利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

26 条记录 (耗时 0.02 秒)

    LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE HAVING DIFFUSION BARRIER LAYER AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE HAVING DIFFUSION BARRIER LAYER AND METHOD OF MANUFACTURING THE SAME 审中-公开
    具有扩散阻挡层的低温共烧陶瓷基板及其制造方法

    公开(公告)号：US20090214881A1

    公开(公告)日：2009-08-27

    申请号：US12388849

    申请日：2009-02-19

    申请人： Myung Whun Chang ,  Jong Myeon Lee ,  Soo Hyun Lyoo ,  Ho Sung Choo

    发明人： Myung Whun Chang ,  Jong Myeon Lee ,  Soo Hyun Lyoo ,  Ho Sung Choo

    IPC分类号： B32B18/00 ,  C03B29/00

    CPC分类号： C04B37/005 ,  C04B2237/062 ,  C04B2237/10 ,  C04B2237/341 ,  C04B2237/62 ,  C04B2237/74 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

    摘要： There is provided a low temperature co-fired ceramic substrate having a diffusion barrier layer to prevent diffusion occurring in a heterojunction during firing and a method of manufacturing the same. A low temperature co-fired ceramic substrate according to an aspect of the invention may include: a first ceramic layer formed of a material having a first dielectric constant; a second ceramic layer formed of a material having a second dielectric constant lower than the first dielectric constant; and a diffusion barrier layer interposed between the first ceramic layer and the second ceramic layer and formed of the first ceramic layer material, the second ceramic layer material, and a barium (Ba) compound, wherein inter-diffusion between the first ceramic layer material and the second ceramic layer material is prevented by using the diffusion barrier layer.

    摘要翻译： 提供了具有扩散阻挡层的低温共烧陶瓷基板及其制造方法，以防止在烧成期间发生异质结的扩散。 根据本发明的一个方面的低温共烧陶瓷衬底可以包括：由具有第一介电常数的材料形成的第一陶瓷层; 由具有低于第一介电常数的第二介电常数的材料形成的第二陶瓷层; 以及介于所述第一陶瓷层和所述第二陶瓷层之间并且由所述第一陶瓷层材料，所述第二陶瓷层材料和钡（Ba）化合物形成的扩散阻挡层，其中所述第一陶瓷层材料和 通过使用扩散阻挡层来防止第二陶瓷层材料。

    Method of repairing a probe board
    4.
    发明授权
    Method of repairing a probe board 有权
    修理探针板的方法

    公开(公告)号：US08806731B2

    公开(公告)日：2014-08-19

    申请号：US12987697

    申请日：2011-01-10

    申请人： Myung Whun Chang ,  Dae Hyeong Lee ,  Ki Pyo Hong

    发明人： Myung Whun Chang ,  Dae Hyeong Lee ,  Ki Pyo Hong

    IPC分类号： B23P6/00

    CPC分类号： H05K1/11 ,  G01R1/02 ,  H05K1/09 ,  H05K3/225 ,  H05K3/4015 ,  H05K3/4061 ,  Y10T29/49002 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49726 ,  Y10T29/49748

    摘要： There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

    摘要翻译： 提供了一种修复探针板的方法，所述方法包括：在形成为陶瓷烧结体的板体中制备多个填充有第一填充材料的第一通孔电极; 在所述多个第一通孔电极中形成用于开放通孔电极的通孔; 用具有比第一填充材料低的烧结温度的第二填充材料填充通孔; 以及通过烧结所述第二填充材料形成第二通孔电极。 根据本发明的开放通孔修复提高了板的制造成品率并降低了其制造成本。

    METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME
    6.
    发明申请
    METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME 有权
    使用该方法修复探针板和探针板

    公开(公告)号：US20120037408A1

    公开(公告)日：2012-02-16

    申请号：US12987697

    申请日：2011-01-10

    申请人： Myung Whun CHANG ,  Dae Hyeong LEE ,  Ki Pyo HONG

    发明人： Myung Whun CHANG ,  Dae Hyeong LEE ,  Ki Pyo HONG

    IPC分类号： H05K1/09 ,  H05K1/00 ,  H01K3/10

    CPC分类号： H05K1/11 ,  G01R1/02 ,  H05K1/09 ,  H05K3/225 ,  H05K3/4015 ,  H05K3/4061 ,  Y10T29/49002 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49726 ,  Y10T29/49748

