公开(公告)号：US08199456B2

公开(公告)日：2012-06-12

申请号：US12078648

申请日：2008-04-02

申请人： Sung-Taek Lim ,  Yul-Kyo Chung ,  Woon-Chun Kim

发明人： Sung-Taek Lim ,  Yul-Kyo Chung ,  Woon-Chun Kim

IPC分类号： H01G4/06

CPC分类号： H01G4/33 ,  H01G2/06 ,  H01G4/10 ,  H05K1/162 ,  H05K3/048 ,  H05K3/244 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/0315 ,  Y10T29/435

摘要： A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.

摘要翻译： 公开了电容器和制造该电容器的方法。 电容器可以包括板，形成在板的一侧上的聚合物层，选择性地形成在聚合物层上的电路图案，以及与电路图案对应的二氧化钛纳米片。 本发明的实施例可以提供板中的平坦度，并且允许板的铜保持其作为电极的功能，同时增加与二氧化钛纳米片的粘合性。 因此，二氧化钛纳米片可以在图案化的板上实现所需的形状，层数和厚度。

公开(公告)号：US07887879B2

公开(公告)日：2011-02-15

申请号：US12437672

申请日：2009-05-08

申请人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

发明人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC分类号： B05D3/12 ,  B05D1/40 ,  B05D5/12

CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

公开(公告)号：US07540913B2

公开(公告)日：2009-06-02

申请号：US11541673

申请日：2006-10-03

申请人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

发明人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC分类号： C09D185/00

CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

摘要翻译： 本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。 涂布溶液包含钛醇盐，β-二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。 该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。 含钛涂层溶液高度稳定。 此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

公开(公告)号：US07417870B2

公开(公告)日：2008-08-26

申请号：US11709156

申请日：2007-02-22

申请人： Sung Taek Lim ,  Yul Kyo Chung

发明人： Sung Taek Lim ,  Yul Kyo Chung

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01L2924/15311 ,  H05K1/162 ,  H05K1/185 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10734 ,  Y02P70/611

摘要： A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.

摘要翻译： 一种在低频带和无线电频带中具有优异的去耦功能的多层板。 多层板包括具有多层堆叠电介质层的电路板，通过通孔连接的电源端子，通过通孔连接的接地端子和连接到电源接地端子的集成电路部件。 多层板还包括连接到电源端子和集成电路部件的电力线单元和连接到接地端子和集成电路部件的接地线单元。 多层板还包括安装在板体上并连接在电源端子和形成在电路板主体上的接地端子之间的至少一个多层片式电容器，以及安装在电路板主体内并连接在电源之间的至少一个薄膜电容器 线路单元和地线单元。

公开(公告)号：US20070194876A1

公开(公告)日：2007-08-23

申请号：US11709156

申请日：2007-02-22

申请人： Sung Taek Lim ,  Yul Kyo Chung

发明人： Sung Taek Lim ,  Yul Kyo Chung

IPC分类号： H01F27/28

CPC分类号： H05K1/0231 ,  H01L2924/15311 ,  H05K1/162 ,  H05K1/185 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10734 ,  Y02P70/611

摘要： A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.

摘要翻译： 一种在低频带和无线电频带中具有优异的去耦功能的多层板。 多层板包括具有多层堆叠电介质层的电路板，通过通孔连接的电源端子，通过通孔连接的接地端子和连接到电源接地端子的集成电路部件。 多层板还包括连接到电源端子和集成电路部件的电力线单元和连接到接地端子和集成电路部件的接地线单元。 多层板还包括安装在板体上并连接在电源端子和形成在电路板主体上的接地端子之间的至少一个多层片式电容器，以及安装在电路板主体内并连接在电源之间的至少一个薄膜电容器 线路单元和地线单元。

公开(公告)号：US20130000965A1

公开(公告)日：2013-01-03

申请号：US13469614

申请日：2012-05-11

申请人： Dong Joo SHIN ,  Seong Min Chin ,  Moon Soo Park ,  Sung Taek Lim ,  Sung Hyun Kim ,  Choon Keun Lee

