公开(公告)号：US20150318237A1

公开(公告)日：2015-11-05

申请号：US14651533

申请日：2013-03-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Alejandro Aldrin II Agcaoili Narag ,  Ravi Palaniswamy ,  Antonny Enojo Flor

IPC: H01L23/498 ,  H01L33/62 ,  H01S5/022 ,  H01L33/48

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/49894 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01S5/02272 ,  H01S5/02276 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.

Abstract translation: 提供了一种用于支撑LESD的物品，其包括具有在其上具有导电层的第一主表面和第二主表面的电介质层，所述电介质层具有从第二主表面延伸到第一主表面的至少三个通孔，导电 层，其至少包括第一和第二导电特征，其中所述第一导电特征与至少第一通孔的开口相邻，并且所述第二导电特征与至少第二和第三通孔的开口相邻。

公开(公告)号：US20190035993A1

公开(公告)日：2019-01-31

申请号：US16135317

申请日：2018-09-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  B32B15/08 ,  B32B27/28 ,  H01L33/48 ,  H01L33/58 ,  B32B7/12 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US09754869B2

公开(公告)日：2017-09-05

申请号：US14651533

申请日：2013-03-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Alejandro Aldrin II Agcaoili Narag ,  Ravi Palaniswamy ,  Bee Leng Tan ,  Antonny Enojo Flor

IPC: H01L23/49 ,  H01L33/62 ,  H01L33/64 ,  H01L23/498 ,  H01S5/022 ,  H01L33/48

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/49894 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01S5/02272 ,  H01S5/02276 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.

公开(公告)号：US09564568B2

公开(公告)日：2017-02-07

申请号：US14859512

申请日：2015-09-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Arokiaraj Jesudoss ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Fong Liang Tan ,  Andrew J. Ouderkirk ,  Justine A. Mooney

IPC: H05K1/02 ,  H01L33/64 ,  H01L33/48 ,  H01L23/00 ,  H01L33/60 ,  H01L33/62 ,  H05K1/18

CPC classification number: H01L33/647 ,  H01L24/17 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0203 ,  H05K1/0277 ,  H05K1/183 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00

Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.

Abstract translation: 一种制品包括具有第一和第二主表面的柔性聚合物电介质层。 第一主表面上具有导电层，其中至少有一个空腔。 所述至少一个腔包含导电材料，所述导电材料包括电分离的第一和第二部分，所述第一和第二部分支撑并将发光半导体器件电连接到第一主表面上的导电层。

公开(公告)号：US10424707B2

公开(公告)日：2019-09-24

申请号：US16135317

申请日：2018-09-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  B32B15/08 ,  H05K1/03 ,  B32B7/12 ,  B32B27/28 ,  H01L33/48 ,  H01L33/58 ,  H05K1/18 ,  H05K3/28

Abstract: Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

公开(公告)号：US10128422B2

公开(公告)日：2018-11-13

申请号：US14886776

申请日：2015-10-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Jian Xia Gao ,  Justine A. Mooney

IPC: H01L33/62 ,  H01L33/64 ,  H01S5/024 ,  H01L33/48 ,  H01L23/498 ,  H01S5/022

Abstract: Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.

公开(公告)号：US20170104143A1

公开(公告)日：2017-04-13

申请号：US15316028

申请日：2015-05-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ravi Palaniswamy ,  Alejandro Aldrin II Agcaoili Narag ,  Siang Sin Foo ,  Hiromitsu Kosugi

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/48

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.