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    Orthogonal electrical connection using a ball edge array
    1.
    发明授权
    Orthogonal electrical connection using a ball edge array 失效
    使用球边缘阵列的正交电气连接

    公开(公告)号：US06784372B1

    公开(公告)日：2004-08-31

    申请号：US09579649

    申请日：2000-05-26

    申请人： Albert T. Yuen ,  Pierre H. Mertz

    发明人： Albert T. Yuen ,  Pierre H. Mertz

    IPC分类号： H05K100

    CPC分类号： H05K3/3442 ,  H05K3/366 ,  H05K2201/09036 ,  H05K2201/10454 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

    摘要： An orthogonal electrical connector using a ball edge array includes one or more stackable fiber optic transceivers, wherein each transceiver includes an electrical substrate, and arrays of solder, which is in form of solder balls or solder paste. The solder is held in predetermined position adjacent to the electrical traces on both sides of the electrical substrate inserted into voids on the molded housing and aligned to contact the electrical traces on the motherboard. The electrical traces on the electrical substrate and the motherboard are located close enough so that the solder physically touches both parts during the soldering process. The solder is reflowed by heat, and the melted solder “wicks up” the electrical traces on the electrical substrate by surface tension.

    摘要翻译： 使用球边缘阵列的正交电连接器包括一个或多个可堆叠的光纤收发器，其中每个收发器包括电衬底和焊料阵列，其为焊球或焊膏的形式。 焊料保持在与插入模制外壳上的空隙中的电气基板的两侧上的电迹线相邻的预定位置，并对准以接触主板上的电迹线。 电气基板和母板上的电气迹线位置足够近，使焊料在焊接过程中物理接触两部分。 焊料通过热回流，并且熔化的焊料通过表面张力“汲取”电气基板上的电迹线。

    Integrated optical fiber and electro-optical converter
    2.
    发明授权
    Integrated optical fiber and electro-optical converter 有权

    公开(公告)号：US07494287B2

    公开(公告)日：2009-02-24

    申请号：US11854319

    申请日：2007-09-12

    申请人： Xiaozhong Wang ,  Albert T. Yuen

    发明人： Xiaozhong Wang ,  Albert T. Yuen

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4201 ,  G02B6/3817 ,  G02B6/4202 ,  G02B6/4249 ,  G02B6/4416

    摘要： A fiber optic communications cable for providing a short range, high speed data communications link between information system units, including an optical fiber with an integral housing at each end having an electrical connector extending from the housing and adapted to mate with a corresponding electrical connector on an external information system unit for transferring an information signal between the cable and the unit. A signal converter in the integral housing's converts the information signal between an electrical signal and a corresponding optical signal.

    Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
    3.
    发明授权
    Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers 有权
    用于光纤通信设备的集成封装系统，提供与光纤的自动对准

    公开(公告)号：US06835003B2

    公开(公告)日：2004-12-28

    申请号：US09954384

    申请日：2001-09-10

    申请人： Kirk S. Giboney ,  Paul K. Rosenberg ,  Albert T. Yuen

    发明人： Kirk S. Giboney ,  Paul K. Rosenberg ,  Albert T. Yuen

    IPC分类号： G02B636

    CPC分类号： G02B6/4249 ,  G02B6/4201 ,  G02B6/4228 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

    摘要： The packaging system comprises a mechanical support, an insulating substrate and an electronic circuit. The mechanical support has a first support element that extends at a non-zero angle from a second support element. The insulating substrate has a first portion and a second portion in contact with the first support element and the second support element, respectively. The first portion is contoured to define at least one access hole. The optical communications device and the electronic circuit are mechanically coupled to the first support element. Either or both the optical communications device and the electronic circuit is mechanically coupled to the first support element through a respective one of the at least one access hole. The packaging device additionally comprises a conductive track extending between the electronic circuit and the optical communications device on the first portion of the insulating substrate.

