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公开(公告)号：US20160211426A1
公开(公告)日：2016-07-21
申请号：US14834690
申请日：2015-08-25
发明人： CHIEN-SHIANG HUANG , TZU-CHIEN HUNG
CPC分类号： H01L33/62 , H01L2933/0066
摘要： A light emitting diode module includes a substrate, a first soldering section, a second soldering section, a block and a light emitting diode die. The substrate has a top surface and includes a circuit structure. The block is formed on the top surface. The soldering section and the second solder section are formed on the top surface of the substrate and electrically connected with the circuit structure. The block is positioned between the first soldering section and the second solder section. A height of the block is larger than thicknesses of the first soldering section and the second soldering section. The light emitting diode die includes a first electrode and a second electrode being respectively electrically connected to the first soldering section and the second soldering section. The block is positioned between the first soldering section and the second soldering section.
摘要翻译： 发光二极管模块包括基板，第一焊接部分，第二焊接部分，块体和发光二极管管芯。 衬底具有顶表面并且包括电路结构。 该块形成在顶表面上。 焊接部分和第二焊接部分形成在基板的顶表面上并与电路结构电连接。 该块位于第一焊接部分和第二焊接部分之间。 块的高度大于第一焊接部和第二焊接部的厚度。 发光二极管管芯包括分别电连接到第一焊接部分和第二焊接部分的第一电极和第二电极。 该块位于第一焊接部和第二焊接部之间。
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公开(公告)号：US20180212105A1
公开(公告)日：2018-07-26
申请号：US15634997
申请日：2017-06-27
发明人： PO-MIN TU , CHIEN-SHIANG HUANG , CHIEN-CHUNG PENG , TZU-CHIEN HUNG , SHIH-CHENG HUANG , CHANG-HO CHEN , TSAU-HUA HSIEH , JONG-JAN LEE , PAUL-JOHN SCHUELE
CPC分类号： H01L33/38 , H01L33/0079 , H01L33/12 , H01L33/24 , H01L33/44 , H01L2933/0016 , H01L2933/0025
摘要： A flip chip light emitting diode includes a semiconductor layer comprising an epitaxial layer an N-semiconductor layer, a light active layer and a P-semiconductor layer arranged from top to bottom in series. A first electrode mounted on the semiconductor layer. A second electrode mounted on the semiconductor layer. A insulating layer mounted on the semiconductor layer. The N-semiconductor layer protrudes away from the epitaxial layer to form a protruding portion. The light active layer and the P-semiconductor layer mounts on the protruding portion in series. The insulating layer mounts between the first electrode and the protruding portion, the light active layer, the P-semiconductor layer and the second electrode. The flip chip light emitting diode also comprises a supporting portion, the supporting portion is mounted on a top surface of the epitaxial layer by a connecting portion. The connecting portion has same or different materials with the supporting portion.
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公开(公告)号：US20160211416A1
公开(公告)日：2016-07-21
申请号：US14879111
申请日：2015-10-09
发明人： CHIEN-SHIANG HUANG , TZU-CHIEN HUNG
CPC分类号： H01L33/40 , H01L33/38 , H01L33/405
摘要： An LED die includes a base, and an N-typed semiconductor layer, an active layer and a P-typed semiconductor layer formed on the base that order. The LED die also includes an N-electrode and a P-electrode. The N-electrode is arranged on the N-typed semiconductor layer and electrically connected therewith. The P-electrode is arranged on the P-typed semiconductor layer and electrically connected therewith. The LED die further includes a barrier layer arranged between the P-typed semiconductor layer and the P-electrode. The barrier layer includes at least two materials of Cr, Ni and Ti. The at least two materials of Cr, Ni and Ti are stacked together to form the barrier layer.
