公开(公告)号：US09320148B2

公开(公告)日：2016-04-19

申请号：US13431091

申请日：2012-03-27

申请人： Yukinobu Mikado ,  Shunsuke Sakai ,  Hirofumi Futamura

发明人： Yukinobu Mikado ,  Shunsuke Sakai ,  Hirofumi Futamura

IPC分类号： H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K3/46 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498

CPC分类号： H05K1/185 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/1469 ,  H01L2924/00

摘要： A printed wiring board includes a core substrate having a penetrating hole extending through the core substrate, an electronic component accommodated in the penetrating hole of the core substrate, a filler resin filling clearance between the component and the core substrate, a first resin insulation layer formed on the component and a first surface of the core substrate, and a second resin insulation layer formed on the component and a second surface of the core substrate on the opposite side of the first surface of the core substrate. The filler resin has elastic modulus which is set to be lower than 0.2 Gpa and thermal expansion coefficient which is set to be higher than 100 ppm and lower than 200 ppm, and the core substrate has elastic modulus which is set to be higher than 30 Gpa, and thermal expansion coefficient which is set to be lower than 10 ppm.

摘要翻译： 印刷电路板包括具有延伸穿过芯基板的穿透孔的芯基板，容纳在芯基板的贯通孔中的电子部件，部件和芯基板之间的填充树脂填充间隙，形成第一树脂绝缘层 在芯基板的第一表面和与芯基板的第一表面相反的一侧上形成的第二树脂绝缘层和芯基板的第二表面上。 填充树脂的弹性模量设定为低于0.2Gpa，热膨胀系数设定为高于100ppm且低于200ppm，芯基材的弹性模量设定为高于30Gpa ，热膨胀系数设定为低于10ppm。

公开(公告)号：US08642897B2

公开(公告)日：2014-02-04

申请号：US13218968

申请日：2011-08-26

申请人： Shunsuke Sakai

发明人： Shunsuke Sakai

IPC分类号： H05K1/16

CPC分类号： H01L24/24 ,  H01L21/568 ,  H01L23/145 ,  H01L23/5389 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3511 ,  H05K1/185 ,  H05K2201/10674 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

摘要： A wiring board including a core substrate having an accommodation portion, an electronic component in the accommodation portion having a substrate, a resin layer on a surface of the substrate and an electrode on the resin layer, a first interlayer resin insulation layer on a surface of the core substrate and a surface of the substrate of the component, and a second interlayer resin insulation layer on the opposite surface of the core substrate and a surface of the substrate having the resin layer and electrode. The first insulation layer has resin in the amount greater than the amount of resin in the second insulation layer such that the total amount of resin component including the resin in the first insulation layer is adjusted to be substantially the same as the total amount of resin component including the resin in the second insulation layer and resin in the resin layer.

摘要翻译： 一种布线板，包括具有容纳部的芯基板，具有基板的容纳部中的电子部件，基板的表面上的树脂层和树脂层上的电极，表面上的第一层间树脂绝缘层 核心基板和部件的基板的表面，以及在芯基板的相对表面上的第二层间树脂绝缘层和具有树脂层和电极的基板的表面。 第一绝缘层具有比第二绝缘层中的树脂量大的树脂，使得包含第一绝缘层中的树脂的树脂成分的总量被调节为与树脂成分的总量基本相同 包括第二绝缘层中的树脂和树脂层中的树脂。

公开(公告)号：US20130192883A1

公开(公告)日：2013-08-01

申请号：US13558892

申请日：2012-07-26

申请人： Toshiki FURUTANI ,  Yukinobu MIKADO ,  Shunsuke SAKAI ,  Yusuke TANAKA

发明人： Toshiki FURUTANI ,  Yukinobu MIKADO ,  Shunsuke SAKAI ,  Yusuke TANAKA

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4661

摘要： A printed wiring board includes a substrate having an accommodation section having multiple opening portions, multiple electronic components accommodated in the opening portions, respectively, a filler resin provided in the opening portions in the substrate such that the electronic components are secured in the opening portions in the substrate, a resin insulation layer formed over the substrate and the electronic components, a conductive layer formed on the resin insulation layer, and via conductors formed in the resin insulation layer and connecting the conductive layer and the electronic components. The opening portions are connected to each other.