发明人： Dong Joo SHIN ,  Seong Min Chin ,  Moon Soo Park ,  Sung Taek Lim ,  Sung Hyun Kim ,  Choon Keun Lee

IPC分类号： H05K1/00 ,  C08K3/26 ,  C08K3/36 ,  H01B19/04

CPC分类号： H05K3/4676 ,  H01B3/40 ,  H05K1/0373 ,  H05K3/38 ,  H05K2201/0209 ,  H05K2203/0773

摘要： Disclosed herein are a dielectric composition of a multilayered circuit board including two types of inorganic fillers of 10 to 60 parts by weight with respect to an epoxy resin of 100 parts by weight, a multilayered printed circuit board including a dielectric layer manufactured of the dielectric composition, and a method for preparing the multilayered printed circuit board.According to the present invention, by mixing two types of inorganic fillers such as SiO2 and CaCO3 in manufacturing the dielectric layer of the multilayered circuit board, a high adhesive strength to a plating layer can be achieved without using a fluoride-based solution including 3NH4HF2 as an oxidant while etching the dielectric layer and furthermore, an environmentally hazardous substance can be prevented from being discharged.

摘要翻译： 本文公开了一种多层电路板的电介质组合物，其包含相对于100重量份的环氧树脂为10至60重量份的两种类型的无机填料，包括由电介质组合物制成的电介质层的多层印刷电路板 以及制备多层印刷电路板的方法。 根据本发明，通过在制造多层电路板的电介质层中混合两种无机填料如SiO 2和CaCO 3，可以在不使用包含3NH 4 HF 2的氟化物溶液作为 氧化剂，同时蚀刻电介质层，此外，可以防止对环境有害的物质的排出。

公开(公告)号：US20120206405A1

公开(公告)日：2012-08-16

申请号：US13396032

申请日：2012-02-14

申请人： Jae Il Kim ,  Sung Taek Lim ,  Jong Young Lee ,  Hyun Jun Kim

发明人： Jae Il Kim ,  Sung Taek Lim ,  Jong Young Lee ,  Hyun Jun Kim

IPC分类号： G06F3/044 ,  G06F3/045 ,  G06F3/041

CPC分类号： G06F3/0412

摘要： Disclosed herein is an operating module of a display device with a touch panel. The operating module includes a touch input unit for a user to input a value through a touch unit; a pattern input unit to which the same pattern image as patterns of a transparent electrode formed on the touch panel having the touch input unit is input; a control unit coupling each image signal into a single image signal according to an output value having a complementary pattern image value with the pattern image value input to the pattern input unit and an output value according to the input of the touch input unit; and an output unit outputting an image signal by the control unit.

摘要翻译： 这里公开了具有触摸面板的显示装置的操作模块。 操作模块包括用于用户通过触摸单元输入值的触摸输入单元; 输入与形成在具有触摸输入单元的触摸面板上的透明电极的图案相同的图案图像的图案输入单元; 控制单元根据具有互补图案图像值的输出值将每个图像信号耦合到单个图像信号，并且输入到图案输入单元的图案图像值和根据触摸输入单元的输入的输出值; 以及由控制单元输出图像信号的输出单元。

公开(公告)号：US20100270065A1

公开(公告)日：2010-10-28

申请号：US12507627

申请日：2009-07-22

申请人： Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

发明人： Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

IPC分类号： H05K1/03 ,  C08L63/00

CPC分类号： H05K1/0373 ,  C08G59/304 ,  C08L63/00 ,  C08L83/04 ,  H05K2201/0133 ,  H05K2201/0212 ,  C08L2666/14

摘要： Disclosed is a resin composition for a printed circuit board, which includes a complex epoxy resin including a bisphenol A epoxy resin obtained by dispersing silicone elastomer particles having a core-shell structure in a diglycidyl ether of bisphenol A epoxy resin, a cresol novolac epoxy resin, and a phosphorus-based epoxy resin; a bisphenol A curing agent; a curing accelerator; and an inorganic filler. A printed circuit board using the resin composition is also provided.

