公开(公告)号：US20160088724A1

公开(公告)日：2016-03-24

申请号：US14958006

申请日：2015-12-03

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： CHIH-HENG CHUO ,  GWUN-JIN LIN ,  KUO-FU SU

IPC: H05K1/02 ,  H01P3/02 ,  H05K1/11

CPC classification number: H05K1/0224 ,  H01P3/02 ,  H01P3/026 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K2201/058

Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.

Abstract translation: 公开了一种用于电路板的高频连接焊盘的接地图案结构。 电路板的基板包括一个部件表面，在该部件表面上至少有一对高频连接焊盘。 至少一对差模信号线形成在基板上并连接到高频连接焊盘。 衬底的接地表面包括形成在对应于差动模式信号线的位置处的接地层。 衬底的接地表面包括形成在其上的接地图案结构，以对应于与高频连接焊盘相邻的位置。 接地图结构与接地层电连接。 基板的部件表面可以设置有安装在其上的连接器，其中连接器的信号端子焊接到高频连接焊盘。

公开(公告)号：US20150029685A1

公开(公告)日：2015-01-29

申请号：US14138364

申请日：2013-12-23

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： GWUN-JIN LIN ,  CHIH-HENG CHUO ,  KUO-FU SU

IPC: H01R35/02 ,  H01R12/61

CPC classification number: H01R35/02 ,  H05K1/028 ,  H05K1/118 ,  H05K5/0226 ,  H05K2201/055 ,  H05K2201/2009 ,  Y10T29/49002

Abstract: Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the connection section and an extended sheet are wound up in a direction towards the terminal distribution section to form the connection section into a rolled body with the extended sheet wrapped around the rolled body to provide an effect of protection. The rolled body is then inserted through a bore of a hinge assembly so that after the rolled body completely passes through the bore of the hinge assembly, the extension section of the flexible circuit board is located in the bore of the hinge assembly and the first end and the second end are respectively set at opposite ends of the bore of the hinge assembly. In other applications, a reinforcement plate is included to reinforce the terminal distribution section of the flexible circuit board.

Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组装结构。 利用形成在作为中心线的预先准备好的柔性电路板上的预折线，将柔性电路板的连接部折叠到端子分配部，然后将连接部和延伸片卷起 在朝向终端分配部分的方向上，将连接部分形成为卷绕体，其中延伸的片材缠绕在卷绕体上以提供保护效果。 然后将卷绕的主体插入通过铰链组件的孔，使得在卷绕体完全通过铰链组件的孔之后，柔性电路板的延伸部分位于铰链组件的孔中，并且第一端 并且第二端分别设置在铰链组件的孔的相对端。 在其他应用中，包括加强板以加强柔性电路板的端子分配部分。

公开(公告)号：US20140374147A1

公开(公告)日：2014-12-25

申请号：US14108790

申请日：2013-12-17

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： GWUN-JIN LIN ,  KUO-FU SU ,  CHIH-HENG CHUO

IPC: H05K1/02

CPC classification number: H05K1/0245 ,  H05K1/0225 ,  H05K1/118 ,  H05K3/4069 ,  H05K2201/09845

Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.

Abstract translation: 柔性电路板的差分信号传输线的衰减降低接地结构包括柔性基板，在该柔性基板上至少有一对差模信号线，至少一个接地线，覆盖绝缘层和薄金属箔 形成层。 至少一个通孔延伸穿过薄金属箔层和覆盖绝缘层，并且对应于接地线的导电接触区。 通孔填充有导电膏层，以将薄金属箔层电连接到接地线的导电接触区域，以提供良好的接地布置。 薄金属箔层包括形成在对应于差模信号线的顶角的位置处的多个开口。

公开(公告)号：US20140290989A1

公开(公告)日：2014-10-02

申请号：US14307652

申请日：2014-06-18

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K3/06 ,  H05K1/11

CPC classification number: H05K1/115 ,  H05K1/028 ,  H05K1/0298 ,  H05K3/002 ,  H05K3/426 ,  Y10T29/49165

Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

公开(公告)号：US20170325331A1

公开(公告)日：2017-11-09

申请号：US15450204

申请日：2017-03-06

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： CHIH-HENG CHUO ,  KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0245 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/024 ,  H05K1/0253 ,  H05K1/032 ,  H05K2201/09336

Abstract: A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.

公开(公告)号：US20160234937A1

公开(公告)日：2016-08-11

申请号：US14731709

申请日：2015-06-05

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/118 ,  H05K3/3405 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/10356 ,  H05K2201/2027

Abstract: Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a plurality of elevation pads are formed and respectively located in spacing zones between contact pads. Each of the elevation pads has a height above a top contact surface of the contact pads. The conductor assembly has exposed conductors that are respectively set in contact with the top contact surfaces of the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the top contact surfaces of the contact pads. Each of the elevation pads includes an extension section extended in a direction toward a front edge of the substrate.

