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1.发明申请ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRONIC DEVICE AND ITS FABRICATION METHOD 失效电子设备基板及其制造方法及其电子设备及其制造方法公开(公告)号：US20090211796A1
公开(公告)日：2009-08-27
申请号：US12432249
申请日：2009-04-29
申请人： Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
发明人： Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
IPC分类号： H05K1/16
CPC分类号： H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05554 , H01L2224/451 , H01L2224/45144 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/85001 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/1461 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。
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2.发明申请公开(公告)号：US20070269590A1
公开(公告)日：2007-11-22
申请号：US11645948
申请日：2006-12-27
申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
发明人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
IPC分类号： B05D5/12
CPC分类号： H01L21/4832 , H01L21/568 , H01L23/3121 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05553 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/49171 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K3/0023 , H05K3/007 , H05K3/06 , H05K3/243 , H05K3/284 , H05K2203/0156 , H05K2203/0571 , H05K2203/1469 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
摘要翻译： 一种电子器件基板，具有：由薄板形成的基材; 电绝缘层，形成在基材上，在其厚度方向上具有多个开口; 以及填充在所述多个开口中的金属镀层。 基材具有金属层，与金属层接触形成的剥离层和与剥离层接触形成的金属膜。
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3.发明授权公开(公告)号：US07880091B2
公开(公告)日：2011-02-01
申请号：US11645948
申请日：2006-12-27
申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
发明人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
IPC分类号： H05K1/03
CPC分类号： H01L21/4832 , H01L21/568 , H01L23/3121 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05553 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/49171 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K3/0023 , H05K3/007 , H05K3/06 , H05K3/243 , H05K3/284 , H05K2203/0156 , H05K2203/0571 , H05K2203/1469 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
摘要翻译： 一种电子器件基板，具有：由薄板形成的基材; 电绝缘层，形成在基材上，在其厚度方向上具有多个开口; 以及填充在所述多个开口中的金属镀层。 基材具有金属层，与金属层接触形成的剥离层和与剥离层接触形成的金属膜。
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4.发明申请Electronic device substrate and its fabrication method, and electronic device and its fabrication method 失效电子器件基板及其制造方法，电子器件及其制造方法公开(公告)号：US20080201943A1
公开(公告)日：2008-08-28
申请号：US12081538
申请日：2008-04-17
申请人： Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
发明人： Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
CPC分类号： H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05554 , H01L2224/451 , H01L2224/45144 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/85001 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/1461 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。
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5.发明申请ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRONIC DEVICE AND ITS FABRICATION METHOD 失效电子设备基板及其制造方法及其电子设备及其制造方法公开(公告)号：US20070235218A1
公开(公告)日：2007-10-11
申请号：US11530344
申请日：2006-09-08
申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
发明人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
CPC分类号： H05K1/113 , H01L21/4857 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/32057 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H05K3/0023 , H05K3/007 , H05K3/025 , H05K3/064 , H05K3/244 , H05K3/386 , H05K3/421 , H05K2201/0394 , H05K2201/09472 , H05K2203/0156 , H05K2203/0733 , H01L2924/00012 , H01L2924/00
摘要： An electronic device substrate is formed of a thin-plate reinforcing substrate; an external connection wiring layer stacked on the reinforcing substrate, and comprising an electrical insulation provided on the reinforcing substrate, an opening formed in the electrical insulation, a first conductor pattern and a via-hole conductor provided in the opening and formed integrally with each other; and a second conductor pattern formed on the opposite side of the electrical insulation to the reinforcing substrate, and at least partially electrically connected to the via-hole conductor.