摘要翻译： 公开了一种用于印刷电路板的树脂组合物，其包括复合环氧树脂，其包括通过将双酚A环氧树脂的二缩水甘油醚中分散有具有核 - 壳结构的有机硅弹性体颗粒，甲酚酚醛环氧树脂 和磷系环氧树脂; 双酚A固化剂; 固化促进剂; 和无机填料。 还提供了使用该树脂组合物的印刷电路板。

公开(公告)号：US20100270064A1

公开(公告)日：2010-10-28

申请号：US12501919

申请日：2009-07-13

申请人： Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

发明人： Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

IPC分类号： H05K1/03 ,  E04B1/80

CPC分类号： C08G59/304 ,  C08L63/00 ,  H05K3/4676 ,  H05K2201/0209 ,  C08L2666/22

摘要： Disclosed is a resin composition for a printed circuit board, composed of a complex epoxy resin including 41˜80 wt % of a naphthalene-modified epoxy resin having an average epoxy resin equivalent of 100˜200 and 20˜59 wt % of a phosphorus-based epoxy resin having an average epoxy resin equivalent of 400˜800, a bisphenol A curing agent used in an equivalent ratio of 0.3˜1.5 with respect to a total epoxy group equivalent of the complex epoxy resin, a curing accelerator used in an amount of 0.1˜1 part by weight based on 100 parts by weight of the complex epoxy resin and an inorganic filler used in an amount of 10˜40 parts by weight based on 100 parts by weight of the complex epoxy resin. A printed circuit board using the resin composition is also provided.

摘要翻译： 公开了一种用于印刷电路板的树脂组合物，其包含复合环氧树脂，其包含41〜80重量％的平均环氧树脂当量为100〜200的萘改性环氧树脂和20〜59重量％ 平均环氧树脂当量为400〜800的双酚A型环氧树脂，相对于复合环氧树脂的总环氧当量比为0.3〜1.5当量比的双酚A固化剂，使用量为 相对于100重量份的复合环氧树脂，相对于100重量份的复合环氧树脂为0.1〜1重量份，使用量为10〜40重量份的无机填料。 还提供了使用该树脂组合物的印刷电路板。

公开(公告)号：US20090208640A1

公开(公告)日：2009-08-20

申请号：US12432221

申请日：2009-04-29

申请人： Won Hoon SONG ,  Yul Kyo Chung ,  Sung Taek Lim

发明人： Won Hoon SONG ,  Yul Kyo Chung ,  Sung Taek Lim

IPC分类号： B05D5/12 ,  C23C14/34

CPC分类号： H01L21/02197 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/02282 ,  H01L21/31683 ,  H01L21/31691 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： The invention relates to a fabrication method of a composite metal oxide dielectric film containing at least two metallic elements on a substrate, and a composite metal oxide dielectric film fabricated thereby. The method includes: forming an amorphous film containing at least one of the metallic elements; preparing a hydrothermal solution where a precursor of the remaining element of the metallic elements is mixed; immersing the amorphous film into the hydrothermal solution; and hydrothermally treating the amorphous film so that the remaining one of the metallic elements is synthesized to the amorphous film, thereby forming a crystallized composite metal oxide film.

摘要翻译： 本发明涉及在基板上含有至少两种金属元素的复合金属氧化物电介质膜的制造方法以及由此制造的复合金属氧化物电介质膜。 该方法包括：形成含有至少一种金属元素的非晶膜; 制备其中混合金属元素的剩余元素的前体的水热溶液; 将非晶膜浸入水热溶液中; 对该非晶质膜进行水热处理，使残留的金属元素与非晶质膜合成，从而形成结晶化复合金属氧化物膜。