公开(公告)号：US6164357A

公开(公告)日：2000-12-26

申请号：US202679

申请日：1998-12-18

申请人： Akio Ochi ,  Kanji Kato ,  Toshio Tanizaki ,  Akira Wada ,  Hidenori Hayashi

发明人： Akio Ochi ,  Kanji Kato ,  Toshio Tanizaki ,  Akira Wada ,  Hidenori Hayashi

IPC分类号： B32B37/20 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  B32B31/16 ,  B32B31/20

CPC分类号： B32B37/206 ,  B32B2038/047 ,  H05K3/0032 ,  H05K3/0052 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/082 ,  H05K2203/1461 ,  H05K2203/1545 ,  Y10T156/1304 ,  Y10T156/1309 ,  Y10T156/1911

摘要： It is an object to provide an apparatus for manufacturing adhesive layers which can be manufactured in a manufacturing process which is fine, which exhibits an excellent mounting efficiency, which does not require a plating process and which is clean, double-sided substrates and multilayer substrates. A bonding-layer forming portion (5) incorporates a bonding portion (1), a hole machining portion (2), a charging portion (3) and a separating portion (4). A double-sided-substrate forming portion incorporates a bonding portion (6), a hole machining portion (7), a charging portion (8) and a separating portion (9), further incorporating a laminating portion (10), a resin hardening portion (11) and a pattern forming portion (12). The apparatus for manufacturing the multilayer substrate has a multilayer laminating portion (13), a resin hardening portion, a resin hardening portion (14) and an outer-layer-patter forming portion (15) to follow the bonding-layer forming portion (5) and the double-sided-substrate forming portion (16).

摘要翻译： PCT No.PCT / JP98 / 01903 Sec。 371 1998年12月18日第 102（e）1998年12月18日日期PCT提交1998年4月24日PCT公布。 第WO98 / 49877号公报 日本公开日1998年11月5日的目的在于提供一种制造粘合剂层的装置，该装置可以在制造过程中精细地制造，其显示出优异的安装效率，其不需要电镀工艺，并且是清洁的， 双面基板和多层基板。 接合层形成部分（5）包括接合部分（1），孔加工部分（2），充电部分（3）和分离部分（4）。 双面基板形成部分包括接合部分（6），孔加工部分（7），充电部分（8）和分离部分（9），还包括层压部分（10），树脂硬化 部分（11）和图案形成部分（12）。 多层基板的制造装置具有多层层叠部（13），树脂硬化部，树脂硬化部（14）和外层图案形成部（15），以沿着接合层形成部（5） ）和双面基板形成部（16）。

公开(公告)号：US07069199B2

公开(公告)日：2006-06-27

申请号：US10327967

申请日：2002-12-26

申请人： Eiji Shima ,  Akio Ochi

发明人： Eiji Shima ,  Akio Ochi

IPC分类号： G06F17/50 ,  G06T15/00

CPC分类号： G06F17/5095 ,  G06F17/5018 ,  G06F2217/16

摘要： A grid convergence solution computation system computes a computed value (Ahigh) Of high-order accuracy, using a single grid, computes a computed value (Alow) of low-order accuracy, using the same single grid, and computes a grid convergence solution based on the relation between the computed value (Ahigh) of high-order accuracy and the computed value (Alow) of low-order accuracy on an assumption that the relation between the computed value (Ahigh) of high-order accuracy, the computed value (Alow) of low-order accuracy, and the grid convergence solution (Aconv) is substantially constant regardless of fineness or coarseness of the grid. The grid convergence solution computation system computes a highly accurate grid convergence solution (Aconv) by using small computational complexity.

摘要翻译： 网格收敛解算机计算系统使用单个网格来计算高阶精度的计算值（A SUB），计算出低阶精度的计算值（A SUB> LOW 使用相同的单个网格，并且基于高阶精度的计算值（A _{high ）与计算值（A low ）之间的关系来计算网格收敛解， 假设高阶精度的计算值（A 高）与计算值（A low ）之间的关系为低阶精度， 的低阶精度，并且网格收敛解决方案（A conv ）基本上是恒定的，而与网格的细度或粗糙度无关。 网格融合解决方案计算系统通过使用小的计算复杂度来计算高度精确的网格融合解决方案（A conv ）。}

