公开(公告)号：US20170325331A1

公开(公告)日：2017-11-09

申请号：US15450204

申请日：2017-03-06

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： CHIH-HENG CHUO ,  KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0245 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/024 ,  H05K1/0253 ,  H05K1/032 ,  H05K2201/09336

Abstract: A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.

公开(公告)号：US20160234937A1

公开(公告)日：2016-08-11

申请号：US14731709

申请日：2015-06-05

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/118 ,  H05K3/3405 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/10356 ,  H05K2201/2027

Abstract: Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a plurality of elevation pads are formed and respectively located in spacing zones between contact pads. Each of the elevation pads has a height above a top contact surface of the contact pads. The conductor assembly has exposed conductors that are respectively set in contact with the top contact surfaces of the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the top contact surfaces of the contact pads. Each of the elevation pads includes an extension section extended in a direction toward a front edge of the substrate.

Abstract translation: 公开了用于连接导体组件和柔性电路板的接触焊盘连接结构。 衬底具有其上形成有多个仰角垫的顶表面，并且分别位于接触垫之间的间隔区域中。 每个仰角垫具有高于接触垫的顶部接触表面的高度。 导体组件具有分别设置成与接触焊盘的顶部接触表面接触的暴露的导体，并且施加焊料材料以将暴露的导体分别焊接并固定在接触焊盘的顶部接触表面上的适当位置。 每个仰角垫包括在朝向基板的前边缘的方向延伸的延伸部分。

公开(公告)号：US20160183371A1

公开(公告)日：2016-06-23

申请号：US14659977

申请日：2015-03-17

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/06 ,  H05K1/09

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/092 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/0397 ,  H05K2201/09845 ,  H05K2201/09854

Abstract: Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of a flexible circuit board and a first exposed zone is defined. A second conductive layer includes a second through hole formed therein and defines a second exposed zone. A dielectric layer includes a dielectric layer through hole corresponding to the second through hole of the second conductive layer. A conductive paste layer is filled in the second through hole of the second conductive layer, the dielectric layer through hole of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste layer covers and electrically contacts the first exposed zone of the first conductive layer and the second exposed zone of the second conductive layer.

Abstract translation: 柔性电路板的尿素微孔结构及其制造方法。 在柔性电路板的第一导电层中形成第一通孔，并且限定第一暴露区域。 第二导电层包括形成在其中的第二通孔并且限定第二暴露区域。 电介质层包括与第二导电层的第二通孔对应的电介质层通孔。 导电膏层填充在第二导电层的第二通孔，电介质层的电介质层通孔和第一导电层的第一通孔中，导电膏层覆盖并电接触 第一导电层的第一暴露区域和第二导电层的第二暴露区域。

公开(公告)号：US20150102874A1

公开(公告)日：2015-04-16

申请号：US14478322

申请日：2014-09-05

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： CHIH-HENG CHUO ,  KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/118 ,  H05K1/024 ,  H05K1/025 ,  H05K1/117 ,  H05K2201/0191

Abstract: An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.

Abstract translation: 电路板的衰减减小结构包括在高频信号接触焊盘和电路板的接地层之间形成的膨胀厚度。 膨胀的厚度大于接地层和高频信号线之间的参考厚度。 电路板由聚对苯二甲酸乙二醇酯（PET）或聚酰亚胺（PI）制成。 或者，使用包括树脂和纤维材料的刚性板或刚挠板。 电路板可以是通过组合至少两个单层电路板而形成的单层电路板或多层板。 在高频信号接触焊盘和接地层之间安装厚度扩大的焊盘，或者增加电路板的接合层的一部分的厚度以提供膨胀的厚度。

公开(公告)号：US20150027751A1

公开(公告)日：2015-01-29

申请号：US14068029

申请日：2013-10-31

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： KUO-FU SU ,  GWUN-JIN LIN

IPC: H05K1/02

CPC classification number: H05K1/024 ,  H01B7/0838 ,  H01B7/0861 ,  H05K1/0242 ,  H05K1/025 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/0323 ,  H05K2201/09236 ,  H05K2201/098 ,  H05K2201/09881

Abstract: A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.

Abstract translation: 柔性电路板的平面化覆盖层结构包括通过第一粘合剂层粘合到布置在柔性电路板的基板上的每个导电信号线的表面的绝缘层。 分别在相邻的导电信号线之间形成的分离区域各自形成有填充层，使得填充层在分离区域中为第一粘合剂层提供平坦化高度，并且平坦化高度基本上等于 导电信号线。 填充层可以替代地具有比导体层的表面高一个覆盖高度的高度，使得第一粘合剂层在分离区域中具有平坦化高度，并且平坦化高度基本上等于高度 的导电信号线和覆盖高度。

公开(公告)号：US20140144678A1

公开(公告)日：2014-05-29

申请号：US14068041

申请日：2013-10-31

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： GWUN-JIN LIN ,  KUO-FU SU ,  CHIH-HENG CHUO

IPC: H01R12/59

CPC classification number: H01R12/592 ,  H01R43/0256

Abstract: Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.

