METHOD FOR DETECTING PNEUMONIA CAUSATIVE BACTERIA USING NUCLEIC ACID CHROMATOGRAPHY
    1.
    发明申请
    METHOD FOR DETECTING PNEUMONIA CAUSATIVE BACTERIA USING NUCLEIC ACID CHROMATOGRAPHY 有权
    使用核酸色谱检测肺炎球菌引起的细菌的方法

    公开(公告)号:US20130023443A1

    公开(公告)日:2013-01-24

    申请号:US13637815

    申请日:2011-03-30

    IPC分类号: C40B30/04 C40B40/06

    摘要: Provided are a method and a kit for accurately and rapidly detecting ten types of targeting pneumonia bacteria: Streptococcus pneumoniae, Haemophilus influenzae, Mycoplasma pneumoniae, Chlamydophila pneumoniae, Legionella pneumophila, Klebsiella pneumoniae, Pseudomonas aeruginosa, Moraxella catarrhalis, methicillin-resistant Staphylococcus aureus (MRSA), and Staphylococcus aureus. A set of primer pairs directed to their respective target regions contained in the DnaJ gene, etc., of the ten types of pneumonia causative bacteria is designed for the ten bacterial strains and used to amplify gene products. A set of bacterial strain-specific probe pairs is further designed for the ten bacterial strains such that the probe pairs hybridize with the amplification products via sequences in the respective target regions differing from the sequences hybridized by the set of primer pairs. A first probe-bound labeled high molecular carrier in which plural types of first probes for the pneumonia bacteria are bound to a labeled high molecular carrier and a solid-phase second probe-carrying developing support are used as the set of probe pairs to perform nucleic acid chromatography.

    摘要翻译: 提供了用于准确和快速检测十种靶向性肺炎细菌的方法和试剂盒:肺炎链球菌,流感嗜血杆菌,肺炎支原体,肺炎衣原体,嗜肺军团菌,肺炎克雷伯菌,铜绿假单胞菌,卡他莫拉菌,耐甲氧西林金黄色葡萄球菌(MRSA) )和金黄色葡萄球菌(Staphylococcus aureus)。 针对十种类型肺炎致病细菌的DnaJ基因等中包含的各自靶区域的一组引物对设计用于十种细菌菌株并用于扩增基因产物。 针对10个细菌菌株进一步设计了一组细菌菌株特异性探针对,使得探针对通过与由该组引物对杂交的序列不同的各个靶区域中的序列与扩增产物进行杂交。 使用第一探针结合标记的高分子载体,其中用于肺炎细菌的多种类型的第一探针与标记的高分子载体结合,并且使用固相第二探针携带的显影载体作为探针对的一组以进行核酸 酸性色谱。

    Silicon object forming method and apparatus
    2.
    发明授权
    Silicon object forming method and apparatus 失效
    硅体形成方法和装置

    公开(公告)号:US07887677B2

    公开(公告)日:2011-02-15

    申请号:US11524207

    申请日:2006-09-21

    IPC分类号: C23C14/34

    摘要: A silicon object formation target substrate is arranged in a first chamber, a silicon sputter target is arranged in a second chamber communicated with the first chamber, plasma for chemical sputtering is formed from a hydrogen gas in the second chamber, chemical sputtering is effected on the silicon sputter target with the plasma thus formed, producing particles contributing to formation of silicon object, whereby a silicon object is formed, on the substrate, from the particles moved from the second chamber to the first chamber.

    摘要翻译: 硅物体形成目标衬底被布置在第一腔室中,硅溅射靶设置在与第一腔室连通的第二室中,用于化学溅射的等离子体由第二腔室中的氢气形成,化学溅射 由此形成等离子体的硅溅射靶,产生有助于硅物体形成的颗粒,由此在从第二室移动到第一室的颗粒的基底上形成硅物体。

    Silicon dot forming method and silicon dot forming apparatus
    5.
    发明申请
    Silicon dot forming method and silicon dot forming apparatus 失效
    硅点形成方法和硅点形成装置

    公开(公告)号:US20070007123A1

    公开(公告)日:2007-01-11

    申请号:US11519154

    申请日:2006-09-12

    IPC分类号: C23C14/32 C23C14/00

    摘要: There are provided a method and an apparatus which form silicon dots having substantially uniform particle diameters and exhibiting a substantially uniform density distribution directly on a substrate at a low temperature. A hydrogen gas (or a hydrogen gas and a silane-containing gas) is supplied into a vacuum chamber (1) provided with a silicon sputter target (e.g., target 30), or the hydrogen gas and the silane-containing gas are supplied into the chamber (1) without arranging the silicon sputter target therein, a high-frequency power is applied to the gas(es) so that plasma is generated such that a ratio (Si(288 nm)/Hβ) between an emission intensity Si(288 nm) of silicon atoms at a wavelength of 288 nm and an emission intensity Hβ of hydrogen atoms at a wavelength of 484 nm in plasma emission is 10.0 or lower, and preferably 3.0 or lower, or 0.5 or lower, and silicon dots (SiD) having particle diameters of 20 nm or lower, or 10 nm or lower are formed directly on the substrate (S) at a low temperature of 500 deg. C. or lower in the plasma (and with chemical sputtering if a silicon sputter target is present).

