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28 条记录 (耗时 0.016 秒)

    Stacked Electronic Components, Method and Apparatus for Aligning Electronic Components
    1.
    发明申请
    Stacked Electronic Components, Method and Apparatus for Aligning Electronic Components 有权
    堆叠电子元件，电子元件对齐方法和装置

    公开(公告)号：US20110235299A1

    公开(公告)日：2011-09-29

    申请号：US12748997

    申请日：2010-03-29

    申请人： Chi Kuen Vincent Leung ,  Bin Xie ,  Xunqing Shi

    发明人： Chi Kuen Vincent Leung ,  Bin Xie ,  Xunqing Shi

    IPC分类号： H05K1/14 ,  H05K3/30 ,  B23P19/00

    CPC分类号： H01L21/67333 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2225/1058 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

    摘要： A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

    摘要翻译： 一种对准电子部件的方法，包括提供具有至少一个结构120的定位部件110，用于接收电子部件; 所述至少一个结构具有用于限制电子部件的运动的横向边界35,36; 将第一电子部件10a放置在所述至少一个结构中; 并且提供用于使所述第一电子部件与所述至少一个结构的横向边界主动对准的力。 例如，可以通过倾斜定位构件，通过提供抽吸或通过使用致动器来提供力。 还公开了一种用于对准电子部件的装置和堆叠的电子部件的3D系统。

    Power control scheme for a power amplifier
    2.
    发明授权
    Power control scheme for a power amplifier 有权
    功率放大器的功率控制方案

    公开(公告)号：US07974596B2

    公开(公告)日：2011-07-05

    申请号：US11646055

    申请日：2006-12-27

    申请人： Lysander Lim ,  David Pehlke ,  John Khoury ,  Vincent Leung

    发明人： Lysander Lim ,  David Pehlke ,  John Khoury ,  Vincent Leung

    IPC分类号： H01Q11/12 ,  H04B1/04

    CPC分类号： H04W52/52

    摘要： In one embodiment, a method includes detecting a power level of a power amplifier coupled to a transceiver during a current burst of a radio communication and providing the detected power level from the power amplifier to the transceiver and controlling a power level of the power amplifier during a next burst based on the detected power level of the current burst.

    摘要翻译： 在一个实施例中，一种方法包括检测在无线电通信的当前突发期间耦合到收发器的功率放大器的功率电平，并且将检测到的功率电平从功率放大器提供给收发器，并且控制功率放大器的功率电平 基于当前突发的检测到的功率电平的下一脉冲串。

    ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF
    3.
    发明申请
    ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF 有权
    电子封装及其制造方法

    公开(公告)号：US20100246141A1

    公开(公告)日：2010-09-30

    申请号：US12415416

    申请日：2009-03-31

    申请人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Chung

    发明人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Chung

    IPC分类号： H05K7/00 ,  B29C47/00

    CPC分类号： H01L24/96 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/00

    摘要： One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of a module stack, wherein the first and second modules are adhesively connected together, each module includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice, in each module the die or dice are bonded on said substrate layer via the metal layer, a plurality of channels formed generally vertically acting as vias to connect the metal layers and arranged adjacent to the die or dice in at least one of the modules, some or all the channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby the dice are electrically connected together, and means serving as an intermediary for providing electrical, mechanical and thermal connectivity, communication externally and connected to the channels.

    摘要翻译： 本发明的一个方面提供了一种电子封装，其包括至少第一模块和布置在第一模块的顶部上的第二模块，模块以模块堆叠的形式在一起，其中第一模块和第二模块被粘合地连接在一起 每个模块包括在每个模块中具有至少一个金属层，至少一个模具和塑料模塑复合层的基底层，模具或模具中的模具或模具经由 金属层，多个通道形成，大体垂直地作为过孔形成，以连接金属层并且在至少一个模块中邻近模具或裸片设置，一些或全部通道设置有涂覆有导电材料层的内表面 或者用导电材料填充以进行电连接，由此骰子电连接在一起，以及作为用于提供电，机械和 rmal连接，外部通信和通道连接。

    Adaptive Bias Current Circuit and Method for Amplifiers
    4.
    发明申请
    Adaptive Bias Current Circuit and Method for Amplifiers 有权
    自适应偏置电流电路和放大器的方法

    公开(公告)号：US20070252646A1

    公开(公告)日：2007-11-01

    申请号：US10587414

    申请日：2005-02-14

    申请人： Vincent Leung ,  Prasad Gudem ,  Lawrence Larsen

    发明人： Vincent Leung ,  Prasad Gudem ,  Lawrence Larsen

    IPC分类号： H03F3/189 ,  H03G3/20

    CPC分类号： H03F1/0266 ,  H03F1/22 ,  H03F3/19 ,  H03F3/4508 ,  H03F2200/18 ,  H03F2200/451 ,  H03F2200/465 ,  H03F2203/45112 ,  H03F2203/45154 ,  H03F2203/45394 ,  H03F2203/45481

    摘要： An adaptive bias method and circuits for amplifiers that provide a substantial current boost based at least partly upon a sensed input power of an amplifier circuit. Methods and circuits of the invention provide an additional bias current based upon the sensed input power. Circuits of the invention may be simple, area-efficient, low-power, stable and digitally-programmable. In addition, methods and circuits of the invention may be used with a number of amplifier circuit configurations, including amplifiers having either inductor and/or resistive degeneration.