Abstract translation: 公开了一种用于将至少一个连接器安装在柔性电路板上的焊接结构。 连接器包括SMD引脚和焊锡引脚。 柔性电路板具有连接器安装部分，其具有形成有SMD焊接区域和焊料浸渍针孔的部件表面。 加强板联接到柔性电路板的加强结合表面。 加强板具有与柔性电路板的焊料浸渍针孔相对应的通孔。 连接器的SMD引脚分别焊接到柔性电路板的SMD焊接区域，连接器的焊料浸渍引脚分别插入柔性电路板的焊料浸渍针孔和 加强板加固板的焊接表面，以焊接材料焊接。

公开(公告)号：US20140014409A1

公开(公告)日：2014-01-16

申请号：US13690344

申请日：2012-11-30

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： GWUN-JIN LIN ,  KUO-FU SU

IPC: H02G15/08

CPC classification number: H02G15/08 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09254

Abstract: A differential mode signal transmission module includes a first section having an external connection end on which at least a pair of differential mode signal transmission terminals are formed and includes a grounding terminal, a first differential mode signal terminal, and a second differential mode signal terminal. The extension connection end of the first section forms a counterpart signal terminals corresponding to those of the external connection end. At least one first conductive connection line is formed on the first section. The conductive connection line connects the grounding terminal of the external connection end of the first section to a collective grounding point. The extension connection end of the first section is connected to an extension section. The extension section is further connected to a second section opposite to the first section. The extension section includes at least one slit line in order to form a bundled section. The first section, the second section, and the extension section include at least one fold line.

Abstract translation: 差分模式信号传输模块包括具有外部连接端的第一部分，在该第一部分上形成有至少一对差模信号传输端子，并且包括接地端子，第一差分模式信号端子和第二差分模式信号端子。 第一部分的延伸连接端形成与外部连接端对应的对应信号端子。 在第一部分上形成至少一个第一导电连接线。 导电连接线将第一部分的外部连接端的接地端子连接到集合接地点。 第一部分的延伸连接端连接到扩展部分。 延伸部分进一步连接到与第一部分相对的第二部分。 延伸部分包括至少一条狭缝线以形成捆扎部分。 第一部分，第二部分和扩展部分包括至少一个折线。

公开(公告)号：US20190245286A1

公开(公告)日：2019-08-08

申请号：US16387833

申请日：2019-04-18

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： CHIH-HENG CHUO ,  KUO-FU SU

IPC: H01R12/65 ,  H01R12/69 ,  H01R12/61 ,  G01R31/28 ,  H05K1/11 ,  H01R12/79 ,  H05K1/02

CPC classification number: H01R12/65 ,  G01R31/2818 ,  H01R12/613 ,  H01R12/69 ,  H01R12/79 ,  H05K1/0281 ,  H05K1/118 ,  H05K2201/09409 ,  H05K2201/09445

Abstract: A pressure adaptive contact structure for a flexible circuit board is disclosed, in which the flexible circuit board is provided with a weakening portion or a partly surrounding weakening portion between a plurality of first contact pads so that contact surfaces of the plurality of first contact pads are respectively contactable with corresponding ones of contact points to generate contact pressing forces applied to the contact points in a manner that the contact pressing forces are adaptively adjustable by the weakening portion to accommodate height differences between adjacent ones of the first contact pads to prevent the first contact pads from being stretched and pulled with respect to each other.

公开(公告)号：US20190045633A1

公开(公告)日：2019-02-07

申请号：US15670232

申请日：2017-08-07

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： CHIH-HENG CHUO ,  KUO-FU SU

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03

Abstract: A stacked flexible printed circuit board assembly with a side connection section is provided, including a first flexible printed circuit board, a second flexible printed circuit board, and a curved connection section. The curved connection section is integrally connected to and between side edges of the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board is folded in a direction toward and thus stacked on the second flexible printed circuit board such that a plurality of first contact pads of the first flexible printed circuit board correspond respectively to a plurality of second contact pads of the second flexible printed circuit board. A height adjustment layer or an adhesive layer is provided between the first flexible printed circuit board and the second flexible printed circuit board to suit the need of thickness in plugging or soldering.

公开(公告)号：US20160088724A1

公开(公告)日：2016-03-24

申请号：US14958006

申请日：2015-12-03

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： CHIH-HENG CHUO ,  GWUN-JIN LIN ,  KUO-FU SU

IPC: H05K1/02 ,  H01P3/02 ,  H05K1/11

CPC classification number: H05K1/0224 ,  H01P3/02 ,  H01P3/026 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K2201/058

Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.

Abstract translation: 公开了一种用于电路板的高频连接焊盘的接地图案结构。 电路板的基板包括一个部件表面，在该部件表面上至少有一对高频连接焊盘。 至少一对差模信号线形成在基板上并连接到高频连接焊盘。 衬底的接地表面包括形成在对应于差动模式信号线的位置处的接地层。 衬底的接地表面包括形成在其上的接地图案结构，以对应于与高频连接焊盘相邻的位置。 接地图结构与接地层电连接。 基板的部件表面可以设置有安装在其上的连接器，其中连接器的信号端子焊接到高频连接焊盘。