal and other types of substrates, are highly reliable as compared to existing technology.

摘要翻译： 根据本发明，提供了用于制备电阻装置（例如电阻器和热敏电阻元件）的新颖的含金属组合物。 根据本发明的组合物包含至少一种低熔点金属材料和任选的较高熔点的金属材料，另外还存在粘合剂体系也是可选的。 根据本发明的组合物表现出宽范围的电阻率和宽的温度范围的温度系数值（TCR）。 具有低TCR值的组合对于电阻器应用是有用的，而具有大的TCR值的组合物可用于热敏电阻应用。 电阻或热敏电阻元件可以通过将根据本发明的组合物施加到合适的基底上并随后将组合物合金化（即固化和/或烧结）来制备。 在固化/烧结期间，金属或金属合金粉末进行瞬态液相烧结，形成连续的冶金网络。 所得到的电阻和/或热敏电阻元件的导电是由于连续的冶金网络而实现的。 使用根据本发明的组合物制备的电阻器和/或热敏电阻的TCR的电阻和值取决于由于合金/烧结工艺而形成的金属间化合物。 使用根据本发明的组合物形成的电阻器和热敏电阻元件在高达约250℃下是稳定的，并且可以在约-50℃至约200℃的温度范围内使用。这些含金属组合物与 聚合物，金属和其他类型的基材，与现有技术相比是高度可靠的。