公开(公告)号：US20080041619A1

公开(公告)日：2008-02-21

申请号：US11889498

申请日：2007-08-14

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim

IPC分类号： H05K1/16 ,  H05K3/36

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/10378 ,  H05K2203/061 ,  Y10T29/49126

摘要： A component-embedded multilayer printed wiring board and manufacturing method thereof. A component-embedded multilayer printed wiring board that includes: a first wiring board, in which a component is embedded; an intermediate layer which is stacked on the first wiring board and through which at least one conductive bump penetrates in correspondence to a wiring pattern formed on the first wiring board; and a second wiring board which is stacked on the intermediate layer and on a surface of which a wiring pattern is formed in correspondence with the conductive bump, can contribute to forming smaller and more functional electronic products, and by individually producing wiring boards having embedded components and then stacking these with intermediate layers interposed in-between, the defect status of each wiring board can be examined in advance, while this approach can be used in conjunction with existing surface mounting approaches to increase the effective mounting area.

摘要翻译： 一种组件嵌入式多层印刷线路板及其制造方法。 一种部件嵌入式多层印刷电路板，其特征在于，包括：嵌入有部件的第一布线基板; 层叠在所述第一布线基板上的中间层，至少一个导电凸块与形成在所述第一布线基板上的布线图形对应地贯穿所述中间层; 并且与导电凸块对应地堆叠在中间层上并且其表面上形成有布线图案的第二布线板可以有助于形成更小和更多功能的电子产品，并且通过单独制造具有嵌入部件的布线板 然后将中间层叠置在其间，可以预先检查各布线基板的缺陷状态，同时可以与现有的表面安装方式结合使用，以增加有效的安装面积。

公开(公告)号：US08011086B2

公开(公告)日：2011-09-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/30 ,  H05K3/00 ,  H05K3/36 ,  H05K3/02 ,  H01R9/00

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US20080052906A1

公开(公告)日：2008-03-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/02

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US20090124043A1

公开(公告)日：2009-05-14

申请号：US12149837

申请日：2008-05-08

申请人： Won-Cheol Bae ,  Young-Do Kweon ,  Doo-Hwan Lee

发明人： Won-Cheol Bae ,  Young-Do Kweon ,  Doo-Hwan Lee

IPC分类号： H01L21/52

CPC分类号： H05K1/187 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2224/92144 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/10674 ,  H05K2203/1469

摘要： A method of manufacturing a package board is disclosed. The method is for manufacturing a package board that has a pad electrically connected with a component, and includes: forming an indentation, which is in correspondence with the pad, in one side of a first insulating layer; filling a metal paste in the indentation; mounting the component on the first insulating layer in correspondence with a location of the indentation; and hardening the metal paste. Using this method, damage to the component can be prevented during the forming of vias, as the component is mounted after filling paste in an indentation formed in an insulating layer.

摘要翻译： 公开了一种制造封装板的方法。 该方法用于制造具有与部件电连接的焊盘的封装板，并且包括：在第一绝缘层的一侧形成与焊盘相对应的凹陷; 在压痕中填充金属膏; 将零件安装在与压痕位置对应的第一绝缘层上; 并硬化金属膏。 使用这种方法，在形成通孔期间可以防止部件的损坏，因为在将糊料填充在形成在绝缘层中的凹陷中之后安装部件。

公开(公告)号：US07348772B2

公开(公告)日：2008-03-25

申请号：US10975736

申请日：2004-10-28

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

IPC分类号： G01R33/04

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： A Printed Circuit Board (PCB) having a weak magnetic field sensor of the present invention includes a base plate on which a first excitation circuit and a first detection circuit are formed on each of the sides thereof, soft magnetic core bodies laminated on the top and bottom of the base plate, respectively, and formed of a plurality of soft magnetic cores, and outer layers that are laminated on the soft magnetic core bodies, respectively, and on which a second excitation circuit and a second detection circuit connected to the first excitation circuit and the first detection circuit through via holes are formed so as to surround the soft magnetic cores, respectively. The present invention is characterized in that the soft magnetic cores, the excitation circuit and the detection circuit formed on one side of the base plate are perpendicular to the soft magnetic cores, the excitation circuit and the detection circuit formed on the other side of the base plate.