摘要翻译： 印刷电路板包括具有多个开口部分的容纳部分的基板，分别容纳在开口部分中的多个电子部件，设置在基板的开口部分中的填充树脂，使得电子部件固定在开口部分中 基板，形成在基板上的树脂绝缘层和电子部件，形成在树脂绝缘层上的导电层和形成在树脂绝缘层中并连接导电层和电子部件的通孔导体。 开口部彼此连接。

公开(公告)号：US08385486B2

公开(公告)日：2013-02-26

申请号：US12307016

申请日：2007-04-17

申请人： Shigeru Soga ,  Shunsuke Sakai

发明人： Shigeru Soga ,  Shunsuke Sakai

IPC分类号： H04L1/02

CPC分类号： H04B7/0871 ,  H04L5/0007 ,  H04L5/0048 ,  H04L27/2647 ,  H04L27/2662

摘要： There is provided a diversity receiving apparatus, comprising: a first branch (5) for decoding a frequency multiplexing signal in which a carrier group has been multiplexed, thereby outputting a first data carrier and a first pilot carrier; a second branch (6) for decoding a frequency multiplexing signal in which a carrier group has been multiplexed, thereby outputting a second data carrier and a second pilot carrier; a timing adjusting unit (7) for synchronizing processing timing for a carrier group decoded by the first branch (5) and a carrier group decoded by the second branch (6); a combining/selecting unit (8) for combining/selecting the first data carrier and/or the second data carrier; and a control unit (10) for controlling stopping and starting operation of at least one of the first branch (5) and the second branch (6) according to at least one of a receiving status of the first branch (5) and a receiving status of second branch (6).

摘要翻译： 提供了一种分集接收装置，包括：第一分支（5），用于解码其中已经复用了载波组的频率复用信号，从而输出第一数据载体和第一导频载波; 用于解码其中已经复用了载波组的频率复用信号的第二分支（6），从而输出第二数据载体和第二导频载波; 定时调整单元（7），用于使由第一分支（5）解码的载波组和由第二分支（6）解码的载波组的处理定时同步; 组合/选择单元（8），用于组合/选择第一数据载体和/或第二数据载体; 以及控制单元（10），用于根据第一分支（5）的接收状态和接收到的第一分支（5）的接收状态中的至少一个来控​​制第一分支（5）和第二分支（6）中的至少一个的停止和开始操作 第二分支（6）的状态。

公开(公告)号：US08335281B2

公开(公告)日：2012-12-18

申请号：US12304019

申请日：2007-03-06

申请人： Shigeru Soga ,  Shunsuke Sakai

发明人： Shigeru Soga ,  Shunsuke Sakai

IPC分类号： H04L27/06 ,  H04L1/02 ,  H04B1/10

CPC分类号： H04B7/08 ,  H04B7/0802 ,  H04B7/0837 ,  H04L27/2647 ,  H04L27/2662 ,  H04W4/18 ,  H04W88/02

摘要： There is provided a diversity receiving apparatus (1) that comprises: a receiving unit (4) for receiving a frequency-division multiplexing signal on which a carrier group is multiplexed; a first demodulating unit (5) for outputting a first data carrier and a first transmission control carrier; a second demodulating unit (6) for outputting a second data carrier and a second transmission control carrier; a timing adjusting unit (7) for synchronizing processing timing of the first demodulating unit (5) and the second demodulating unit (6); a first combining/selecting unit (60) for combining or selecting a first transmission control carrier and a second transmission control carrier; a second combining/selecting unit (8) for combining or selecting a first data carrier and a second data carrier; a decoding unit (13) for decoding a transmission control signal using the transmission control carrier selected by the first combining/selecting unit (60); and a detecting unit (14) for detecting frame synchronization.