公开(公告)号：US20080073024A1

公开(公告)日：2008-03-27

申请号：US11943209

申请日：2007-11-20

申请人： Junichi Kimura ,  Toshihiro Nishii ,  Akio Ochi ,  Shinji Harada

发明人： Junichi Kimura ,  Toshihiro Nishii ,  Akio Ochi ,  Shinji Harada

IPC分类号： B32B38/10 ,  B32B37/00 ,  B32B41/00 ,  B32B38/04

CPC分类号： H05K1/165 ,  H01L21/50 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12034 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/186 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/403 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2203/0169 ,  H05K2203/0191 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/12 ,  H01L2924/00

摘要： A laminated circuit board has electronic components buried therein wherein the laminated circuit board may assure excellent reliability of electrical connections and high mechanical strength even with electronic components mounted in high density. It comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to integrated circuit or the like, and a sheet laminated on the upper surface of the substrate and also provided with a resin fluid filling portion formed by clearance at the outer periphery of integrated circuit or the like, wherein the sheet maintains its shape by woven or non-woven cloth having a hole in which integrated circuit or the like is buried, and the woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.

摘要翻译： 叠层电路板具有埋入其中的电子部件，其中即使电子部件以高密度安装，层压电路板也可确保电连接的良好可靠性和高机械强度。 它包括一个基板，其上设置在其一个主表面上的焊盘通过焊料与集成电路等连接并固定，并且层叠在基板的上表面上并且还设置有由间隙形成的树脂流体填充部分 在集成电路等的外周，其中片材通过编织或无纺布保持其形状，所述织物或非织造布具有埋设有集成电路等的孔，织造或非织造布浸渍有具有 热流动性并被热压缩。 因此，可以提高层叠电路板和电子部件之间的电气和机械连接的可靠性。

公开(公告)号：US07317621B2

公开(公告)日：2008-01-08

申请号：US10991682

申请日：2004-11-18

申请人： Junichi Kimura ,  Toshihiro Nishii ,  Akio Ochi ,  Shinji Harada

发明人： Junichi Kimura ,  Toshihiro Nishii ,  Akio Ochi ,  Shinji Harada

IPC分类号： H05K7/00

CPC分类号： H05K1/165 ,  H01L21/50 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12034 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/186 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/403 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2203/0169 ,  H05K2203/0191 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/12 ,  H01L2924/00

摘要： A laminated circuit board with electronic components buried therein comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to an integrated circuit (or the like). A sheet is laminated on the upper surface of the substrate. A filling portion by fluid resin is formed by clearance at the outer periphery of the integrated circuit (or the like). The sheet maintains its shape by woven or non-woven cloth having a hole in which the integrated circuit (or the like) is buried. The woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.

摘要翻译： 埋设有电子部件的层压电路基板包括基板，其上设置在其主表面上的焊盘通过焊料与集成电路等连接固定。 在基板的上表面上层压片材。 流体树脂的填充部分通过在集成电路（等）的外周边的间隙形成。 该片材通过具有埋入集成电路（等）的孔的编织物或无纺布保持其形状。 织造或无纺布用具有热流动性的树脂浸渍并被热压缩。 因此，可以提高层叠电路板和电子部件之间的电气和机械连接的可靠性。

公开(公告)号：US20050117312A1

公开(公告)日：2005-06-02

申请号：US10991682

申请日：2004-11-18

申请人： Junichi Kimura ,  Toshihiro Nishii ,  Akio Ochi ,  Shinji Harada

发明人： Junichi Kimura ,  Toshihiro Nishii ,  Akio Ochi ,  Shinji Harada

IPC分类号： H01L21/04 ,  H01L21/50 ,  H01L25/00 ,  H01L25/16 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  H05K7/20

CPC分类号： H05K1/165 ,  H01L21/50 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12034 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/186 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/403 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2203/0169 ,  H05K2203/0191 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/12 ,  H01L2924/00

摘要： A laminated circuit board with electronic components buried therein comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to an integrated circuit (or the like). A sheet is laminated on the upper surface of the substrate. A filling portion by fluid resin is formed by clearance at the outer periphery of the integrated circuit (or the like). The sheet maintains its shape by woven or non-woven cloth having a hole in which the integrated circuit (or the like) is buried. The woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.

摘要翻译： 埋设有电子部件的层压电路基板包括基板，其上设置在其一个主表面上的焊盘通过焊料连接并固定到集成电路（等）上。 在基板的上表面上层压片材。 流体树脂的填充部分通过在集成电路（等）的外周边的间隙形成。 该片材通过具有埋入集成电路（等）的孔的编织物或无纺布保持其形状。 织造或无纺布用具有热流动性的树脂浸渍并被热压缩。 因此，可以提高层叠电路板和电子部件之间的电气和机械连接的可靠性。