公开(公告)号：US07939916B2

公开(公告)日：2011-05-10

申请号：US11627041

申请日：2007-01-25

申请人： Alan O'Donnell ,  Oliver Kierse ,  Thomas M. Goida

发明人： Alan O'Donnell ,  Oliver Kierse ,  Thomas M. Goida

IPC分类号： H01L23/552

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/3185 ,  H01L2224/13022 ,  H01L2224/73203 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2224/0401 ,  H01L2224/03

摘要： An electronics package includes a wafer die substrate containing electronic circuits and having a top surface and a bottom surface. A top protective layer is substantially thinner than the substrate and covers the top surface. A bottom protective layer is substantially thinner than the substrate and covers the bottom surface. Circuit contacts are distributed about the bottom protective layer for electrically coupling the substrate electronic circuits to external electronic circuits.

摘要翻译： 电子封装包括包含电子电路并具有顶表面和底表面的晶片管芯衬底。 顶部保护层基本上比基板薄，并且覆盖顶部表面。 底部保护层基本上比衬底更薄并且覆盖底部表面。 电路触点围绕底部保护层分布，用于将衬底电子电路电耦合到外部电子电路。

公开(公告)号：US20080179730A1

公开(公告)日：2008-07-31

申请号：US11627041

申请日：2007-01-25

申请人： Alan O'Donnell ,  Oliver Kierse ,  Thomas M. Goida

发明人： Alan O'Donnell ,  Oliver Kierse ,  Thomas M. Goida

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/3185 ,  H01L2224/13022 ,  H01L2224/73203 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2224/0401 ,  H01L2224/03

摘要： An electronics package includes a wafer die substrate containing electronic circuits and having a top surface and a bottom surface. A top protective layer is substantially thinner than the substrate and covers the top surface. A bottom protective layer is substantially thinner than the substrate and covers the bottom surface. Circuit contacts are distributed about the bottom protective layer for electrically coupling the substrate electronic circuits to external electronic circuits.

摘要翻译： 电子封装包括包含电子电路并具有顶表面和底表面的晶片管芯衬底。 顶部保护层基本上比基板薄，并且覆盖顶部表面。 底部保护层基本上比衬底更薄并且覆盖底部表面。 电路触点围绕底部保护层分布，用于将衬底电子电路电耦合到外部电子电路。

公开(公告)号：US20120162947A1

公开(公告)日：2012-06-28

申请号：US12975847

申请日：2010-12-22

申请人： Alan O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

发明人： Alan O'DONNELL ,  Santiago IRIARTE ,  Mark J. MURPHY ,  Colin LYDEN ,  Gary CASEY ,  Eoin Edward ENGLISH

IPC分类号： H05K7/00 ,  H01L31/12 ,  H01L29/86 ,  H01L29/8605 ,  H01L23/525 ,  H01L29/92

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

摘要翻译： 本发明的实施例提供一种集成电路系统，其包括在半导体管芯的前侧制造的第一有源层和在半导体管芯的背面上的第二预制层，并且其中包含电气部件，其中电气部件 包括至少一个分立的无源部件。 集成电路系统还包括耦合第一有源层和第二预制层的至少一个电路径。

公开(公告)号：US08026599B2

公开(公告)日：2011-09-27

申请号：US11517131

申请日：2006-09-07

申请人： Alan O'Donnell

发明人： Alan O'Donnell

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present application relates to the manufacture of Wafer Level Chip Scale Packages (WLCSPs), which are a type of CSP in which the traditional wire bonding arrangements are dispensed with in favor of making direct contact by means of conductive bumps (typically solder balls) to the integrated circuitry. WLCSPs differ from fine pitch Ball Grid Array (BGA) and leadframe based Chip Scale Packages (CSPs) in that most of the packaging process steps are performed at wafer level. A package and method of manufacture are provided which prevent the ingress of light to the internal circuitry of WLCSP packages by providing a substantially opaque coating on the inactive side of the WLCSP packages and at least partially on the sides of WLCSP packages.

摘要翻译： 本申请涉及晶片级芯片尺寸封装（WLCSP）的制造，这是一种CSP型，其中传统的引线键合装置被省去，有利于通过导电凸块（通常是焊球）直接接触到 集成电路。 WLCSPs与细间距球栅阵列（BGA）和基于引线框架的芯片尺寸封装（CSP）不同，因为大多数封装工艺步骤在晶圆级执行。 提供了一种封装和制造方法，其通过在WLCSP封装的不活动侧提供基本上不透明的涂层并且至少部分地在WLCSP封装的侧面上来防止光进入WLCSP封装的内部电路。

公开(公告)号：US08569861B2

公开(公告)日：2013-10-29

申请号：US12975847

申请日：2010-12-22

申请人： Alan O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin Lyden ,  Gary Casey ,  Eoin Edward English

发明人： Alan O'Donnell ,  Santiago Iriarte ,  Mark J. Murphy ,  Colin Lyden ,  Gary Casey ,  Eoin Edward English

