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    Process for resist pattern formation using positive electrodeposition photoresist compositions
    2.
    发明授权
    Process for resist pattern formation using positive electrodeposition photoresist compositions 失效
    使用正电沉积光致抗蚀剂组合物的抗蚀剂图案形成方法

    公开(公告)号：US5702872A

    公开(公告)日：1997-12-30

    申请号：US610237

    申请日：1996-03-04

    申请人： Genji Imai ,  Naozumi Iwasawa ,  Tsuguo Yamaoka

    发明人： Genji Imai ,  Naozumi Iwasawa ,  Tsuguo Yamaoka

    IPC分类号： G03F7/004 ,  G03F7/039 ,  G03F7/16 ,  G03F7/027

    CPC分类号： G03F7/0045 ,  G03F7/039 ,  G03F7/164 ,  G03F7/168 ,  Y10S430/12 ,  Y10S430/122

    摘要： A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A") a hydroxy-phenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A"), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound. The positive type electrodeposition photoresist composition allows the forming of a fine image pattern at high resolution. A process for a resist pattern formation using such a composition is also disclosed.

    摘要翻译： 正型电沉积光致抗蚀剂组合物包括作为必要组分的（A）100重量份的具有羧基的聚合物，其量为每当所述聚合物为0.5至10当量，并且任选地具有羟基苯基 至少1当量/ kg聚合物或（A'）含羧基聚合物和（A“）含羟基苯基的聚合物的量; （B）5〜150重量份的分子中具有至少2个乙烯基醚基的化合物; 和（C）每100重量份聚合物（A）或聚合物（A'）和聚合物（A“）和含乙烯基醚基化合物（B）的总量为0.1〜40重量份 ），当用光化射线照射时产生酸。 通过用碱性化合物中和聚合物（A）或（A'）中的羧基，将组合物溶解或分散在水性介质中。 正型电沉积光致抗蚀剂组合物允许以高分辨率形成精细图像图案。 还公开了使用这种组合物的抗蚀剂图案形成方法。

    Positive type electrodeposition photoresist compositions
    3.
    发明授权
    Positive type electrodeposition photoresist compositions 失效
    正型电沉积光致抗蚀剂组合物

    公开(公告)号：US5527656A

    公开(公告)日：1996-06-18

    申请号：US233443

    申请日：1994-04-26

    申请人： Genji Imai ,  Naozumi Iwasawa ,  Tsuguo Yamaoka

    发明人： Genji Imai ,  Naozumi Iwasawa ,  Tsuguo Yamaoka

    IPC分类号： G03F7/004 ,  G03F7/039 ,  G03F7/16 ,  G03C1/73

    CPC分类号： G03F7/0045 ,  G03F7/039 ,  G03F7/164 ,  G03F7/168 ,  Y10S430/12 ,  Y10S430/122

    摘要： A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A") a hydroxyphenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A"), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound. The positive type electrodeposition photoresist composition allows the forming of a fine image pattern at high resolution. A process for a resist pattern formation using such a composition is also disclosed.

    摘要翻译： 正型电沉积光致抗蚀剂组合物包括作为必要组分的（A）100重量份的具有羧基的聚合物，其量为每当所述聚合物为0.5至10当量，并且任选地具有羟基苯基 或（A'）含有羧基的聚合物和（A“）含羟基苯基的聚合物的量为每千克聚合物至少1当量; （B）5〜150重量份的分子中具有至少2个乙烯基醚基的化合物; 和（C）每100重量份聚合物（A）或聚合物（A'）和聚合物（A“）和含乙烯基醚基化合物（B）的总量为0.1〜40重量份 ），当用光化射线照射时产生酸。 通过用碱性化合物中和聚合物（A）或（A'）中的羧基，将组合物溶解或分散在水性介质中。 正型电沉积光致抗蚀剂组合物允许以高分辨率形成精细图像图案。 还公开了使用这种组合物的抗蚀剂图案形成方法。