Abstract translation: 公开了用于连接导体组件和柔性电路板的接触焊盘连接结构。 衬底具有其上形成有多个仰角垫的顶表面，并且分别位于接触垫之间的间隔区域中。 每个仰角垫具有高于接触垫的顶部接触表面的高度。 导体组件具有分别设置成与接触焊盘的顶部接触表面接触的暴露的导体，并且施加焊料材料以将暴露的导体分别焊接并固定在接触焊盘的顶部接触表面上的适当位置。 每个仰角垫包括在朝向基板的前边缘的方向延伸的延伸部分。

公开(公告)号：US20160183371A1

公开(公告)日：2016-06-23

申请号：US14659977

申请日：2015-03-17

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/06 ,  H05K1/09

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/092 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/0397 ,  H05K2201/09845 ,  H05K2201/09854

Abstract: Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of a flexible circuit board and a first exposed zone is defined. A second conductive layer includes a second through hole formed therein and defines a second exposed zone. A dielectric layer includes a dielectric layer through hole corresponding to the second through hole of the second conductive layer. A conductive paste layer is filled in the second through hole of the second conductive layer, the dielectric layer through hole of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste layer covers and electrically contacts the first exposed zone of the first conductive layer and the second exposed zone of the second conductive layer.

Abstract translation: 柔性电路板的尿素微孔结构及其制造方法。 在柔性电路板的第一导电层中形成第一通孔，并且限定第一暴露区域。 第二导电层包括形成在其中的第二通孔并且限定第二暴露区域。 电介质层包括与第二导电层的第二通孔对应的电介质层通孔。 导电膏层填充在第二导电层的第二通孔，电介质层的电介质层通孔和第一导电层的第一通孔中，导电膏层覆盖并电接触 第一导电层的第一暴露区域和第二导电层的第二暴露区域。

公开(公告)号：US20150102874A1

公开(公告)日：2015-04-16

申请号：US14478322

申请日：2014-09-05

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： CHIH-HENG CHUO ,  KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/118 ,  H05K1/024 ,  H05K1/025 ,  H05K1/117 ,  H05K2201/0191

Abstract: An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.

Abstract translation: 电路板的衰减减小结构包括在高频信号接触焊盘和电路板的接地层之间形成的膨胀厚度。 膨胀的厚度大于接地层和高频信号线之间的参考厚度。 电路板由聚对苯二甲酸乙二醇酯（PET）或聚酰亚胺（PI）制成。 或者，使用包括树脂和纤维材料的刚性板或刚挠板。 电路板可以是通过组合至少两个单层电路板而形成的单层电路板或多层板。 在高频信号接触焊盘和接地层之间安装厚度扩大的焊盘，或者增加电路板的接合层的一部分的厚度以提供膨胀的厚度。

公开(公告)号：US20150027751A1

公开(公告)日：2015-01-29

申请号：US14068029

申请日：2013-10-31

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/02

CPC classification number: H05K1/024 ,  H01B7/0838 ,  H01B7/0861 ,  H05K1/0242 ,  H05K1/025 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/0323 ,  H05K2201/09236 ,  H05K2201/098 ,  H05K2201/09881

Abstract: A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.

Abstract translation: 柔性电路板的平面化覆盖层结构包括通过第一粘合剂层粘合到布置在柔性电路板的基板上的每个导电信号线的表面的绝缘层。 分别在相邻的导电信号线之间形成的分离区域各自形成有填充层，使得填充层在分离区域中为第一粘合剂层提供平坦化高度，并且平坦化高度基本上等于 导电信号线。 填充层可以替代地具有比导体层的表面高一个覆盖高度的高度，使得第一粘合剂层在分离区域中具有平坦化高度，并且平坦化高度基本上等于高度 的导电信号线和覆盖高度。

公开(公告)号：US20140144678A1

公开(公告)日：2014-05-29

申请号：US14068041

申请日：2013-10-31

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： GWUN-JIN LIN ,  KUO-FU SU ,  CHIH-HENG CHUO

IPC: H01R12/59

CPC classification number: H01R12/592 ,  H01R43/0256

Abstract: Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.

Abstract translation: 公开了一种用于将至少一个连接器安装在柔性电路板上的焊接结构。 连接器包括SMD引脚和焊锡引脚。 柔性电路板具有连接器安装部分，其具有形成有SMD焊接区域和焊料浸渍针孔的部件表面。 加强板联接到柔性电路板的加强结合表面。 加强板具有与柔性电路板的焊料浸渍针孔相对应的通孔。 连接器的SMD引脚分别焊接到柔性电路板的SMD焊接区域，连接器的焊料浸渍引脚分别插入柔性电路板的焊料浸渍针孔和 加强板加固板的焊接表面，以焊接材料焊接。