公开(公告)号：US5053921A

公开(公告)日：1991-10-01

申请号：US601927

申请日：1990-10-23

Applicant: Gregory H. Nelson ,  Steven C. Lockard

Inventor： Gregory H. Nelson ,  Steven C. Lockard

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/64 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/642 ,  H05K3/205 ,  H05K3/4673 ,  B23K2203/05 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09918 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/107 ,  H05K3/0017 ,  H05K3/0035 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652

Abstract: An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has at least three layers of circuitry, one for signal transmission and two for voltage planes (power and ground). The interconnect device is made by a processing on a stainless steel carrier plate to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias between signal and voltage (power and ground) plane layers.

Abstract translation: 本发明提供了一种用于电子部件的互连装置，例如集成电路，多芯片模块等及其制造方法。 互连器件具有至少三层电路，一层用于信号传输，另一层用于电压平面（电源和接地）。 互连器件是通过在不锈钢载体板上的加工制成的，以实现高引线数能力，具有精细的线宽和间距，以及精确的配准层到层。 激光钻孔用于定义信号和电压（电源和接地）平面层之间的互连通孔。

公开(公告)号：US5459634A

公开(公告)日：1995-10-17

申请号：US973229

申请日：1992-11-06

Applicant: Gregory H. Nelson ,  Steven C. Lockard

Inventor： Gregory H. Nelson ,  Steven C. Lockard

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/64 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46 ,  H01G4/40

CPC classification number: H05K3/4673 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49894 ,  H01L23/642 ,  H05K3/205 ,  H05K3/4655 ,  B23K2203/05 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09918 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/107 ,  H05K3/0017 ,  H05K3/0035 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652

Abstract: An area array interconnect device (such as of the TAB type) has a plurality of input/output (I/O) leads for connection to an electronic device such as an IC. The interconnect device also has arrays of lead lines in areas remote from the I/O leads, e.g., central or internal areas, which are connected by vias to ground and/or power pads on corresponding areas of the electronic device.

Abstract translation: 区域阵列互连设备（例如TAB类型）具有多个用于连接到诸如IC的电子设备的输入/输出（I / O）引线。 互连设备还具有远离I / O引线的区域中的引线阵列，例如中心或内部区域，其通过通孔连接到电子设备的相应区域上的接地和/或电源焊盘。

公开(公告)号：US5096426A

公开(公告)日：1992-03-17

申请号：US639982

申请日：1991-01-11

Applicant: Scott S. Simpson ,  Steven C. Lockard ,  William P. Harper

Inventor： Scott S. Simpson ,  Steven C. Lockard ,  William P. Harper

IPC: H05K3/32 ,  H05K3/36

CPC classification number: H01R12/714 ,  H01R12/52 ,  H05K3/325 ,  H05K3/368 ,  Y10T29/4922

Abstract: A circuit board electrical interconnection system, including improved, elongated, bodily-rotatable interconnect elements, is disclosed. Each element has tab portions projection angularly from the opposing ends of the element, which tab portions define a pair of pad engagement surfaces. The pad engagement surfaces engage corresponding contact pads on opposing surfaces of two circuit boards by means of elastic support member. The element is divided longitudinally, axially or laterally into a plurality of sectors. Some sectors are electrically conductive, while others have other electrically predetermined characteristics. The two types of sectors are arranged in an alternating patter. The non-conducting sectors may be comprised of insulative, resistive or capacitive materials.

Abstract translation: 公开了一种电路板电互连系统，包括改进的，细长的，可以旋转的互连元件。 每个元件具有从元件的相对端成角度地突出的突片部分，该突片部分限定一对垫接合表面。 焊盘接合表面通过弹性支撑构件与两个电路板的相对表面上的相应接触焊盘接合。 该元件被纵向，轴向或横向划分为多个扇区。 一些扇区是导电的，而其它扇区具有其它电预定特性。 两种类型的扇区以交替的方式排列。 非导电扇区可以由绝缘，电阻或电容材料组成。

公开(公告)号：US4626958A

公开(公告)日：1986-12-02

申请号：US811673

申请日：1985-12-20

Applicant: Steven C. Lockard ,  Michael S. Hyslop ,  Jorge M. Hernandez

Inventor： Steven C. Lockard ,  Michael S. Hyslop ,  Jorge M. Hernandez

IPC: H01G2/12 ,  H01G4/228 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01G1/14 ,  H01L23/02

CPC classification number: H01G4/228 ,  H01G2/12 ,  H05K1/0231 ,  H05K1/18 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K3/3447 ,  Y10S257/916

Abstract: High frequency noise is decoupled from power supplied to a Pin Grid Array (PGA) package by insertion of a decoupling capacitor between the PGA package and printed circuit board. The decoupling capacitor comprises a dielectric material sandwiched between a pair of conductors and having a plurality of leads extending from each conductor. In accordance with the present invention, the decoupling capacitor is individually dimensioned and configured to fit under a PGA package and correspond to the power and ground pin configuration of that PGA package.

Abstract translation: 通过在PGA封装和印刷电路板之间插入去耦电容器，高频噪声与提供给引脚栅极阵列（PGA）封装的电源脱耦。 去耦电容器包括夹在一对导体之间并具有从每个导体延伸的多个引线的电介质材料。 根据本发明，去耦电容器被独立地尺寸设计成配置在PGA封装下并对应于该PGA封装的电源和接地引脚配置。

公开(公告)号：US5097393A

公开(公告)日：1992-03-17

申请号：US727009

申请日：1991-07-08

Applicant: Gregory H. Nelson ,  Steven C. Lockard

Inventor： Gregory H. Nelson ,  Steven C. Lockard

IPC: H01L23/14 ,  H01L23/498 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4673 ,  H01L23/142 ,  H01L23/49894 ,  H05K3/205 ,  H05K3/4655 ,  B23K2203/05 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09918 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K2203/107 ,  H05K3/0017 ,  H05K3/0035 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652

Abstract: An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has at least three layers of circuitry, one for signal transmission and two for voltage planes (power and ground). The interconnect device is made by a processing on a stainless steel carrier plate to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias between signal and voltage (power and ground) plane layers.

Abstract translation: 本发明提供了一种用于电子部件的互连装置，例如集成电路，多芯片模块等及其制造方法。 互连器件具有至少三层电路，一层用于信号传输，另一层用于电压平面（电源和接地）。 互连器件是通过在不锈钢载体板上的加工制成的，以实现高引线数能力，具有精细的线宽和间隔，以及精确的配准层到层。 激光钻孔用于定义信号和电压（电源和接地）平面层之间的互连通孔。