    摘要翻译: 提供了形成具有基本上均匀的粒径并且在低温下直接在基底上表现出基本均匀的密度分布的硅点的方法和装置。 将氢气(或氢气和含硅烷气体)供给到设置有硅溅射靶(例如,靶30)的真空室(1)中,或者将氢气和含硅烷的气体供应到 在不将硅溅射靶设置在其中的腔室(1)中,向气体施加高频功率,从而产生等离子体,使得发射强度Si(((nm)/ Hbeta) 288nm波长的硅原子和等离子体发射波长为484nm的氢原子的发光强度Hbeta为10.0以下,优选为3.0以下,0.5以下,硅点(SiD ),在500度的低温下直接在基板(S)上形成粒径为20nm以下或10nm以下的粒径。 在等离子体中(如果存在硅溅射靶,则具有化学溅射)。

    Silicon object forming method and apparatus
    7.
    发明申请
    Silicon object forming method and apparatus 失效
    硅体形成方法和装置

    公开(公告)号:US20080035471A1

    公开(公告)日:2008-02-14

    申请号:US11524207

    申请日:2006-09-21

    IPC分类号: C23C14/00

    摘要: A silicon object formation target substrate is arranged in a first chamber, a silicon sputter target is arranged in a second chamber communicated with the first chamber, plasma for chemical sputtering is formed from a hydrogen gas in the second chamber, chemical sputtering is effected on the silicon sputter target with the plasma thus formed, producing particles contributing to formation of silicon object, whereby a silicon object is formed, on the substrate, from the particles moved from the second chamber to the first chamber.

    摘要翻译: 硅物体形成目标衬底被布置在第一腔室中,硅溅射靶设置在与第一腔室连通的第二室中,用于化学溅射的等离子体由第二腔室中的氢气形成,化学溅射 由此形成等离子体的硅溅射靶,产生有助于硅物体形成的颗粒,由此在从第二室移动到第一室的颗粒的基底上形成硅物体。

    Silicon dot forming method and silicon dot forming apparatus
    10.
    发明授权
    Silicon dot forming method and silicon dot forming apparatus 失效
    硅点形成方法和硅点形成装置

    公开(公告)号:US07988835B2

    公开(公告)日:2011-08-02

    申请号:US11519154

    申请日:2006-09-12

    摘要: There are provided a method and an apparatus which form silicon dots having substantially uniform particle diameters and exhibiting a substantially uniform density distribution directly on a substrate at a low temperature. A hydrogen gas (or a hydrogen gas and a silane-containing gas) is supplied into a vacuum chamber (1) provided with a silicon sputter target (e.g., target 30), or the hydrogen gas and the silane-containing gas are supplied into the chamber (1) without arranging the silicon sputter target therein, a high-frequency power is applied to the gas(es) so that plasma is generated such that a ratio (Si(288 nm)/Hβ) between an emission intensity Si(288 nm) of silicon atoms at a wavelength of 288 nm and an emission intensity Hβ of hydrogen atoms at a wavelength of 484 nm in plasma emission is 10.0 or lower, and preferably 3.0 or lower, or 0.5 or lower, and silicon dots (SiD) having particle diameters of 20 nm or lower, or 10 nm or lower are formed directly on the substrate (S) at a low temperature of 500 deg. C. or lower in the plasma (and with chemical sputtering if a silicon sputter target is present).

    摘要翻译: 提供了形成具有基本上均匀的粒径并且在低温下直接在基底上表现出基本均匀的密度分布的硅点的方法和装置。 将氢气(或氢气和含硅烷气体)供给到设置有硅溅射靶(例如,靶30)的真空室(1)中,或者将氢气和含硅烷的气体供应到 在不将硅溅射靶设置在其中的腔室(1)中,向气体施加高频功率,从而产生等离子体,使得发射强度Si(288nm)的比率(Si(288nm)/ H&bgr)) (288nm)的波长288nm的硅原子和发光强度H&bgr; 的等离子体发射波长为484nm的氢原子为10.0以下,优选为3.0以下,或0.5以下,形成粒径为20nm以下或10nm以下的硅点(SiD) 在500度的低温下直接在基板(S)上。 在等离子体中(如果存在硅溅射靶,则具有化学溅射)。