摘要翻译： 提供了一种分集接收装置（1），包括：接收单元（4），用于接收载波组复用的频分复用信号; 用于输出第一数据载体和第一传输控制载体的第一解调单元（5） 用于输出第二数据载体和第二传输控制载体的第二解调单元（6） 用于使第一解调单元（5）和第二解调单元（6）的处理定时同步的定时调整单元（7）; 用于组合或选择第一传输控制载体和第二传输控制载体的第一组合/选择单元（60） 用于组合或选择第一数据载体和第二数据载体的第二组合/选择单元（8） 解码单元，用于使用由所述第一组合/选择单元选择的所述传输控制载波来解码传输控制信号; 以及用于检测帧同步的检测单元（14）。

公开(公告)号：US20120142147A1

公开(公告)日：2012-06-07

申请号：US13369376

申请日：2012-02-09

申请人： Shunsuke SAKAI ,  Kenji Sato ,  Toshiki Furutani

发明人： Shunsuke SAKAI ,  Kenji Sato ,  Toshiki Furutani

IPC分类号： H01L21/762

CPC分类号： H05K1/0298 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/184 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/049 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole.

摘要翻译： 具有内置电子部件的布线基板包括芯基板，该芯基板具有形成在芯基板上的贯通孔，容纳在芯基板的贯通孔中的电子部件，形成在芯基板的第一面上的导电图案层 并且包括第一导电图案和第二导电图案，以及形成在导电图案层和芯基板的第一表面之上的层间绝缘层。 第二导电图案邻近穿透孔的周边形成并且成形为使得用于将电子部件定位在穿透孔中的片材相对于芯基板的第一表面在穿孔上水平地​​层叠。

公开(公告)号：US20110240354A1

公开(公告)日：2011-10-06

申请号：US13075480

申请日：2011-03-30

申请人： Naoki FURUHATA ,  Shunsuke Sakai ,  Yukinobu Mikado

发明人： Naoki FURUHATA ,  Shunsuke Sakai ,  Yukinobu Mikado

IPC分类号： H05K1/16 ,  H05K1/00 ,  H05K3/36

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3511 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09063 ,  H05K2201/09645 ,  H05K2201/09781 ,  H05K2203/0191 ,  H05K2203/1469 ,  Y10T29/49126

摘要： A wiring board including a substrate having a cavity, an electronic component accommodated in the cavity of the substrate, a first conductive pattern formed on a surface of the substrate and having a frame shape surrounding the opening of the cavity, a second conductive pattern formed on the surface of the substrate and outside the frame shape of the first conductive pattern, and an insulation layer formed on the surface of the substrate and covering the first conductive pattern, the second conductive pattern and the opening of the cavity. The first conductive pattern has a slit extending from the outside of the frame shape to the inside of the frame shape.

摘要翻译： 一种布线板，包括具有空腔的基板，容纳在所述基板的空腔中的电子部件，形成在所述基板的表面上并且具有围绕所述空腔的开口的框架形状的第一导电图案，形成在 基板的表面和第一导电图案的框架形状外部，以及形成在基板的表面上并覆盖第一导电图案，第二导电图案和空腔的开口的绝缘层。 第一导电图案具有从框架形状的外部延伸到框架形状的内部的狭缝。

公开(公告)号：US20100183097A1

公开(公告)日：2010-07-22

申请号：US12304019

申请日：2007-03-06

申请人： Shigeru Soga ,  Shunsuke Sakai

发明人： Shigeru Soga ,  Shunsuke Sakai

IPC分类号： H04L27/06

CPC分类号： H04B7/08 ,  H04B7/0802 ,  H04B7/0837 ,  H04L27/2647 ,  H04L27/2662 ,  H04W4/18 ,  H04W88/02

摘要： There is provided a diversity receiving apparatus (1) that comprises: a receiving unit (4) for receiving a frequency-division multiplexing signal on which a carrier group is multiplexed; a first demodulating unit (5) for outputting a first data carrier and a first transmission control carrier; a second demodulating unit (6) for outputting a second data carrier and a second transmission control carrier; a timing adjusting unit (7) for synchronizing processing timing of the first demodulating unit (5) and the second demodulating unit (6); a first combining/selecting unit (60) for combining or selecting a first transmission control carrier and a second transmission control carrier; a second combining/selecting unit (8) for combining or selecting a first data carrier and a second data carrier; a decoding unit (13) for decoding a transmission control signal using the transmission control carrier selected by the first combining/selecting unit (60); and a detecting unit (14) for detecting frame synchronization.