摘要翻译： LED芯片包括基底，N基类型的半导体层，有源层和形成在基底上的P型半导体层。 LED管芯还包括N电极和P电极。 N电极配置在N型半导体层上并与其电连接。 P电极配置在P型半导体层上并与其电连接。 LED芯片还包括布置在P型半导体层和P电极之间的阻挡层。 阻挡层包括至少两种Cr，Ni和Ti的材料。 将Cr，Ni和Ti的至少两种材料堆叠在一起以形成阻挡层。
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公开(公告)号：US20190128951A1
公开(公告)日：2019-05-02
申请号：US15824601
申请日：2017-11-28
发明人： PO-MIN TU , TZU-CHIEN HUNG , CHIA-HUI SHEN , CHIEN-SHIANG HUANG , CHIEN-CHUNG PENG , YA-WEN LIN , CHING-HSUEH CHIU
IPC分类号： G01R31/26 , H01L33/20 , H01L33/00 , H01L33/36 , H01L33/62 , H01L33/48 , H01L25/075 , H01L23/00
CPC分类号： G01R31/2635 , H01L24/92 , H01L24/94 , H01L25/0753 , H01L33/0008 , H01L33/005 , H01L33/20 , H01L33/36 , H01L33/483 , H01L33/62 , H01L2933/0016 , H01L2933/0025
摘要： A detection method for an LED chip comprising the following steps: providing a container with a solvent therein, and putting the LED chips in the container to mix the LED chips with the solvent; providing a base with a circuit therein, the base forms a plurality of receiving holes, a bottom of each receiving holes have an N electrode and a P electrode coupled with the circuit; transferring the solvent and the LED chip mixed in the solvent on the base; detecting the LED chip received in the receiving holes; providing a carrier film and classifying the LED chips on the carrier film.
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公开(公告)号：US20180040785A1
公开(公告)日：2018-02-08
申请号：US15492164
申请日：2017-04-20
CPC分类号： H01L33/46 , H01L33/38 , H01L33/507 , H01L33/54 , H01L33/56
摘要： A light emitting diode include a light emitting chip, a first reflecting layer surrounding the light emitting diode chip, a first encapsulation layer and a second encapsulation layer covering on the light emitting diode chip. The light emitting chip has a light exiting surface, a first electrode and a second electrode. the first electrode and the second electrode are located opposite to the light exiting surface. Further, a second reflecting layer surrounds the periphery of the light emitting chip and also locates between the first encapsulation layer and the second encapsulation layer. A reflectivity of the first reflecting layer is greater than a reflectivity of the first reflecting layer. A bottom surface of the first electrode and the second electrode are exposed from the first reflecting layer.
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公开(公告)号：US20160064614A1
公开(公告)日：2016-03-03
申请号：US14826397
申请日：2015-08-14
发明人： CHIEN-SHIANG HUANG , TZU-CHIEN HUNG
IPC分类号： H01L33/44
CPC分类号： H01L33/44 , H01L33/486 , H01L2224/73204 , H01L2933/0025 , H01L2933/0033
摘要： A light emitting diode package includes a substrate, a light emitting diode mounted on the substrate by flip chip bonding and a protective layer. The light emitting diode includes an epitaxial layer, a first electrode and a second electrode on the epitaxial layer. The first electrode and the second electrode are spaced apart from each other. The first and second electrodes are embedded in the protective layer. This disclosure also relates to a method for manufacturing the light emitting diode package.
摘要翻译： 发光二极管封装包括衬底，通过倒装芯片焊接安装在衬底上的发光二极管和保护层。 发光二极管包括在外延层上的外延层，第一电极和第二电极。 第一电极和第二电极彼此间隔开。 第一和第二电极嵌入在保护层中。 本公开还涉及一种用于制造发光二极管封装的方法。
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公开(公告)号：US20210074884A1
公开(公告)日：2021-03-11
申请号：US16950715
申请日：2020-11-17
摘要： A light emitting diode structure includes a first electrode, a second electrode, and an epitaxial structure. The epitaxial structure is divided into a base area and a structural supporting area. The base area includes a bottom portion and a top portion. The top portion protrudes from a surface of the bottom portion along a single direction. The light emitting diode structure is square. The structural supporting area is positioned at a side of the top portion and protrudes from the surface of the bottom portion beside the top portion along the same direction. A top of the structural supporting area is aligned with a top of the top portion. The first electrode is arranged on the top of the top portion. The second electrode is arranged on the top of the structural supporting area. The second electrode arranged on the structural supporting area is aligned with the first electrode.