摘要翻译： 本发明的具有弱磁场传感器的印刷电路板（PCB）包括：基板，其基板在其基板上形成有第一激励电路和第一检测电路，软磁芯体层叠在顶板上， 底板分别由多个软磁芯和层叠在软磁体上的外层构成，第二激励电路和第二检测电路分别连接到第一激励 电路和通过通孔的第一检测电路分别形成为围绕软磁芯。 本发明的特征在于，形成在基板的一侧上的软磁芯，激励电路和检测电路垂直于软磁芯，激励电路和检测电路形成在基座的另一侧 盘子。

公开(公告)号：US07886433B2

公开(公告)日：2011-02-15

申请号：US12007795

申请日：2008-01-15

申请人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

发明人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K1/185 ,  B32B3/06 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/09509 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T428/22 ,  H01L2224/82

摘要： A component-embedded PCB and a method of manufacturing the PCB are disclosed. Using a method that includes perforating a cavity in a core substrate; inserting a component in the cavity; stacking a film layer over the core substrate; forming at least one post by selectively leaving behind the film layer in correspondence to a position of at least one electrode of the component; covering an insulation layer over the core substrate such that the post penetrates the insulation layer to be exposed at a surface of the insulation layer; and forming at least one via hole by removing the post, can provide increased precision and finer pitch. Also, since laser is not used when processing the vias, damage to the component that may occur due to the laser is prevented. Furthermore, tolerance defects may be decreased, as well as defects caused by residue left after processing.

摘要翻译： 公开了一种组件嵌入式PCB及其制造方法。 使用包括在芯基板中穿孔的方法; 将部件插入腔中; 在芯基板上堆叠薄膜层; 通过选择性地将所述膜层留在所述元件的至少一个电极的位置上而形成至少一个柱; 覆盖所述芯基板上的绝缘层，使得所述柱穿透所述绝缘层以在所述绝缘层的表面上暴露; 并且通过去除柱形成至少一个通孔，可以提供更高的精度和更细的间距。 此外，由于在加工通孔时不使用激光，因此防止了由于激光而可能发生的部件的损坏。 此外，可能会降低公差缺陷，以及加工后残留物造成的缺陷。

公开(公告)号：US20080196931A1

公开(公告)日：2008-08-21

申请号：US12010194

申请日：2008-01-22

申请人： Sang-Chul Lee ,  Won-Cheol Bae ,  Kwan-Kyu Kim ,  Doo-Hwan Lee

发明人： Sang-Chul Lee ,  Won-Cheol Bae ,  Kwan-Kyu Kim ,  Doo-Hwan Lee

IPC分类号： H05K1/02 ,  H05K3/36

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/18162 ,  H01L2924/351 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2203/061 ,  Y10T29/49126 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded components and a method for the manufacturing of the printed circuit board are disclosed. The printed circuit board includes: an intermediary insulation layer; a first core board, in which a first component having at least one electrode formed on one side is embedded, stacked on one side of the intermediary insulation layer; a first insulation layer stacked on the first core board such that the first component is covered; a second core board, in which a second component having at least one electrode formed on one side is embedded, stacked on the other side of the intermediary insulation layer; a second insulation layer stacked on the second core board such that the second component is covered; and a first via, which penetrates the first core board and the second core board. The use of this printed circuit board allows highly integrated designs.

摘要翻译： 公开了一种具有嵌入部件的印刷电路板和印刷电路板的制造方法。 印刷电路板包括：中间绝缘层; 第一芯板，其中嵌入有在一侧形成的至少一个电极的第一部件，堆叠在中间绝缘层的一侧上; 第一绝缘层，堆叠在所述第一芯板上，使得所述第一部件被覆盖; 第二芯板，其中嵌入有形成在一侧上的至少一个电极的第二部件，堆叠在中间绝缘层的另一侧上; 第二绝缘层，堆叠在所述第二芯板上，使得所述第二部件被覆盖; 以及穿过第一芯板和第二芯板的第一通孔。 该印刷电路板的使用允许高度集成的设计。

公开(公告)号：US20080171172A1

公开(公告)日：2008-07-17

申请号：US12007795

申请日：2008-01-15

申请人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

发明人： Won-Cheol Bae ,  Je-Gwang Yoo ,  Sang-Chul Lee ,  Doo-Hwan Lee

IPC分类号： H05K1/11 ,  B32B3/06

CPC分类号： H05K1/185 ,  B32B3/06 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H05K2201/09509 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T156/1056 ,  Y10T428/22 ,  H01L2224/82

