Compositions and structures for chemical mechanical polishing of FeRAM capacitors and method of fabricating FeRAM capacitors using same
    9.
    发明授权
    Compositions and structures for chemical mechanical polishing of FeRAM capacitors and method of fabricating FeRAM capacitors using same 有权
    FeRAM电容器的化学机械抛光的组成和结构以及使用其制造FeRAM电容器的方法

    公开(公告)号:US06346741B1

    公开(公告)日:2002-02-12

    申请号:US09200499

    申请日:1998-11-25

    IPC分类号: H01L2940

    摘要: An integrated circuit structures formed by chemical mechanical polishing (CMP) process, which comprises a conductive pathway recessed in a dielectric substrate, wherein the conductive pathway comprises conductive transmission lines encapsulated in a transmission-enhancement material, and wherein the conductive pathway is filled sequentially by a first layer of the transmission-enhancement material followed by the conductive transmission line; a second layer of transmission-enhancement material encapsulating the conductive transmission line and contacting the first layer of the transmission-enhancement material, wherein the transmission-enhancement material is selected from the group consisting of high magnetic permeability material and high permittivity material. Such integrated circuit structure may comprise a device structure selected from the group consisting of capacitors, inductors, and resistors. Preferably, the transmission-enhancement material comprises MgMn ferrites, MgMnAl ferrites, barium strontium titanate, lead zirconium titanate, titanium oxide, tantalum oxide, etc.

    摘要翻译: 通过化学机械抛光(CMP)工艺形成的集成电路结构,其包括凹入电介质基底中的导电通路,其中导电路径包括封装在透射增强材料中的导电传输线,并且其中导电通路依次由 传输增强材料的第一层,随后是导电传输线; 传输增强材料的第二层,其封装所述导电传输线并与所述透射增强材料的第一层接触,其中所述透射增强材料选自高磁导率材料和高介电常数材料。 这种集成电路结构可以包括从由电容器,电感器和电阻器组成的组中选择的器件结构。 优选地,透射增强材料包括MgMn铁氧体,MgMnAl铁氧体,钛酸锶钡,钛酸铅锆,氧化钛,氧化钽等

    Super-dry reagent compositions for formation of ultra low k films
    10.
    发明授权
    Super-dry reagent compositions for formation of ultra low k films 有权
    用于形成超低k膜的超干试剂组合物

    公开(公告)号:US08053375B1

    公开(公告)日:2011-11-08

    申请号:US11925838

    申请日:2007-10-27

    IPC分类号: H01L21/00 C07F7/08 C07C7/00

    摘要: An ultra low k dielectric film, including a silicon film containing porosity deriving from a porogen, as formed from a precursor silane and a porogen, wherein the precursor silane has a water content below 10 ppm, based on total weight of the precursor silane, and/or the porogen has a water content below 10 ppm, based on total weight of the porogen. In one implementation, the precursor silane is diethoxymethylsilane, and the porogen is bicyclo[2.2.1]-hepta-2,5-diene having a trace water content below 10 ppm, based on total weight of said bicyclo[2.2.1]-hepta-2,5-diene. These super-dry reagents are unexpectedly polymerization-resistant during their delivery and deposition in the formation of ultra low k films, and are advantageously employed to produce ultra low k films of superior character.

    摘要翻译: 一种超低k电介质膜,包括由前体硅烷和致孔剂形成的含有致孔剂的孔隙率的硅膜,其中前体硅烷的含水量基于前体硅烷的总重量低于10ppm,和 /或致孔剂的含水量基于致孔剂的总重量低于10ppm。 在一个实施方案中,前体硅烷是二乙氧基甲基硅烷,并且致孔剂是基于所述双环[2.2.1] - 二甲基甲硅烷基的总重量的具有痕量水含量低于10ppm的双环[2.2.1] - 庚-2,5-二烯。 庚-2,5-二烯。 这些超级干燥试剂在它们的输送和沉积期间在超低k膜的形成期间出人意料地具有抗聚合性,并且有利地用于生产优异特性的超低k膜。