公开(公告)号：US08671754B2

公开(公告)日：2014-03-18

申请号：US13629911

申请日：2012-09-28

Applicant: Agency for Science, Technology and Research

Inventor： Allen Hum ,  Man I Lei ,  Julius Ming Lin Tsai

IPC: G01D11/24 ,  G01L19/14 ,  G01P1/02 ,  G01L19/04

CPC classification number: G01L19/04 ,  G01L9/0047 ,  G01L19/0681

Abstract: In various embodiments, a sensor device is provided. The sensor includes a sensor receiving portion, a sensor arranged in the sensor receiving portion and a cap covering the sensor and the sensor receiving portion. The cap includes a plurality of recesses in the inner side wall of the cap for reducing the pressure measured by the sensor.

Abstract translation: 在各种实施例中，提供了一种传感器装置。 传感器包括传感器接收部分，布置在传感器接收部分中的传感器和覆盖传感器和传感器接收部分的盖。 所述盖包括在所述盖的内侧壁中的多个凹部，用于降低由所述传感器测量的压力。

公开(公告)号：US20160289063A1

公开(公告)日：2016-10-06

申请号：US14778514

申请日：2014-04-17

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Ilker E. Ocak ,  Julius Ming Lin Tsai ,  Navab Singh

IPC: B81B7/00 ,  G01P15/125 ,  G01R33/028 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00285 ,  B81C2203/0118 ,  B81C2203/0172 ,  G01C19/56 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0828 ,  G01R33/00 ,  G01R33/0052 ,  G01R33/0286 ,  H01L25/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electromechanical device and method of fabrication thereof comprising: providing a first wafer with a circuit arrangement on a first surface thereof and a first electrode on a second surface thereof; forming first and second via structures from the first surface to the second surface of the first wafer, said first via electrically connecting the first electrode with the circuit arrangement; providing a second wafer with a suspended structure on a first surface thereof; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer that electrically connects with the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, with the second via structure electrically connecting the circuit arrangement to the interconnect structure, and the first and second electrodes forming a capacitive structure.

Abstract translation: 一种机电装置及其制造方法，包括：在其第一表面上提供具有电路装置的第一晶片和在其第二表面上的第一电极; 从所述第一晶片的第一表面到所述第二表面形成第一和第二通孔结构，所述第一通孔将所述第一电极与所述电路装置电连接; 在其第一表面上提供具有悬挂结构的第二晶片; 在所述悬挂结构上形成第二电极; 在与第二电极电连接的第二晶片的第一表面上形成互连结构; 将第一晶片接合到第二晶片，其中第一晶片的第二表面面向第二晶片的第一表面，其中第二通孔结构将电路装置电连接到互连结构，并且第一和第二电极形成电容结构 。

公开(公告)号：US10463304B2

公开(公告)日：2019-11-05

申请号：US14897578

申请日：2014-06-12

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  SINGAPORE HEALTH SERVICES PTE. LTD.

Inventor： Wai Pan Chan ,  Margarita Sofia Narducci ,  Yuan Gao ,  Julius Ming Lin Tsai ,  Ruiqi Lim ,  Ming-Yuan Cheng ,  Abdur Rub Abdur Rahman ,  Mi Kyoung Park ,  Minkyu Je ,  Jai Prashanth Rao

IPC: A61B5/00 ,  A61B5/01 ,  A61B5/03 ,  A61B5/145 ,  A61B5/1486

Abstract: There is provided a monolithically integrated multimodal sensor device for intracranial neuromonitoring, the sensor device including: a single substrate; a temperature sensor formed on a first portion of the single substrate for detecting temperature; a pressure sensor formed on a second portion of the single substrate for detecting intracranial pressure; and an oxygen sensor formed on a third portion of the single substrate for detecting oxygen concentration. In particular, sensing portions of the temperature sensor, the oxygen sensor and the pressure sensor, respectively, are formed at different layers of the sensor device. There is also provided an integrated multimodal sensor system incorporating the sensor device and the associated methods of fabrication.

公开(公告)号：US09650237B2

公开(公告)日：2017-05-16

申请号：US14778514

申请日：2014-04-17

Applicant: Agency for Science, Technology and Research

Inventor： Ilker E. Ocak ,  Julius Ming Lin Tsai ,  Navab Singh

IPC: B81B7/00 ,  H01L25/00 ,  G01C19/56 ,  G01R33/00 ,  G01R33/028 ,  G01P15/08 ,  G01P15/125 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00285 ,  B81C2203/0118 ,  B81C2203/0172 ,  G01C19/56 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0828 ,  G01R33/00 ,  G01R33/0052 ,  G01R33/0286 ,  H01L25/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electromechanical device and method of fabrication thereof comprising: providing a first wafer with a circuit arrangement on a first surface thereof and a first electrode on a second surface thereof; forming first and second via structures from the first surface to the second surface of the first wafer, said first via electrically connecting the first electrode with the circuit arrangement; providing a second wafer with a suspended structure on a first surface thereof; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer that electrically connects with the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, with the second via structure electrically connecting the circuit arrangement to the interconnect structure, and the first and second electrodes forming a capacitive structure.