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公开(公告)号：US20190198712A1
公开(公告)日：2019-06-27
申请号：US16290625
申请日：2019-03-01
CPC分类号： H01L33/20 , H01L33/06 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/46 , H01L33/62 , H01L2933/0016
摘要： A light emitting diode structure includes a first electrode, a second electrode, and an epitaxial structure. The epitaxial structure is divided into a base area and a structural supporting area. The base area includes a bottom portion and a top portion. The top portion protrudes from a surface of the bottom portion along a single direction. The light emitting diode structure is square. The structural supporting area is positioned at a side of the top portion and protrudes from the surface of the bottom portion beside the top portion along the same direction. A top of the structural supporting area is aligned with a top of the top portion. The first electrode is arranged on the top of the top portion. The second electrode is arranged on the top of the structural supporting area. The second electrode arranged on the structural supporting area is aligned with the first electrode.
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公开(公告)号：US20160064595A1
公开(公告)日：2016-03-03
申请号：US14695365
申请日：2015-04-24
发明人： CHIEN-SHIANG HUANG , TZU-CHIEN HUNG
IPC分类号： H01L33/00
CPC分类号： H01L33/005 , H01L33/44 , H01L33/486 , H01L33/647 , H01L2933/0016 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2933/0075
摘要： A method for manufacturing a light emitting diode (LED) package, the method includes providing an LED chip and forming electrodes on a top surface of the LED chip; forming a first electric insulation layer on the top surface of the LED chip, the first electric insulation layer adapted to enclose the electrodes therein; etching the first electric insulation layer to define a plurality of second through holes; forming a substrate on a top surface of the first electric insulation layer, the substrate adapted to fill in the plurality of second through holes, the substrate directly contacting the electrodes; dividing the substrate into a plurality of spaced heat dissipation parts; and forming a packaging layer on a bottom surface of the substrate, the packaging layer adapted to enclose the LED chip therein.
摘要翻译： 一种制造发光二极管（LED）封装的方法，该方法包括提供LED芯片并在LED芯片的顶表面上形成电极; 在所述LED芯片的顶表面上形成第一电绝缘层，所述第一电绝缘层适于将所述电极包围在其中; 蚀刻第一电绝缘层以限定多个第二通孔; 在所述第一电绝缘层的顶表面上形成衬底，所述衬底适于填充所述多个第二通孔，所述衬底直接接触所述电极; 将基板分成多个间隔开的散热部件; 以及在所述基底的底表面上形成包装层，所述包装层适于将所述LED芯片包围在其中。
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公开(公告)号：US20190140136A1
公开(公告)日：2019-05-09
申请号：US15833190
申请日：2017-12-06
发明人： PO-MIN TU , TZU-CHIEN HUNG , CHIA-HUI SHEN , CHIEN-SHIANG HUANG , CHIEN-CHUNG PENG , YA-WEN LIN , CHING-HSUEH CHIU
CPC分类号： H01L33/0079 , H01L33/007 , H01L33/0095 , H01L33/32 , H01L33/38 , H01L2933/0016
摘要： A method for manufacturing light emitting diode crystal grains includes steps of providing a first substrate; forming a buffer layer on the first substrate; forming a UV blocking layer on buffer layer; and forming a plurality of light emitting diode crystal grains on the buffer layer. The emitting diode crystal grains together form a wafer. An auxiliary substrate is provided and coated with an adhesive layer. The auxiliary substrate is pressed to the wafer, the adhesive layer fills gaps between the light emitting diode crystal grains, and solidifies the adhesive layer. The second surface is irradiated and gasified. The first substrate is thus separated from the UV blocking layer and the adhesive layer is dissolved, thus achieving a plurality of light-emitting diode crystal grains.
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