    Process for preparing printed-circuit board
    7.
    发明授权
    Process for preparing printed-circuit board 失效
    制备印刷电路板的工艺

    公开(公告)号：US5236810A

    公开(公告)日：1993-08-17

    申请号：US592245

    申请日：1990-10-03

    申请人： Toshio Kondo ,  Shinsuke Onishi ,  Naozumi Iwasawa ,  Sadaaki Hashimoto

    发明人： Toshio Kondo ,  Shinsuke Onishi ,  Naozumi Iwasawa ,  Sadaaki Hashimoto

    IPC分类号： G03F7/26 ,  H05K3/06

    CPC分类号： G03F7/265 ,  H05K3/064 ,  H05K2203/0793 ,  H05K2203/135

    摘要： An improved process for preparing a printed-circuit board, which successively comprises (I) a step of forming a positive photo-sensitive resist film onto a circuit board having a conductive film according to the electrodeposition coating process, (II) a step of irradiating a full dose of an actinic ray onto the positive photo-sensitive resist film through a photomask with which the actinic ray is cut off over a conductive circuit-forming area, (III) a step of developing the resulting resist film, (IV) a step of etching away a deposited copper-clad area, and (V) removing a remaining resist film on the conductive circuit-forming area, the improvement further comprising a step of imparting the resist film in the conductive circuit-forming area an increased alkali resistance prior to development so as to obtain the printed-circuit board having high resolution with good reproductivity without being affected by variations of the developing conditions.

    摘要翻译： 一种制备印刷电路板的改进方法，其依次包括（I）根据电沉积涂布工艺在具有导电膜的电路板上形成正光敏抗蚀剂膜的步骤，（II）照射步骤 通过在导电电路形成区域上切割光化射线的光掩模，将正光敏抗蚀剂膜上的全剂量的光化射线，（III）显影所得抗蚀剂膜的步骤，（IV） 蚀刻掉沉积的铜包层区域的步骤，以及（V）去除导电电路形成区域上的剩余抗蚀剂膜，该改进还包括将导电电路形成区域中的抗蚀剂膜赋予增加的耐碱性的步骤 在开发之前，以获得具有高分辨率的印刷电路板，具有良好的再现性，而不受显影条件的变化的影响。

    Resins with unsaturated carbonyl and hydroxyl groups
    9.
    发明授权
    Resins with unsaturated carbonyl and hydroxyl groups 失效
    具有不饱和羰基和羟基的树脂

    公开(公告)号：US5216094A

    公开(公告)日：1993-06-01

    申请号：US884881

    申请日：1992-05-18

    申请人： Osamu Isozaki ,  Naozumi Iwasawa

    发明人： Osamu Isozaki ,  Naozumi Iwasawa

    IPC分类号： C08F8/44

    CPC分类号： C08F8/44

    摘要： The present invention provides a curable resin coating composition consisting essentially of:(i) a resin (A) containing .alpha.,.beta.-unsaturated carbonyl group and primary and/or secondary hydroxyl group, or(ii) a mixture of a resin (B) containing .alpha.,.beta.-unsaturated carbonyl group and a resin (C) containing primary and/or secondary hydroxyl group, and(iii) at least one curing catalyst selected from the group consisting of alkali metal alkoxides, metal hydroxides, organic acid salts of metals, quaternary ammonium hydroxides, quaternary phosphonium hydroxides, tertiary sulfonium hydroxides and organic acid salts of these onium hydroxides.

    摘要翻译： 本发明提供一种可固化树脂涂料组合物，其基本上由以下组成：（i）含有α，β-不饱和羰基和伯和/或仲羟基的树脂（A），或（ii）树脂（B） 含有α，β-不饱和羰基和含有伯和/或仲羟基的树脂（C），和（iii）至少一种选自碱金属醇盐，金属氢氧化物，金属有机酸盐的固化催化剂 ，季铵氢氧化物，季铵氢氧化物，叔锍氢氧化物和这些氢氧化镧的有机酸盐。