Abstract:
The present invention provides a HPT having high sensitivity and extensive wavelength band characteristics. The collector and barrier layer (5) is formed on the photo-absorption layer (6), wherein the energy level in the conduction band is higher than that of the photo-absorption layer (6), the energy level in the valence band is almost equal to or higher than that of the photo-absorption layer (6) and is a relatively wider gap semiconductor than the photo-absorption layer. The base layer (4) formed on the collector and barrier layer (5), is a relatively narrow gap as compared with the collector and barrier layer (5), wherein the energy level in the conduction band is equal to or higher than that of the collector and barrier layer (5) in the boundary of the collector and barrier layer (5). The emitter layer (3) formed on a base layer (4) is a relatively wide gap as compared with the base layer (4), and the energy level in the valence band is the first conductivity type semiconductor layer lower than that of the base layer (4).
Abstract:
A Group III atomic layer required for fabrication of a semiconductor quantum nanostructure is grown to be properly restricted to a monolayer.A substrate is configured to have a fast-growth surface portion where growth of a Ga atomic layer proceeds at a relatively high rate and a slow-growth surface portion where the growth of the Ga atomic layer proceeds at a relatively low rate. Ga atoms are supplied to the fast-growth surface portion in an amount not less than that which grows one layer of the Group III atoms. Excess Ga atoms on the fast-growth surface portion are allowed to migrate to the slow-growth surface portion by surface migration, thereby growing only one layer of the Ga atoms on the fast-growth surface portion.
Abstract:
This invention provides a photo-FET, in which a FET part and photodiode part are stacked, and the FET part and photodiode part are optimized independently in design and operational bias conditions. The semiconductor layer serving as a photo-absorption layer (41) is formed on the cathode semiconductor layer (10) of a photodiode part (50). An electron barrier layer (40) with a wider bandgap semiconductor than a photo-absorption layer (41), which also serves as an anode layer of a photodiode part (50), is formed on a photo-absorption layer (41). The channel layer (15) which constitutes the channel regions of the FET part is formed with a narrower bandgap semiconductor than an electron barrier layer (40) on an electron barrier layer (40). The hole barrier layer (16) with a bandgap wider than the semiconductor which constitutes a channel layer (15) is formed on a channel layer (15). The source electrode (30) and drain electrode (32) which are separated each others, are formed on a hole barrier layer (16). The holes injected into the channel layer (15) by light illumination through the electron barrier layer (40) from the photo-absorption layer (41) are confined with the hole barrier layer (16). And the electrons in a channel layer (15) are confined with the electron barrier layer (40) into the channel layer (15), respectively.
Abstract:
A quantum nanostructure semiconductor laser includes a strip-shaped ridge with a plurality of V-grooves formed on a compound semiconductor substrate in the direction of laser beam emission, with the V-grooves arrayed in parallel and with each V-groove extending orthogonally to the direction of laser beam emission. On the ridge, an optical waveguide is provided that includes a lower cladding layer, a plurality of quantum wires, and an upper cladding layer. The quantum wires are formed to a finite length corresponding to the stripe width of the laser beam, and are each located at a position corresponding to a V-groove location. The optical waveguide is trapezoidal in shape. The quantum wires do not project out beyond the width of the ridge, but the ends of the wires are converged and closed off with the upper and lower cladding layers toward higher index crystalline planes.
Abstract:
A photo-FET based on a compound semiconductor including a channel layer formed on a substrate constituting a current path between source and drain electrodes, serving as part of a photodiode and a photosensitive region. A back-gate layer that serving as a substrate-side depletion layer formation layer is disposed between the substrate and the channel layer, and applies to the channel layer a back-gate bias by photogenerated carriers upon illumination. A barrier layer is disposed on the front side of the channel layer that causes one of the photogenerated carriers to run through the channel layer and other of the photogenerated carriers to sojourn or be blocked off. A front-side depletion layer formation layer is disposed on the front side of the channel layer brings the front-side depletion layer into contact with the substrate-side depletion layer without illumination to close the current path in the channel layer, bringing the photo-FET to an off-state.
