Chemical mechanical polishing compositions for CMP removal of iridium thin films
    3.
    发明授权
    Chemical mechanical polishing compositions for CMP removal of iridium thin films 失效
    用于CMP去除铱薄膜的化学机械抛光组合物

    公开(公告)号:US06699402B2

    公开(公告)日:2004-03-02

    申请号:US10034764

    申请日:2001-12-28

    CPC classification number: C09G1/02 C23F3/00 H01L21/3212 H01L28/60

    Abstract: A chemical mechanical polishing (CMP) slurry composition for removing noble metal material from a substrate having the noble metal material deposited thereon, for example, a semiconductor device structure including thereon a layer of the noble metal material, e.g., iridium, patterned for use as an electrode. Such polishing slurry composition contains abrasive polishing particles, a bromide compound, a bromate compound for providing free bromine as an oxidizing agent in the composition, and an organic acid for mediating decomposition of the bromate compound in the composition. The CMP slurry composition of the invention is particularly effective for planarization and/or removal of noble metal(s) from the substrate, in applications such as the fabrication of ferroelectric or high permittivity capacitor devices.

    Abstract translation: 一种用于从其上沉积有贵金属材料的基板除去贵金属材料的化学机械抛光(CMP)浆料组合物,例如包括贵金属材料层的半导体器件结构,例如铱,被图案化为用作 电极。 这种抛光浆料组合物含有研磨抛光颗粒,溴化物化合物,用于在组合物中提供游离溴作为氧化剂的溴酸盐化合物,以及用于介导组合物中溴酸盐化合物分解的有机酸。 本发明的CMP浆料组合物在诸如制造铁电体或高介电常数电容器器件的应用中对于从衬底的平坦化和/或去除贵金属是特别有效的。

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