-
公开(公告)号：US08591636B2
公开(公告)日：2013-11-26
申请号：US12968219
申请日：2010-12-14
申请人： Feng Liu , Maria Anna Rzeznik
发明人： Feng Liu , Maria Anna Rzeznik
IPC分类号： C23C18/30
CPC分类号： C23C18/40 , B01J13/0034 , B01J13/0043 , C23C18/1608 , C23C18/161 , C23C18/1653 , C23C18/1879 , C23C18/1893 , C23C18/206 , C23C18/2086 , C23C18/30 , C23C18/405
摘要： Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.
-
公开(公告)号：US20130098770A1
公开(公告)日：2013-04-25
申请号：US13280135
申请日：2011-10-24
IPC分类号： C25D3/38 , C07D471/04 , C07D215/38 , C07D401/06 , C07D213/74 , C07D213/73
CPC分类号： C25D3/38
摘要： Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
摘要翻译： 提供含有作为某种吡啶化合物与一种或多种含环氧化物的化合物的反应产物的流平剂的镀铜浴，其在导电层的表面上沉积铜。 这样的电镀浴在电解质浓度的范围内沉积在基底表面上基本平坦的铜层。 还公开了使用这种镀铜浴沉积铜层的方法。
-
公开(公告)号：US07190016B2
公开(公告)日：2007-03-13
申请号：US11243890
申请日：2005-10-05
IPC分类号： H01L27/108 , H01L29/76 , H01L29/94 , H01L31/119
CPC分类号： H05K1/162 , H01G4/005 , H01L28/75 , H05K3/384 , H05K2201/0355 , H05K2201/09509 , H05K2203/0723
摘要： Structures including a capacitor dielectric material disposed on the surface of an electrode suitable for use in forming capacitors are disclosed. Methods of forming such structures are also disclosed.
摘要翻译： 公开了包括设置在适合用于形成电容器的电极的表面上的电容器电介质材料的结构。 还公开了形成这种结构的方法。
-
公开(公告)号：US08900666B2
公开(公告)日：2014-12-02
申请号：US13278865
申请日：2011-10-21
申请人： Feng Liu , Maria Anna Rzeznik
发明人： Feng Liu , Maria Anna Rzeznik
CPC分类号： C23C18/28
摘要： Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.
摘要翻译： 稳定的无锡钯催化剂用于金属化印刷电路板的通孔。 催化剂配方中包含一种稳定剂，可防止钯沉淀和附聚。
-
公开(公告)号：US20130216718A1
公开(公告)日：2013-08-22
申请号：US13589029
申请日：2012-08-17
申请人： Feng LIU , Maria Anna RZEZNIK
发明人： Feng LIU , Maria Anna RZEZNIK
CPC分类号： C23C18/1803 , B01J23/40 , B01J23/48 , B01J23/50 , B01J23/70 , B01J31/061 , B01J31/28 , B01J35/0013 , B01J37/16 , B01J2531/0272 , B01J2531/17 , C23C18/1633 , C23C18/2086 , C23C18/30 , C23C18/31 , C23C18/32 , C23C18/38
摘要： Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.
摘要翻译： 催化剂包括催化金属和纤维素或纤维素衍生物的纳米颗粒。 催化剂用于化学镀金属。 催化剂不含锡。
-
公开(公告)号：US20130216713A1
公开(公告)日：2013-08-22
申请号：US13589019
申请日：2012-08-17
申请人： Feng LIU , Maria Anna Rzeznik
发明人： Feng LIU , Maria Anna Rzeznik
IPC分类号： B01J31/06
CPC分类号： C23C18/1834 , B01J23/44 , B01J31/061 , B01J31/28 , B01J35/0013 , B01J35/006 , B01J37/0201 , B01J37/0209 , B01J37/0213 , B01J37/16 , B01J2531/0272 , B01J2531/824 , C23C18/1831 , C23C18/1879 , C23C18/1882 , C23C18/206 , C23C18/2066 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/34 , C23C18/38 , C23C18/40 , C23C18/50 , H05K3/422
摘要： Catalysts which include nanoparticles of palladium metal and cellulose derivatives are used in electroless metal plating. The palladium catalysts are free of tin.
-
公开(公告)号：US20130048505A1
公开(公告)日：2013-02-28
申请号：US13214723
申请日：2011-08-22
IPC分类号： C25D3/38 , C07D231/56 , C07D405/14
摘要： Copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
摘要翻译： 提供含有作为一种或多种某些环二氮杂化合物与一种或多种在导电层的表面上沉积铜的含环氧化合物的反应产物的流平剂的镀铜浴。 这样的电镀浴在电解质浓度的范围内沉积在基底表面上基本平坦的铜层。 还公开了使用这种镀铜浴沉积铜层的方法。
-
公开(公告)号：US20120097548A1
公开(公告)日：2012-04-26
申请号：US13278865
申请日：2011-10-21
申请人： Feng LIU , Maria Anna Rzeznik
发明人： Feng LIU , Maria Anna Rzeznik
CPC分类号： C23C18/28
摘要： Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.
摘要翻译： 稳定的无锡钯催化剂用于金属化印刷电路板的通孔。 催化剂配方中包含一种稳定剂，可防止钯沉淀和附聚。
-
公开(公告)号：US06661642B2
公开(公告)日：2003-12-09
申请号：US10268433
申请日：2002-10-10
IPC分类号： H01G420
CPC分类号： H05K1/162 , H01G4/06 , H01L21/2885 , H01L28/56 , H01L28/60 , H05K3/181 , H05K2201/0195 , H05K2201/0236 , H05K2201/09309
摘要： Multilayer dielectric structures particularly suitable for use in capacitors and having a plating dopant in an amount sufficient to promote plating of a conductive layer are provided, together with methods of forming such structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.
摘要翻译： 提供特别适用于电容器并具有足以促进导电层镀覆的电镀掺杂剂的多层电介质结构，以及形成这种结构的方法。 这种介电结构显示随后施加的导电层的附着力增加。
-
公开(公告)号：US09353443B2
公开(公告)日：2016-05-31
申请号：US13589007
申请日：2012-08-17
CPC分类号： C23C18/1662 , C23C18/206 , C23C18/2073 , C23C18/2086 , C23C18/30 , C23C18/31 , C23C18/32 , C23C18/38
摘要： Catalysts include nanoparticles of catalytic metal and gallic acid or gallic acid derivatives or salts thereof. The catalysts are used in electroless metal plating. The catalysts are free of tin.
摘要翻译： 催化剂包括催化金属和没食子酸或没食子酸衍生物或其盐的纳米颗粒。 催化剂用于化学镀金属。 催化剂不含锡。
-
-
-
-
-
-
-
-
-
搜索结果
24 条记录 (耗时 0.016 秒)