Abstract:
A scanning-type lithographic and image-pickup device causes the terminal face of either a projecting optical fiber or a picking-up optical fiber to scan a given object in the plane of real image of an objective lens, projects a light through the projecting optical fiber onto the object, and receives the reflected light or a light of photoluminescence through the picking-up optical fiber. When this device is applied to a spectromicroscope, the quantitative surface information can be spectrally measured with high resolution and high reproducibility. When the device is applied to a contracting-projection exposure device or a selective laser annealing device, positional alignment and exposure pattern correction can be easily effected with high accuracy and high productivity. Simultaneous fabrication of a plurality of electronic components can be also obtained by use of this device.
Abstract:
A hetero-junction bipolar phototransistor includes a photo-absorption layer formed of a first conductivity type semiconductor layer, and a collector operating as a barrier layer, a base layer, and an emitter layer, which are stacked in sequence on the photo-absorption layer. The photo-absorption layer, collector, base layer and emitter layer forms a first mesa structure, and an emitter contact layer forms a second mesa structure. The photo-absorption layer includes a semiconductor layer with a narrow gap corresponding to a light-sensing wavelength of the phototransistor. The collector includes a semiconductor layer with a wider gap than a gap of the photo-absorption layer. The base layer has an energy level equal to or higher than the energy level of the collector. The emitter layer has a wide gap as compared to the base layer, and an energy level in a valence band is lower than an energy level of the base layer.
Abstract:
An array structure solves issues that exist in conventional compound semiconductor photodiode arrays, such as large cross talk, large surface leaks, large stray capacitance, narrow detection wavelength bands, and bad manufacturing yield, simultaneously. A photodiode array has, laminated upon a semiconductor substrate, a buffer layer (8) with a broad forbidden band width, an I-type (low concentration photosensitive layer (2) with a narrow forbidden band width, and an n-type semiconductor window layer (3) with a broad forbidden band width, wherein photodiode elements are electrically separated from adjacent elements, by doping the periphery of the p-type impurity, and the detection wavelength band is expanded, by making the n-type window layer (3) on the photosensitive layer (2) a thinner layer with crystal growth.
Abstract:
A highly sensitive and wide spectra-range mesa type photodetector having the impurity diffusion along the mesa-sidewall is provided. A mesa-type hetero-bipolar phototransistor or photodiode having a photo-absorption layer formed by a first semiconductor layer of a first conductivity type, an anode layer (or base layer) formed by a second semiconductor layer of a second conductivity type which has an opposite polarity with the first conductivity type, a wide band gap emitter or window layer formed by the third semiconductor layer on the anode layer, and the wide band gap buffer layer of the first conductivity type which has a relatively wide band gap semiconductor as compared with the second semiconductor layer on the substrate, which also serves as the cathode layer. And the first semiconductor layer, the second semiconductor layer and the wide band gap emitter or window layer is selectively etched to form the mesa structure. The diffusion region shaped like a ring in plan view is also provided from the exposed sidewall of this mesa structure toward the center of the device by a predetermined horizontal width, converted into the second conductivity type, which is the same conductivity type as the second semiconductor layer.
Abstract:
An array structure solves issues that exist in conventional compound semiconductor photodiode arrays, such as large cross talk, large surface leaks, large stray capacitance, narrow detection wavelength bands, and bad manufacturing yield, simultaneously. A photodiode array has, laminated upon a semiconductor substrate, a buffer layer (8) with a broad forbidden band width, an I-type (low concentration photosensitive layer (2) with a narrow forbidden band width, and an n-type semiconductor window layer (3) with a broad forbidden band width, wherein photodiode elements are electrically separated from adjacent elements, by doping the periphery of the p-type impurity, and the detection wavelength band is expanded, by making the n-type window layer (3) on the photosensitive layer (2) a thinner layer with crystal growth.