摘要： A component-embedded PCB and a method of manufacturing the PCB are disclosed. Using a method that includes perforating a cavity in a core substrate; inserting a component in the cavity; stacking a film layer over the core substrate; forming at least one post by selectively leaving behind the film layer in correspondence to a position of at least one electrode of the component; covering an insulation layer over the core substrate such that the post penetrates the insulation layer to be exposed at a surface of the insulation layer; and forming at least one via hole by removing the post, can provide increased precision and finer pitch. Also, since laser is not used when processing the vias, damage to the component that may occur due to the laser is prevented. Furthermore, tolerance defects may be decreased, as well as defects caused by residue left after processing.

摘要翻译： 公开了一种组件嵌入式PCB及其制造方法。 使用包括在芯基板中穿孔的方法; 将部件插入腔中; 在芯基板上堆叠薄膜层; 通过选择性地将所述膜层留在所述元件的至少一个电极的位置上而形成至少一个柱; 覆盖所述芯基板上的绝缘层，使得所述柱穿透所述绝缘层以在所述绝缘层的表面上暴露; 并且通过去除柱形成至少一个通孔，可以提供更高的精度和更细的间距。 此外，由于在加工通孔时不使用激光，因此防止了由于激光而可能发生的部件的损坏。 此外，可能会降低公差缺陷，以及加工后残留物造成的缺陷。

公开(公告)号：US07394249B2

公开(公告)日：2008-07-01

申请号：US10965613

申请日：2004-10-14

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC分类号： G01R33/04

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： Disclosed is a printed circuit board with a weak magnetic field sensor according to the present invention, which includes a substrate having first excitation circuits and first detection circuits formed on both sides thereof. First laminates are layered on both sides of the substrate, and have soft magnetic cores with a predetermined shape formed thereon. Second laminates are layered on the first laminates, and have second excitation circuits and second detection circuits, connected through via holes to the first excitation circuits and first detection circuits, respectively, so that the first and second excitation circuits and first and second detection circuits are wound around the soft magnetic cores, formed thereon. The soft magnetic cores each include a magnetic core and non-magnetic metal layers formed on both sides of the magnetic core.

摘要翻译： 公开了根据本发明的具有弱磁场传感器的印刷电路板，其包括具有形成在其两侧上的第一激励电路和第一检测电路的基板。 第一层压体层叠在基板的两侧，并且具有形成在其上的预定形状的软磁芯。 第二层叠体层叠在第一层叠体上，并具有分别通过通孔与第一激励电路和第一检测电路连接的第二激励电路和第二检测电路，使得第一和第二激励电路以及第一和第二检测电路 缠绕在其上形成的软磁芯上。 软磁芯各自包括形成在磁芯两侧的磁芯和非磁性金属层。

公开(公告)号：US20060017435A1

公开(公告)日：2006-01-26

申请号：US10975736

申请日：2004-10-28

申请人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

发明人： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

IPC分类号： G01R33/02

CPC分类号： G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

摘要： A Printed Circuit Board (PCB) having a weak magnetic field sensor of the present invention includes a base plate on which a first excitation circuit and a first detection circuit are formed on each of the sides thereof, soft magnetic core bodies laminated on the top and bottom of the base plate, respectively, and formed of a plurality of soft magnetic cores, and outer layers that are laminated on the soft magnetic core bodies, respectively, and on which a second excitation circuit and a second detection circuit connected to the first excitation circuit and the first detection circuit through via holes are formed so as to surround the soft magnetic cores, respectively. The present invention is characterized in that the soft magnetic cores, the excitation circuit and the detection circuit formed on one side of the base plate are perpendicular to the soft magnetic cores, the excitation circuit and the detection circuit formed on the other side of the base plate.

摘要翻译： 本发明的具有弱磁场传感器的印刷电路板（PCB）包括：基板，其基板在其基板上形成有第一激励电路和第一检测电路，软磁芯体层叠在顶板上， 底板分别由多个软磁芯和层叠在软磁体上的外层构成，第二激励电路和第二检测电路分别连接到第一激励 电路和通过通孔的第一检测电路分别形成为围绕软磁芯。 本发明的特征在于，形成在基板的一侧上的软磁芯，激励电路和检测电路垂直于软磁芯，激励电路和检测电路形成在基座的另一侧 盘子。