摘要翻译： 电子器件基板由薄板加强基板形成; 叠层在所述加强基板上的外部连接布线层，并且包括设置在所述加强基板上的电绝缘体，形成在所述电绝缘体中的开口，设置在所述开口中的第一导体图案和通孔导体，并且彼此一体地形成 ; 以及第二导体图案，其形成在与所述加强基板的所述电绝缘体的相对侧上，并且至少部分地电连接到所述通孔导体。
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公开(公告)号：US08230591B2
公开(公告)日：2012-07-31
申请号：US12081538
申请日：2008-04-17
申请人： Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
发明人： Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
IPC分类号： H05K3/02
CPC分类号： H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05554 , H01L2224/451 , H01L2224/45144 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/85001 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/1461 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。
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公开(公告)号：US08230588B2
公开(公告)日：2012-07-31
申请号：US12553815
申请日：2009-09-03
申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
发明人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
CPC分类号： H01L21/4832 , H01L21/568 , H01L23/3121 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05553 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/49171 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K3/0023 , H05K3/007 , H05K3/06 , H05K3/243 , H05K3/284 , H05K2203/0156 , H05K2203/0571 , H05K2203/1469 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of making an electronic device is disclosed. The method includes the steps of providing an electronic device substrate, mounting an electronic part on the electronic device substrate, removing the tape member and the metal film from the electronic device substrate, and forming a conductive structure at a position corresponding to the metal plating layer. The electronic device substrate includes a base material formed of a thin board and the base material includes a tape member, a metal film, a release layer, a metal layer, an electrical insulation layer and a metal plating layer filled in the plurality of openings.
摘要翻译： 公开了一种制造电子设备的方法。 该方法包括以下步骤：提供电子器件基板，将电子部件安装在电子器件基板上，从电子器件基板去除带状部件和金属膜，以及在对应于金属镀层的位置形成导电结构 。 电子设备基板包括由薄板形成的基材，并且基材包括填充在多个开口中的带部件，金属膜，剥离层，金属层，电绝缘层和金属镀层。
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8.发明授权Electronic device substrate and its fabrication method, and electronic device and its fabrication method 失效电子器件基板及其制造方法，电子器件及其制造方法公开(公告)号：US07705245B2
公开(公告)日：2010-04-27
申请号：US11530344
申请日：2006-09-08
申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
发明人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
CPC分类号： H05K1/113 , H01L21/4857 , H01L21/6835 , H01L23/49816 , H01L23/49822 , H01L24/32 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/32057 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/83102 , H01L2224/83385 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H05K3/0023 , H05K3/007 , H05K3/025 , H05K3/064 , H05K3/244 , H05K3/386 , H05K3/421 , H05K2201/0394 , H05K2201/09472 , H05K2203/0156 , H05K2203/0733 , H01L2924/00012 , H01L2924/00
摘要： An electronic device substrate is formed of a thin-plate reinforcing substrate; an external connection wiring layer stacked on the reinforcing substrate, and comprising an electrical insulation provided on the reinforcing substrate, an opening formed in the electrical insulation, a first conductor pattern and a via-hole conductor provided in the opening and formed integrally with each other; and a second conductor pattern formed on the opposite side of the electrical insulation to the reinforcing substrate, and at least partially electrically connected to the via-hole conductor.
摘要翻译： 电子器件基板由薄板加强基板形成; 叠层在所述加强基板上的外部连接布线层，并且包括设置在所述加强基板上的电绝缘体，形成在所述电绝缘体中的开口，设置在所述开口中的第一导体图案和通孔导体，并且彼此一体地形成 ; 以及第二导体图案，其形成在与所述加强基板的所述电绝缘体的相对侧上，并且至少部分地电连接到所述通孔导体。
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9.发明申请公开(公告)号：US20090323299A1
公开(公告)日：2009-12-31
申请号：US12553815
申请日：2009-09-03
申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
发明人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
CPC分类号： H01L21/4832 , H01L21/568 , H01L23/3121 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05553 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/49171 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01046 , H01L2924/0105 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K3/0023 , H05K3/007 , H05K3/06 , H05K3/243 , H05K3/284 , H05K2203/0156 , H05K2203/0571 , H05K2203/1469 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
摘要翻译： 一种电子器件基板，具有：由薄板形成的基材; 电绝缘层，形成在基材上，在其厚度方向上具有多个开口; 以及填充在所述多个开口中的金属镀层。 基材具有金属层，与金属层接触形成的剥离层和与剥离层接触形成的金属膜。
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10.发明申请Electronic device substrate and its fabrication method, and electronic device and its fabrication method 审中-公开电子器件基板及其制造方法，电子器件及其制造方法公开(公告)号：US20060225918A1
公开(公告)日：2006-10-12
申请号：US11376556
申请日：2006-03-16
申请人： Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
发明人： Akira Chinda , Nobuaki Miyamoto , Koki Hirasawa , Kenji Uchida , Mamoru Mita
CPC分类号： H01L21/486 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68345 , H01L2224/05554 , H01L2224/451 , H01L2224/45144 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/85001 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/10161 , H01L2924/14 , H01L2924/1461 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。
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