公开(公告)号：US20140026649A1

公开(公告)日：2014-01-30

申请号：US14041780

申请日：2013-09-30

申请人： Alan J. O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin G. LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

发明人： Alan J. O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin G. LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

IPC分类号： G01N27/26 ,  B81B7/00

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US20140035630A1

公开(公告)日：2014-02-06

申请号：US14041804

申请日：2013-09-30

申请人： Alan J. O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin G. LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

发明人： Alan J. O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin G. LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

IPC分类号： H01L27/14 ,  H01L49/02 ,  H01L27/15

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US20140034104A1

公开(公告)日：2014-02-06

申请号：US14041745

申请日：2013-09-30

申请人： Alan J. O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin G. LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

发明人： Alan J. O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin G. LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

IPC分类号： H01L25/16

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US20120162947A1

公开(公告)日：2012-06-28

申请号：US12975847

申请日：2010-12-22

申请人： Alan O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

发明人： Alan O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

IPC分类号： H05K7/00 ,  H01L31/12 ,  H01L29/86 ,  H01L29/8605 ,  H01L23/525 ,  H01L29/92

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

摘要翻译： 本发明的实施例提供一种集成电路系统，其包括在半导体管芯的前侧制造的第一有源层和在半导体管芯的背面上的第二预制层，并且其中包含电气部件，其中电气部件 包括至少一个分立的无源部件。 集成电路系统还包括耦合第一有源层和第二预制层的至少一个电路径。

公开(公告)号：US20110128250A1

公开(公告)日：2011-06-02

申请号：US12708927

申请日：2010-02-19

申请人： Mark J. MURPHY ,  Eoin Edward English ,  Eoghan Moloney ,  Mel Conway ,  Gary Casey ,  Krystian Balicki

发明人： Mark J. MURPHY ,  Eoin Edward English ,  Eoghan Moloney ,  Mel Conway ,  Gary Casey ,  Krystian Balicki

IPC分类号： G06F3/045

CPC分类号： G06F3/016 ,  G06F3/0414

摘要： A method and a device for detecting user input includes receiving a user input at an input arrangement of a user interface. The input arrangement has at least one piezoelectric sensor that generates an electric signal in response to the input. The electric signal is processed to determine the presence of the input. The processing may indicate the magnitude of the force of the input, in addition to the input's location. An output arrangement of the user interface generates an output in response to the processing. The output may be a haptic, audio or visual output.

摘要翻译： 用于检测用户输入的方法和装置包括在用户界面的输入排列处接收用户输入。 输入装置具有至少一个压电传感器，其响应于输入产生电信号。 处理电信号以确定输入的存在。 处理可以指示输入的力的大小，以及输入的位置。 用户接口的输出布置响应于该处理产生输出。 输出可以是触觉，音频或视觉输出。

公开(公告)号：US20120249475A1

公开(公告)日：2012-10-04

申请号：US13434677

申请日：2012-03-29

申请人： Mark J. MURPHY ,  Mel J. CONWAY ,  Adrian FLANAGAN ,  Shrenik DELIWALA ,  Eoin E. ENGLISH

发明人： Mark J. MURPHY ,  Mel J. CONWAY ,  Adrian FLANAGAN ,  Shrenik DELIWALA ,  Eoin E. ENGLISH

IPC分类号： G06F3/041 ,  G08B6/00 ,  G06F3/045 ,  G06F3/042 ,  G06F3/044

CPC分类号： G06F3/041 ,  G06F1/1694 ,  G06F3/016 ,  G06F3/04886 ,  G06F2200/1637

摘要： Techniques to provide a three-dimensional (“3D”) user interface (“UI”) processing system for a device that may include at least one sensor, a 3D display, and a controller. The controller may include a memory, which may store instructional information, and a processor. The processor may be configured to receive sensor data from the sensor(s) and to interpret sensor data according to the instructional information. The processor may generate a user interface command(s) and transmit the command(s) to the 3D display to control and/or manipulate the 3D display. The processor may also generate host commands to control and/or execute applications within a host system of the device.

摘要翻译： 为可以包括至少一个传感器，3D显示器和控制器的设备提供三维（3D）用户界面（UI）处理系统的技术。 控制器可以包括可以存储教学信息的存储器和处理器。 处理器可以被配置为从传感器接收传感器数据并且根据指导信息来解释传感器数据。 处理器可以生成用户界面命令并将命令传送到3D显示器以控制和/或操纵3D显示。 处理器还可以生成主机命令以在设备的主机系统内控制和/或执行应用。

公开(公告)号：US20120249474A1

公开(公告)日：2012-10-04

申请号：US13434623

申请日：2012-03-29

申请人： Susan Michelle PRATT ,  Mark J. MURPHY ,  Eoin E. ENGLISH ,  Adrian FLANAGAN

发明人： Susan Michelle PRATT ,  Mark J. MURPHY ,  Eoin E. ENGLISH ,  Adrian FLANAGAN

IPC分类号： G06F3/044

CPC分类号： G06F3/041 ,  G06F1/1694 ,  G06F3/016 ,  G06F3/04886 ,  G06F2200/1637

摘要： The present invention may provide a device including a haptic driver to drive a coupled actuator causing the actuator to generate a vibratory haptic effect. A touch screen may display a user interface and may include a sensor to detect user interaction with the touch screen within a predetermined range above the touch screen. A controller may calculate a proximity event based on the detected user interaction above the touch screen, and to control haptic driver operations according to the proximity event.

摘要翻译： 本发明可以提供一种包括触觉驱动器的装置，以驱动耦合的致动器，致使致动器产生振动触觉效果。 触摸屏可以显示用户界面，并且可以包括传感器，以在触摸屏上方的预定范围内检测用户与触摸屏的交互。 控制器可以基于触摸屏上方检测到的用户交互来计算接近事件，并且根据接近事件来控制触觉驾驶员操作。