摘要翻译： 提供了一种分集接收装置（1），包括：接收单元（4），用于接收载波组复用的频分复用信号; 用于输出第一数据载体和第一传输控制载体的第一解调单元（5） 用于输出第二数据载体和第二传输控制载体的第二解调单元（6） 用于使第一解调单元（5）和第二解调单元（6）的处理定时同步的定时调整单元（7）; 用于组合或选择第一传输控制载体和第二传输控制载体的第一组合/选择单元（60） 用于组合或选择第一数据载体和第二数据载体的第二组合/选择单元（8） 解码单元，用于使用由所述第一组合/选择单元选择的所述传输控制载波来解码传输控制信号; 以及用于检测帧同步的检测单元（14）。

公开(公告)号：US08908387B2

公开(公告)日：2014-12-09

申请号：US13562683

申请日：2012-07-31

申请人： Yukinobu Mikado ,  Shunsuke Sakai ,  Takashi Kariya ,  Toshiki Furutani

发明人： Yukinobu Mikado ,  Shunsuke Sakai ,  Takashi Kariya ,  Toshiki Furutani

IPC分类号： H05K7/12 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K1/185 ,  H01G2/06 ,  H05K1/0207 ,  H05K1/115 ,  H05K3/30 ,  H05K3/32 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49146

摘要： A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.

摘要翻译： 布线板包括具有开口部分的基板，位于基板的开口部分中的电子部件，并且包括第一和第二电子部件，以及形成在基板和第一和第二部件上的绝缘层。 第一部件具有在第一部件的侧面具有侧部的第一电极和第二电极，第二部件具有第一部件和第二电极，第一部件的第一电极和第二电极具有在第二部件的侧面上的侧面部分，第一部件的第一电极和第一部件的第一电极 第二部件被设定为具有大致相同的电位，并且第一部件和第二部件位于基板的开口部分中，使得第一部件的第一电极的侧部位于第二部件的侧部 第二部件的第一电极。

公开(公告)号：US08642070B2

公开(公告)日：2014-02-04

申请号：US10588969

申请日：2005-04-27

申请人： Akira Okutani ,  Hiroaki Motoki ,  Eiji Tamura ,  Yumi Takashima ,  Shunsuke Sakai

发明人： Akira Okutani ,  Hiroaki Motoki ,  Eiji Tamura ,  Yumi Takashima ,  Shunsuke Sakai

IPC分类号： A23K1/17 ,  A23K1/165

CPC分类号： A61K31/198 ,  A23K20/105 ,  A23K20/158 ,  A23K40/35 ,  A23K50/10

摘要： The coating composition which coats the biologically active substance includes at least one protective material selected from the group consisting of a hardened animal fat, a hardened vegetable oil, a linear or branched, saturated or unsaturated aliphatic monocarboxylic acid having 12 to 22 carbon atoms, a fatty acid ester, and a wax group; lecithin; and at least one preservative selected from a propionic acid or its salt, a sorbic acid or its salt, a benzoic acid or its salt, a dehydroacetic acid or its salt, parahydroxybenzoic acid esters, an imazalil, a thiabendazole, an orthophenyl phenol, an orthophenyl phenol natrium, and a diphenyl.

摘要翻译： 涂覆生物活性物质的涂料组合物包括至少一种选自硬化动物脂肪，硬化植物油，具有12-22个碳原子的直链或支链，饱和或不饱和脂肪族单羧酸的保护材料， 脂肪酸酯和蜡基; 卵磷脂 和选自丙酸或其盐，山梨酸或其盐，苯甲酸或其盐的至少一种防腐剂，脱氢乙酸或其盐，对羟基苯甲酸酯，咪达唑仑，噻苯达唑，邻苯基苯酚， 邻苯基苯酚钠和二苯基。