    摘要翻译： 包装系统包括机械支撑件，绝缘基板和电子电路。 机械支撑件具有从第二支撑元件以非零角度延伸的第一支撑元件。 绝缘基板具有分别与第一支撑元件和第二支撑元件接触的第一部分和第二部分。 第一部分是轮廓以限定至少一个进入孔。 光通信设备和电子电路机械耦合到第一支撑元件。 光通信设备和电子电路中的任何一个或两者通过至少一个访问孔中的相应的一个机械耦合到第一支撑元件。 该封装装置还包括在绝缘基板的第一部分上的电子电路和光通信装置之间延伸的导电轨迹。

    Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
    4.
    发明授权
    Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers 有权
    用于光纤通信设备的集成封装系统，提供与光纤的自动对准

    公开(公告)号：US06318909B1

    公开(公告)日：2001-11-20

    申请号：US09248877

    申请日：1999-02-11

    申请人： Kirk S. Giboney ,  Paul K. Rosenberg ,  Albert T. Yuen

    发明人： Kirk S. Giboney ,  Paul K. Rosenberg ,  Albert T. Yuen

    IPC分类号： G02B636

    CPC分类号： G02B6/4249 ,  G02B6/4201 ,  G02B6/4228 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

    摘要： An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.

    摘要翻译： 一种集成的包装系统，包括一体的机械支撑件，印刷电路板和光通信装置。 机械支撑件包括第一支撑元件和第二支撑元件。 第一支撑元件与第二支撑元件成非零角度延伸。 印刷电路板包括分别与第一支撑元件和第二支撑元件接触的第一部分和第二部分。 光通信设备机械耦合到机械支撑件的第一支撑元件并且电连接到印刷电路板的第一部分。 综合包装系统优选地在光通信设备与光学元件和光纤之一或两者之间自动对准。 在这种情况下，第一支撑元件包括装置对准特征。 设备对准特征和光通信设备相对于彼此具有限定的位置关系。 或者，系统可以另外包括盖组件，其包括包括装置对准特征的盖。 所述盖在第一支撑元件处机械联接到装置对准特征和光通信装置相对于彼此具有预定位置关系的位置。

    N-drive p-common surface emitting laser fabricated on n+ substrate
    5.
    发明授权
    N-drive p-common surface emitting laser fabricated on n+ substrate 失效
    在n +衬底上制造的N驱动p共面发射激光器

    公开(公告)号：US5892784A

    公开(公告)日：1999-04-06

    申请号：US330033

    申请日：1994-10-27

    申请人： Michael R. T. Tan ,  Albert T. Yuen ,  Shih-Yuan Wang

    发明人： Michael R. T. Tan ,  Albert T. Yuen ,  Shih-Yuan Wang

    IPC分类号： H01S5/00 ,  H01L33/00 ,  H01L33/30 ,  H01S5/042 ,  H01S5/183 ,  H01S5/30 ,  H01S5/42 ,  H01S3/19

    CPC分类号： H01L33/30 ,  H01L33/0016 ,  H01L33/0062 ,  H01S5/18308 ,  H01S5/0207 ,  H01S5/0421 ,  H01S5/18305 ,  H01S5/2063 ,  H01S5/3054 ,  H01S5/3095 ,  H01S5/423

    摘要： The present invention provides a n-drive surface emitting laser comprised of an active region, a first mirror region having a first conductivity type, a second mirror region having a second opposite conductivity type, the first and second mirror regions being located on opposite sides of the light generation region, a buffer region having a second conductivity type, and a substrate having a first conductivity type. In the preferred embodiment the first conductivity type is n-type, thus the present invention provides a method of forming an n-drive semiconductor laser on an n-type substrate. Contact is made to the p-type mirror region via a tunnel junction formed by degeneratively doping the areas of the substrate region and the buffer region which abut each other. The tunnel junction is reverse biased so that current is injected through the degeneratively doped p-n junction formed by the n+ substrate and the p-type conducting layer.

