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公开(公告)号：US20190393117A1
公开(公告)日：2019-12-26
申请号：US16014278
申请日：2018-06-21
IPC分类号： H01L23/367 , H01L23/498 , H01L23/373
摘要： A component carrier having a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and an array of exposed highly thermally conductive cooling structures integrally formed with the stack and defining cooling channels in between is disclosed.
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公开(公告)号：US20180358302A1
公开(公告)日：2018-12-13
申请号：US15780019
申请日：2016-11-30
IPC分类号： H01L23/552 , H01L23/31 , H01L23/538 , H01L23/00 , H01L21/48 , H01L21/56
CPC分类号： H01L23/552 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L23/3107 , H01L23/3114 , H01L23/3121 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/96 , H01L2223/6677 , H01L2224/04105 , H01L2224/214 , H01L2224/32245 , H01L2224/73267 , H01L2224/92144 , H01L2924/14 , H01L2924/1431 , H01L2924/3025
摘要： An electronic device having an electronic component with electric terminals and a component carrier in which the electronic component is packaged. The component carrier includes a shielding cage surrounding all sides of the electronic component at least partially.
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公开(公告)号：US11129314B2
公开(公告)日：2021-09-21
申请号：US16434962
申请日：2019-06-07
IPC分类号： H05K13/00 , H01L21/673
摘要： An electronic package includes a component carrier having a stepped cavity formed therein; and a component assembly having at least two electrically connected electronic components with different sizes such that the component assembly has a stepped shape. The component assembly is accommodated at least partially inserted within the stepped cavity. Further described is a method of manufacturing such an electric package.
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公开(公告)号：US20170092630A1
公开(公告)日：2017-03-30
申请号：US15272568
申请日：2016-09-22
IPC分类号： H01L25/16 , H05K1/02 , H05K1/11 , H05K7/20 , H01L23/467 , H01L25/07 , H01L23/00 , H05K1/18 , H01L23/538
CPC分类号： H01L25/16 , H01L23/3677 , H01L23/467 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/17 , H01L24/19 , H01L24/20 , H01L25/074 , H01L25/105 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2225/1035 , H01L2225/1047 , H01L2225/1094 , H01L2924/1033 , H01L2924/13055 , H01L2924/1306 , H01L2924/1426 , H01L2924/1436 , H01L2924/153 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19102 , H01L2924/19105 , H05K1/0206 , H05K1/0209 , H05K1/0212 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K1/185 , H05K7/20154 , H05K2201/10015 , H05K2201/10166 , Y02P70/611
摘要： In a connection system for electronic components (1) comprising a plurality of insulating layers (2) and conductive layers (3) and further comprising at least one embedded electronic component (4) embedded within at least one of the plurality of insulating layers (2) and conductive layers (3) the at least one embedded electronic component (4) is at least one first transistor having a bulk terminal thereof in thermal contact with a thermal duct (6) comprised of a plurality of vias (7) reaching through at least one of an insulating layer (2) and a conductive layer (3) of the connection system for electronic components (1) and emerging on a first outer surface (8) of the connection system for electronic components (1) under a first surface-mounted component (10).
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公开(公告)号：US11264737B2
公开(公告)日：2022-03-01
申请号：US16814684
申请日：2020-03-10
摘要： A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.
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公开(公告)号：US20220030697A1
公开(公告)日：2022-01-27
申请号：US17443235
申请日：2021-07-22
发明人： Naoto Yokoi , Raymond Yi , Sabine Liebfahrt , Christian Vockenberger , Ferdinand Lutschounig , Bernhard Reitmaier
摘要： A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.
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公开(公告)号：US11184983B2
公开(公告)日：2021-11-23
申请号：US16512557
申请日：2019-07-16
摘要： A method of manufacturing a component carrier, wherein the method comprises mounting a known-good component on or spaced with regard to a first known-good component carrier block, thereafter forming an electrically conductive connection structure on and/or in and/or spaced with regard to the first component carrier block, and embedding the component between the first component carrier block and a second known-good component carrier block.
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公开(公告)号：US11051406B2
公开(公告)日：2021-06-29
申请号：US16446434
申请日：2019-06-19
摘要： Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure.
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9.发明授权公开(公告)号：US10356904B2
公开(公告)日：2019-07-16
申请号：US15310991
申请日：2015-05-13
发明人： Johannes Stahr , Wolfgang Schrittwieser , Mike Morianz , Christian Vockenberger , Markus Leitgeb
摘要： The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an electrically conducting contact structure which extends from the surface into the support structure and is electrically connected to the conductor path at a connection point, thereby forming a common conductor track. The conductor path and the contact structure transition into each other in an enlargement-free manner at the connection point.
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公开(公告)号：US20190150295A1
公开(公告)日：2019-05-16
申请号：US15822427
申请日：2017-11-27
摘要： A method of manufacturing a component carrier, wherein the method comprises mounting a known-good component on or spaced with regard to a first known-good component carrier block, thereafter forming an electrically conductive connection structure on and/or in and/or spaced with regard to the first component carrier block, and embedding the component between the first component carrier block and a second known-good component carrier block.
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