    摘要： There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

    摘要翻译： 提供了一种修复探针板的方法，所述方法包括：在形成为陶瓷烧结体的板体中制备多个填充有第一填充材料的第一通孔电极; 在所述多个第一通孔电极中形成用于开放通孔电极的通孔; 用具有比第一填充材料低的烧结温度的第二填充材料填充通孔; 以及通过烧结所述第二填充材料形成第二通孔电极。 根据本发明的开放通孔修复提高了板的制造成品率并降低了其制造成本。

    METHOD OF FORMING PHOSPHOR FILM AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE INCORPORATING THE SAME
    7.
    发明申请
    METHOD OF FORMING PHOSPHOR FILM AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE INCORPORATING THE SAME 有权
    形成磷光体膜的方法及其制造发光二极管包装的方法

    公开(公告)号：US20110043100A1

    公开(公告)日：2011-02-24

    申请号：US12914042

    申请日：2010-10-28

    申请人： Hai Sung LEE ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

    发明人： Hai Sung LEE ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

    IPC分类号： H01J1/63 ,  C09K11/06 ,  B82Y30/00

    CPC分类号： C09K11/7749 ,  C09K11/025 ,  H01L33/502 ,  H01L2933/0041

    摘要： The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

    摘要翻译： 本发明涉及一种形成荧光膜的方法及其制造方法。 形成荧光体膜的方法包括在水性溶剂中混合荧光体和透光珠，使得具有第一电荷的纳米尺寸的透光珠吸附在具有第二电荷的荧光体颗粒的表面上。 该方法还包括将从混合步骤获得的荧光体混合物涂覆在要形成荧光膜的区域上，并干燥涂覆的荧光体混合物以形成荧光膜。 本发明还提供一种制造包含形成荧光膜的方法的LED封装的方法。

    Method of manufacturing light emitting diode package
    9.
    发明申请
    Method of manufacturing light emitting diode package 有权
    制造发光二极管封装的方法

    公开(公告)号：US20070196939A1

    公开(公告)日：2007-08-23

    申请号：US11709130

    申请日：2007-02-22

    申请人： Youn Gon Park ,  Jong Myeon Lee ,  Hai Sung Lee ,  Myung Whun Chang ,  Ho Sung Choo

    发明人： Youn Gon Park ,  Jong Myeon Lee ,  Hai Sung Lee ,  Myung Whun Chang ,  Ho Sung Choo

    IPC分类号： H01L21/00

    CPC分类号： H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

    摘要翻译： 一种制造发光二极管封装的方法。 制备其中形成有凹部的杯形封装结构和形成在凹部的底部上的电极结构。 发光二极管芯片安装在凹部的底部，其中芯片的端子电连接到电极结构。 将液态透明树脂注入到凹部中，并且在液态透明树脂完全固化之前，将刻有其上的微粗糙图案的印模涂布在树脂的上表面上。 液态透明树脂用施加在其上的印模固化以形成树脂密封剂，并且从树脂密封剂中除去印模。

    Method of forming phosphor film and method of manufacturing light emitting diode package incorporating the same
    10.
    发明申请
    Method of forming phosphor film and method of manufacturing light emitting diode package incorporating the same 有权
    形成荧光膜的方法及其制造的发光二极管封装的制造方法

    公开(公告)号：US20070148332A1

    公开(公告)日：2007-06-28

    申请号：US11524952

    申请日：2006-09-22

    申请人： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

    发明人： Hai Sung Lee ,  Jong Myeon Lee ,  Ho Sung Choo ,  Myung Whun Chang ,  Youn Gon Park

    IPC分类号： B05D1/12 ,  B05D7/00 ,  B05D5/12

    CPC分类号： C09K11/7749 ,  C09K11/025 ,  H01L33/502 ,  H01L2933/0041

    摘要： The invention relates to a method of forming a phosphor film and a method of manufacturing an LED package incorporating the same. The method of forming a phosphor film includes mixing phosphor and light-transmitting beads in an aqueous solvent such that the nano-sized light-transmitting beads having a first charge are adsorbed onto surfaces of phosphor particles having a second charge. The method also includes coating a phosphor mixture obtained from the mixing step on an area where the phosphor film is to be formed, and drying the coated phosphor mixture to form the phosphor film. The invention further provides a method of manufacturing an LED package incorporating the method of forming the phosphor film.

    摘要翻译： 本发明涉及一种形成荧光膜的方法及其制造方法。 形成荧光体膜的方法包括在水性溶剂中混合荧光体和透光珠，使得具有第一电荷的纳米尺寸的透光珠吸附在具有第二电荷的荧光体颗粒的表面上。 该方法还包括将从混合步骤获得的荧光体混合物涂覆在要形成荧光膜的区域上，并干燥涂覆的荧光体混合物以形成荧光膜。 本发明还提供一种制造包含形成荧光膜的方法的LED封装的方法。