    摘要翻译： 用于放大器的自适应偏置方法和电路，其至少部分地基于放大器电路的感测输入功率来提供实质的电流升压。 本发明的方法和电路基于感测的输入功率提供额外的偏置电流。 本发明的电路可以是简单的，区域有效的，低功率的，稳定的和数字可编程的。 此外，本发明的方法和电路可以与许多放大器电路配置一起使用，包括具有电感和/或电阻退化的放大器。

    Radiant tubes arrangement in low NOx furnace
    5.
    发明申请
    Radiant tubes arrangement in low NOx furnace 审中-公开
    辐射管布置在低NOx炉中

    公开(公告)号：US20060188417A1

    公开(公告)日：2006-08-24

    申请号：US11063813

    申请日：2005-02-23

    申请人： James Roth ,  Vincent Leung ,  Brian Doerksen ,  Robin McGlynn

    发明人： James Roth ,  Vincent Leung ,  Brian Doerksen ,  Robin McGlynn

    IPC分类号： B01J10/00

    CPC分类号： B01J8/062 ,  B01J6/004 ,  C10G9/20

    摘要： System and method are disclosed for increasing the effectiveness of the lower tubes in a delayed coker furnace. The system and method involve arranging the tubes so that the lower tubes are as close to the heat source as the upper tubes. Such an arrangement allows all the tubes to have substantially the same amount of radiant flux. In some implementations, it is also possible to conform the refractory floor to the arrangement of the tubes.

    摘要翻译： 公开了用于提高延迟焦化炉中下管的有效性的系统和方法。 该系统和方法包括布置管，使得下管与上管近似于热源。 这种布置允许所有管具有基本相同量的辐射通量。 在一些实施方案中，还可以使耐火地板与管的布置一致。

    Reducing power consumption by in-circuit measurement of receive band attenuation and/or noise
    7.
    发明授权
    Reducing power consumption by in-circuit measurement of receive band attenuation and/or noise 失效
    通过在线测量接收频带衰减和/或噪声降低功耗

    公开(公告)号：US08774874B2

    公开(公告)日：2014-07-08

    申请号：US12794239

    申请日：2010-06-04

    申请人： Prasad S. Gudem ,  Bhushan Asuri ,  Soon-Seng Lau ,  Wingching Vincent Leung

    发明人： Prasad S. Gudem ,  Bhushan Asuri ,  Soon-Seng Lau ,  Wingching Vincent Leung

    IPC分类号： H04B1/38

    CPC分类号： H04B1/1027 ,  H03F1/02 ,  H03F3/24 ,  H04B1/525 ,  H04B2001/045 ,  H04W52/0245 ,  Y02D70/1242 ,  Y02D70/164 ,  Y02D70/40

    摘要： Although the duplexer in a full-duplex transceiver circuit may only be guaranteed by the duplexer manufacturer to have a transmit band rejection from its TX port to its RX port of a certain amount, and may only be guaranteed to have a receive band rejection of another amount, the actual transmit band rejection and the actual receive band rejection of a particular instance of the duplexer may be better than specified. Rather than consuming excess power in the receiver and/or transmitter in order to meet performance requirements assuming the duplexer only performs as well as specified, the duplexer's in-circuit performance is measured as part of a transmitter-to-receiver isolation determination. Transmitter and/or receiver power settings are reduced where possible to take advantage of the measured better-than-specified in-circuit duplexer performance, while still meeting transceiver performance requirements. Power settings are not changed during normal transmit and receive mode operation.

    摘要翻译： 虽然全双工收发器电路中的双工器可能只能由双工器制造商保证从其TX端口到其一定数量的RX端口的发射波段抑制，并且只能保证具有另一个的接收频带抑制 数量，双工器的特定实例的实际发射频带抑制和实际接收频带抑制可能优于指定的。 假设双工器仅执行指定，而不是在接收机和/或发射机中消耗多余的功率，以满足性能要求，则双工器的在线性能是作为发射机到接收机隔离确定的一部分进行测量的。 发射机和/或接收机功率设置在可能的情况下可以减少，以便在仍然满足收发器性能要求的同时利用测得的优于指定的在线双工器性能。 在正常的发送和接收模式操作期间，电源设置不会改变。

    Electronic package with stacked modules with channels passing through metal layers of the modules
    8.
    发明授权
    Electronic package with stacked modules with channels passing through metal layers of the modules 有权
    具有堆叠模块的电子封装，通道通过模块的金属层

    公开(公告)号：US08194411B2

    公开(公告)日：2012-06-05

    申请号：US12415416

    申请日：2009-03-31

    申请人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Tom Chung

    发明人： Chi Kuen Vincent Leung ,  Peng Sun ,  Xunqing Shi ,  Chang Hwa Tom Chung

    IPC分类号： H05K1/18

    CPC分类号： H01L24/96 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/00

    摘要： One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of a module stack, wherein the first and second modules are adhesively connected together, each module includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice, in each module the die or dice are bonded on said substrate layer via the metal layer, a plurality of channels formed generally vertically acting as vias to connect the metal layers and arranged adjacent to the die or dice in at least one of the modules, some or all the channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby the dice are electrically connected together, and means serving as an intermediary for providing electrical, mechanical and thermal connectivity, communication externally and connected to the channels.

    摘要翻译： 本发明的一个方面提供了一种电子封装，其包括至少第一模块和布置在第一模块的顶部上的第二模块，模块以模块堆叠的形式在一起，其中第一模块和第二模块被粘合地连接在一起 每个模块包括在每个模块中具有至少一个金属层，至少一个模具和塑料模塑复合层的基底层，模具或模具中的模具或模具经由 金属层，多个通道形成，大体垂直地作为过孔形成，以连接金属层并且在至少一个模块中邻近模具或裸片设置，一些或全部通道设置有涂覆有导电材料层的内表面 或填充导电材料用于电连接，由此骰子电连接在一起，以及作为用于提供电，机械和 rmal连接，外部通信和通道连接。