公开(公告)号：US20220181268A1

公开(公告)日：2022-06-09

申请号：US17111350

申请日：2020-12-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN ,  Meng-Wei HSIEH ,  Yu-Pin TSAI

IPC: H01L23/552 ,  H01L21/50 ,  H01L23/31

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

公开(公告)号：US20230078564A1

公开(公告)日：2023-03-16

申请号：US17990645

申请日：2022-11-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN ,  Meng-Wei HSIEH ,  Yu-Pin TSAI

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/50

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

公开(公告)号：US20190206843A1

公开(公告)日：2019-07-04

申请号：US16297470

申请日：2019-03-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hao LYU ,  Chieh-Ju TSAI ,  Yu-Kai LIN ,  Wei-Ming HSIEH ,  Yu-Pin TSAI ,  Man-Wen TSENG ,  Yu-Ting LU

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/427 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L23/28

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/28 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/427 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2224/83

Abstract: A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.

公开(公告)号：US20170125310A1

公开(公告)日：2017-05-04

申请号：US15409434

申请日：2017-01-18

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Yu-Cheng TSAO ,  Cheng-Hung WANG ,  Chun-Chieh LIN ,  Hsiu-Hsiung YANG ,  Yu-Pin TSAI

IPC: H01L21/66 ,  H01L21/683 ,  H01L21/78

CPC classification number: H01L22/14 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/11 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/94 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/014

Abstract: The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.

公开(公告)号：US20210074664A1

公开(公告)日：2021-03-11

申请号：US16565158

申请日：2019-09-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/29 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US20210005761A1

公开(公告)日：2021-01-07

申请号：US16503318

申请日：2019-07-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Tsung-Yueh TSAI ,  Teck-Chong LEE

IPC: H01L31/02 ,  H01L25/16 ,  H01L31/0203

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.

公开(公告)号：US20180061813A1

公开(公告)日：2018-03-01

申请号：US15675617

申请日：2017-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Ming HSIEH ,  Yu-Pin TSAI ,  Man-Wen TSENG ,  Li-Hao LYU

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/28 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/427 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2224/83

Abstract: A semiconductor device package including a first encapsulation layer, a redistribution layer disposed on the first encapsulation layer, a first die disposed on the redistribution layer, a second encapsulation layer covering the first die and the redistribution layer, and an electrical connection terminal electrically connected to the redistribution layer. The first encapsulation layer has a first surface and a second surface different from the first surface. The first encapsulation layer surrounds a portion of the electrical connection terminal and exposes the electrical connection terminal.

公开(公告)号：US20240063163A1

公开(公告)日：2024-02-22

申请号：US18498931

申请日：2023-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Ming-Chi LIU ,  Yu-Ting LU ,  Kai-Chiang HSU ,  Che-Ting LIU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L24/24 ,  H01L23/3128 ,  H01L24/05 ,  H01L23/295 ,  H01L23/49838 ,  H01L24/25 ,  H01L25/105 ,  H01L21/6836 ,  H01L21/78 ,  H01L21/565 ,  H01L24/19 ,  H01L24/97 ,  H01L23/49827 ,  H01L2924/35121 ,  H01L2221/68381 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/19102 ,  H01L2224/2518 ,  H01L2224/24226

Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.

公开(公告)号：US20220020885A1

公开(公告)日：2022-01-20

申请号：US17488076

申请日：2021-09-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Tsung-Yueh TSAI ,  Teck-Chong LEE

IPC: H01L31/02 ,  H01L25/16 ,  H01L31/0203

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.

公开(公告)号：US20180061727A1

公开(公告)日：2018-03-01

申请号：US15675612

申请日：2017-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hao LYU ,  Chieh-Ju TSAI ,  Yu-Kai LIN ,  Wei-Ming HSIEH ,  Yu-Pin TSAI ,  Man-Wen TSENG ,  Yu-Ting LU

IPC: H01L23/28 ,  H01L23/498 ,  H01L23/427 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/28 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/427 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06586 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2224/83

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.