    摘要翻译： 本发明提供一种n驱动面发射激光器，其包括有源区，具有第一导电类型的第一镜区，具有第二相反导电类型的第二镜区，第一和第二镜区位于 光产生区域，具有第二导电类型的缓冲区域和具有第一导电类型的衬底。 在优选实施例中，第一导电类型是n型，因此本发明提供了在n型衬底上形成n驱动半导体激光器的方法。 通过将衬底区域和相邻的缓冲区的区域进行退化掺杂形成的隧道结对p型反射镜区域进行接触。 隧道结被反向偏置，使得电流通过由n +衬底和p型导电层形成的退化掺杂的p-n结注入。

    High-density fiber-optic module with multi-fold flexible circuit
    6.
    发明授权
    High-density fiber-optic module with multi-fold flexible circuit 失效
    高密度光纤模块，具有多重柔性电路

    公开(公告)号：US07070341B2

    公开(公告)日：2006-07-04

    申请号：US10263942

    申请日：2002-10-02

    申请人： Lakshman Rathnam ,  Edmond Lau ,  Pierre Mertz ,  Albert T. Yuen ,  Howard Huang

    发明人： Lakshman Rathnam ,  Edmond Lau ,  Pierre Mertz ,  Albert T. Yuen ,  Howard Huang

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4201 ,  G02B6/4256 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  H05K1/189 ,  H05K2201/10121

    摘要： A flexible printed circuit board (FPCB) for fiber optic modules includes a board with multiple bends, forming a structure with sides and a bottom. The traces in the FPCB traverse from the opto-electronic chips, through the sides of the FPCB, to the module interconnects at the bottom. The multi-fold structure allows the FPCB to support a higher number of traces than conventional single-fold FPCB's, and it allows the fanning out of signal traces from the opto-electronic and electronic chips at the front of the fiber-optic module, thereby reducing the crosstalk between the traces. This higher number is provided with a FPCB that features a single insulating layer and without the need to criss-cross the traces, resulting in improved signal integrity over conventional multi-layer FPCB's.

    摘要翻译： 用于光纤模块的柔性印刷电路板（FPCB）包括具有多个弯曲的板，形成具有侧面和底部的结构。 FPCB中的迹线从光电芯片穿过FPCB的侧面到底部的模块互连。 多折叠结构允许FPCB支持比传统单折FPCB更多的迹线，并且它允许从光纤模块前面的光电子和电子芯片的信号迹线扇出，从而 减少迹线之间的串扰。 该更高数量的FPCB具有特征在于单个绝缘层并且不需要跨越迹线的FPCB，导致比传统多层FPCB更好的信号完整性。

    Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
    9.
    发明授权
    Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers 有权
    用于光纤通信设备的集成封装系统，提供与光纤的自动对准

    公开(公告)号：US07380994B2

    公开(公告)日：2008-06-03

    申请号：US10932539

    申请日：2004-09-01

    申请人： Kirk S. Giboney ,  Paul K. Rosenberg ,  Albert T. Yuen

    发明人： Kirk S. Giboney ,  Paul K. Rosenberg ,  Albert T. Yuen

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4249 ,  G02B6/4201 ,  G02B6/4228 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

    摘要： An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.

    摘要翻译： 一种集成的包装系统，包括一体的机械支撑件，印刷电路板和光通信装置。 机械支撑件包括第一支撑元件和第二支撑元件。 第一支撑元件与第二支撑元件成非零角度延伸。 印刷电路板包括分别与第一支撑元件和第二支撑元件接触的第一部分和第二部分。 光通信设备机械耦合到机械支撑件的第一支撑元件并且电连接到印刷电路板的第一部分。 综合包装系统优选地在光通信设备与光学元件和光纤之一或两者之间自动对准。 在这种情况下，第一支撑元件包括装置对准特征。 设备对准特征和光通信设备相对于彼此具有限定的位置关系。 或者，系统可以另外包括盖组件，其包括包括装置对准特征的盖。 所述盖在第一支撑元件处机械联接到装置对准特征和光通信装置相对于彼此具有预定位置关系的位置。