IPC分类号： H01L29/86 ,  H01L29/8605

CPC分类号： G01N27/226 ,  B81B7/00 ,  B81B7/007 ,  B81B2201/0214 ,  G01N27/26 ,  G01N27/4148 ,  H01F17/00 ,  H01F17/04 ,  H01L21/82 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/473 ,  H01L23/481 ,  H01L23/58 ,  H01L24/05 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L25/16 ,  H01L25/167 ,  H01L27/0694 ,  H01L27/14 ,  H01L27/15 ,  H01L28/00 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L28/82 ,  H01L28/86 ,  H01L28/90 ,  H01L31/0392 ,  H01L31/0525 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/06 ,  H01L35/00 ,  H01L35/28 ,  H01L35/30 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/0557 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2225/06531 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H02S10/10 ,  H02S40/38 ,  Y02E10/50 ,  Y02E10/52 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05552 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.

公开(公告)号：US6132283A

公开(公告)日：2000-10-17

申请号：US88273

申请日：1998-06-01

申请人： Teresa Hohol O'Donnell ,  Patrick Alan O'Donnell

发明人： Teresa Hohol O'Donnell ,  Patrick Alan O'Donnell

IPC分类号： A63H33/00 ,  A63H33/38 ,  G09F5/00 ,  G09F19/08

CPC分类号： A63H33/006

摘要： A toy apparatus includes a back housing portion which includes straps for connecting the apparatus to a crib. A plurality of item pressing members are connected to an interior portion of the back housing portion. A front housing portion includes a housing connector for connecting the front housing portion to the back housing portion. The front housing portion includes a plurality of item retainers and a plurality of windows placed in registration with the item retainers. A plurality of infant stimulus items are retained in the item retainers. The item retainers are placed in registration with the item pressing members when the front housing portion and the back housing portion are placed in a closed orientation. A housing lock assembly is connected between the back housing portion and the front housing portion, for keeping the back housing portion and the front housing portion closed with respect to each other. The infant stimulus items can include stimulus cards which include grab tabs located on back sides of the stimulus cards. The housing connector includes a hinge connected between an edge of the back housing portion and a complementary edge of the front housing portion. An electrical power and distribution system is supported by the back housing portion. The electrical power and distribution system includes a battery power supply, electrical conductors, and electrical contacts for powering electrical items used in the apparatus. A lock-enabled electrical switch is located in series in the electrical power and distribution system.

摘要翻译： 一种玩具装置包括：后壳体部分，其包括用于将该装置连接到婴儿床的带子。 多个物品按压构件连接到后壳体部分的内部。 前壳体部分包括用于将前壳体部分连接到后壳体部分的壳体连接器。 前壳体部分包括多个物品保持器和与物件保持器对准放置的多个窗口。 多个婴儿刺激物品保留在物品保持器中。 当前壳体部分和后壳体部分处于闭合方向时，物品保持器被放置成与物品按压部件对准。 壳体锁定组件连接在后壳体部分和前壳体部分之间，用于保持后壳体部分和前壳体部分相对于彼此闭合。 婴儿刺激物品可以包括刺激卡片，其包括位于刺激卡片背面的抓片。 壳体连接器包括连接在后壳体部分的边缘和前壳体部分的互补边缘之间的铰链。 电力和配电系统由后壳体部分支撑。 电力和配电系统包括用于为设备中使用的电气物品供电的电池电源，电导体和电触头。 一个启用锁定的电气开关串联在电力和配电系统中。

公开(公告)号：US20080064137A1

公开(公告)日：2008-03-13

申请号：US11517131

申请日：2006-09-07

申请人： Alan O'Donnell

发明人： Alan O'Donnell

IPC分类号： H01L21/00

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present application relates to the manufacture of Wafer Level Chip Scale Packages (WLCSPs), which are a type of CSP in which the traditional wire bonding arrangements are dispensed with in favour of making direct contact by means of conductive bumps (typically solder balls) to the integrated circuitry. WLCSPs differ from fine pitch Ball Grid Array (BGA) and leadframe based Chip Scale Packages (CSPs) in that most of the packaging process steps are performed at wafer level. A package and method of manufacture are provided which prevent the ingress of light to the internal circuitry of WLCSP packages by providing a substantially opaque coating on the inactive side of the WLCSP packages and at least partially on the sides of WLCSP packages.

摘要翻译： 本申请涉及晶片级芯片尺寸封装（WLCSP）的制造，这是一种CSP型，其中传统的引线键合装置被省去，有利于通过导电凸块（通常是焊球）直接接触到 集成电路。 WLCSPs与细间距球栅阵列（BGA）和基于引线框架的芯片尺寸封装（CSP）不同，因为大多数封装工艺步骤在晶圆级执行。 提供了一种封装和制造方法，其通过在WLCSP封装的不活动侧提供基本上不透明的涂层并且至少部分地在WLCSP封装的侧面上来防止光进入WLCSP封装的内部电路。