公开(公告)号：US09510121B2

公开(公告)日：2016-11-29

申请号：US14442800

申请日：2013-12-06

Applicant: Agency for Science, Technology and Research

Inventor： Jinghui Xu ,  Julius Ming Lin Tsai

IPC: H04R7/04 ,  H04R29/00 ,  H04R1/00 ,  H04R1/04 ,  H04R1/32 ,  H04R3/00 ,  H04R19/00 ,  H04R31/00

CPC classification number: H04R29/004 ,  H04R1/04 ,  H04R1/326 ,  H04R3/00 ,  H04R3/005 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003 ,  H04R2499/11

Abstract: According to embodiments of the present invention, a transducer is provided. The transducer includes a substrate, and a diaphragm suspended from the substrate, wherein the diaphragm is displaceable in response to an acoustic signal impinging on the diaphragm, wherein the transducer is configured, in a first mode of operation, to determine a direction of the acoustic signal based on a first displacement of the diaphragm in the first mode of operation, and to decide to accept or reject the acoustic signal based on at least one predetermined parameter and the determined direction of the acoustic signal, and in a second mode of operation, to sense the acoustic signal based on a second displacement of the diaphragm in the second mode of operation if the acoustic signal is accepted in the first mode of operation.

Abstract translation: 根据本发明的实施例，提供了一种换能器。 所述换能器包括衬底和从所述衬底悬挂的隔膜，其中所述隔膜响应于撞击所述隔膜的声学信号而移位，其中所述换能器被配置为在第一操作模式中以确定所述声学的方向 基于第一操作模式中的振膜的第一位移的信号，并且基于至少一个预定参数和所确定的声信号的方向来决定接受或拒绝声信号，并且在第二操作模式中， 如果在第一操作模式中接受声信号，则基于第二操作模式中的振膜的第二位移来感测声信号。

公开(公告)号：US09354283B2

公开(公告)日：2016-05-31

申请号：US14071766

申请日：2013-11-05

Applicant: Agency for Science, Technology and Research

Inventor： Ilker Ender Ocak ,  Julius Ming Lin Tsai

IPC: G01R33/02 ,  G01R33/028

CPC classification number: G01R33/0286

Abstract: According to embodiments of the present invention, a sensor is provided. The sensor includes a substrate, a beam suspended from the substrate, and a plurality of conductive lines arranged on the beam, wherein the beam is adapted to be displaced in response to a current flowing through the plurality of conductive lines, and a magnetic field interacting with the beam, and wherein the sensor is configured to determine a property of the magnetic field based on the displacement of the beam. According to further embodiments of the present invention, a method of controlling a sensor is also provided.

Abstract translation: 根据本发明的实施例，提供了一种传感器。 传感器包括基板，从基板悬挂的光束和布置在光束上的多条导线，其中光束适于响应于流过多条导线的电流而移位，并且磁场相互作用 并且其中所述传感器被配置为基于所述梁的位移来确定所述磁场的特性。 根据本发明的另外的实施例，还提供了一种控制传感器的方法。

公开(公告)号：US20140125325A1

公开(公告)日：2014-05-08

申请号：US14071766

申请日：2013-11-05

Applicant: Agency for Science, Technology and Research

Inventor： Ilker Ender Ocak ,  Julius Ming Lin Tsai

IPC: G01R33/02

CPC classification number: G01R33/0286

Abstract: According to embodiments of the present invention, a sensor is provided. The sensor includes a substrate, a beam suspended from the substrate, and a plurality of conductive lines arranged on the beam, wherein the beam is adapted to be displaced in response to a current flowing through the plurality of conductive lines, and a magnetic field interacting with the beam, and wherein the sensor is configured to determine a property of the magnetic field based on the displacement of the beam. According to further embodiments of the present invention, a method of controlling a sensor is also provided.

Abstract translation: 根据本发明的实施例，提供了一种传感器。 传感器包括基板，从基板悬挂的光束和布置在光束上的多条导线，其中光束适于响应于流经多条导线的电流移位，并且磁场相互作用 并且其中所述传感器被配置为基于所述梁的位移来确定所述磁场的特性。 根据本发明的另外的实施例，还提供了一种控制传感器的方法。