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1.发明授权Electronic structures having a joining geometry providing reduced capacitive loading 失效具有提供降低的电容负载的接合几何形状的电子结构
公开(公告)号：US5471090A
公开(公告)日：1995-11-28
申请号：US28023
申请日：1993-03-08
CPC分类号： H01L23/5385 , H05K1/0216 , H05K1/111 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0289 , H05K2201/0373 , H05K2201/0792 , H05K2201/0939 , H05K2201/09427 , H05K2201/10719 , H05K2203/061 , H05K3/4614 , Y02P70/611
摘要： Electrical interconnection structures are described. The electrical interconnection structures are formed by electrically interconnecting in a stack a plurality of discrete substrates. By using a plurality of discrete substrates, a multilayer dielectric/electrical conductor structure can be fabricated from individual discrete substrates each of which can be tested prior to forming a composite stack so that defects in each discrete substrate can be eliminated before inclusion into the stack. Electrical interconnection between adjacent substrate is provided by an array of contact locations on each surface of the adjacent substrates. Corresponding contacts on adjacent substrates are adapted for mutual electrical engagement. Adjacent contact locations can be thermocompression bonded. To reduce the parasitic capacitance and coupled noise between the contact pads and the electrical conductors within the interior of each discrete substrate, the contact pads on each substrate have elongated shape. The elongated contact pads or lattice pads on adjacent substrates are nonparallel and preferably orthogonal so that the corresponding pads of adjacent substrates electrically interconnect an intersecting area which varies in location along the elongated contact pads as the placement of the adjacent substrates varies in the manufacture.
摘要翻译： 描述电互连结构。 电互连结构通过在堆叠中电互连而形成，多个分立的衬底。 通过使用多个分立的衬底，多层电介质/电导体结构可以由单独的离散衬底制成，每个离散衬底可以在形成复合堆叠之前进行测试，以便在包含在堆叠中之前可以消除每个离散衬底中的缺陷。 相邻基板之间的电气互连通过相邻基板的每个表面上的接触位置阵列来提供。 相邻基板上的相应触点适于相互电接合。 相邻的接触位置可以热压粘合。 为了减小接触焊盘和每个离散衬底内部的电导体之间的寄生电容和耦合噪声，每个衬底上的接触焊盘具有细长形状。 相邻基板上的细长接触焊盘或网格焊盘是不平行的并且优选地是正交的，使得相邻衬底的相应焊盘在制造中随着相邻衬底的布置变化而沿着细长的接触焊盘将位置变化的相交区域电连接。
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2.发明授权Device to monitor and control the temperature of electronic chips to enhance reliability 失效用于监控和控制电子芯片温度的装置，以增强可靠性
公开(公告)号：US5569950A
公开(公告)日：1996-10-29
申请号：US563510
申请日：1995-11-28
IPC分类号： H01L23/34 , H01L23/38 , H05K7/20 , H01L31/058
CPC分类号： H01L23/38 , H01L23/34 , H01L2924/0002 , Y10S257/93
摘要： Device to monitor and control the temperature of electronic chips to enhance reliability including a thermal electric cooling device in which the cold side is thermally secured to the chip and the hot side is attached to a heat sink. A thermocouple is sandwiched between the TEC device and the chip and a feedback control circuit is connected between the thermocouple and the voltage source which applies a potential to the TEC device to maintain the chip at the desired substantially constant temperature.
摘要翻译： 用于监测和控制电子芯片的温度以提高可靠性的装置，包括其中冷侧被热固定到芯片的热电冷却装置，并且热侧附接到散热器。 热电偶夹在TEC器件和芯片之间，并且反馈控制电路连接在热电偶和电压源之间，该电压向TEC器件施加电位以将芯片保持在期望的基本恒定的温度。
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公开(公告)号：US06177975B1
公开(公告)日：2001-01-23
申请号：US09559958
申请日：2000-04-27
申请人： Stephen L. Buchwalter , David A. Lewis , Shui-Chih Alan Lien , Sampath Purushothaman , John J. Ritsko
发明人： Stephen L. Buchwalter , David A. Lewis , Shui-Chih Alan Lien , Sampath Purushothaman , John J. Ritsko
IPC分类号： G02F113
CPC分类号： G02F1/1333 , G02F2001/133354
摘要： A system for aligning two plates, in accordance with the present invention, includes a first plate having a lithographically patterned structure formed on a first surface. A second plate also has a lithographically patterned structure formed on a second surface, the first and second surfaces being disposed to face each other. The patterned structures of the plates have corresponding and opposing edges to provide an interference fit between the patterned structures of the first and second plates wherein self-alignment between the first and second plates is realized by engaging the corresponding and opposing edges in the interference fit. A method for aligning two plates includes the steps of providing the system described above, coarsely aligning the plates in a first state which includes an interference between the patterned structures, adjusting at least one of plates to provide a second state having a clearance fit between the patterned structures and moving the plates together and returning to the first state to align the plates relative to each other.
摘要翻译： 根据本发明的用于对准两个板的系统包括形成在第一表面上的具有光刻图案化结构的第一板。 第二板还具有形成在第二表面上的光刻图案结构，第一和第二表面被设置为彼此面对。 板的图案化结构具有对应的和相对的边缘，以在第一和第二板的图案化结构之间提供过盈配合，其中第一和第二板之间的自对准是通过在干涉配合中接合相应和相对的边缘来实现的。 一种用于对准两个板的方法包括以下步骤：提供上述系统，在第一状态下将板粗略对准，该第一状态包括图案化结构之间的干涉，调节板中的至少一个以提供第二状态， 图案化结构并将板移动到一起并返回到第一状态以使板相对于彼此对准。
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4.发明授权Hierarchical system of the simple modification of process steps for a manufacturing tool 失效制造工具的工艺步骤的简单修改的分层系统
公开(公告)号：US5790406A
公开(公告)日：1998-08-04
申请号：US546364
申请日：1995-10-20
申请人： John P. Dunn , David A. Lewis
发明人： John P. Dunn , David A. Lewis
IPC分类号： G05B19/418 , G06F9/00 , G06F11/00
CPC分类号： G05B19/41835 , Y02P90/12 , Y02P90/26
摘要： A system and method for controlling an apparatus, in particular an apparatus for performing manufacturing operations on a work piece is described. The system uses a hierarchical series of levels of functional operations. The system has a highest level and a series of lower levels. There is a means for initiating an instruction in the highest level which results in executing of instructions in the series of lower levels until an instruction is executed to control the apparatus. A particular example consists of four levels all written as sample programming language files which are fully editable and modifiable by end users: A manufacturing operations consists of a cell or cluster of manufacturing the operations of which are controlled by the system of the invention which enables on-line tool diagnostics and simulations that can predict the effects of proposed process changes, thereby reducing the time normally required to make alterations to a process.
摘要翻译： 描述了用于控制装置的系统和方法，特别是用于在工件上执行制造操作的装置。 该系统使用层次化的功能操作级别。 该系统具有最高级别和一系列较低级别。 存在用于启动最高级别的指令的装置，其导致执行下一系列级别的指令，直到执行指令以控制该装置。 一个特定的例子包括四个层次，所有这些层面都是作为最终用户完全可编辑和修改的示例编程语言文件编写的：制造操作包括由本发明的系统控制的制造单元或集群， 可以预测所提出的过程变化的影响的线工具诊断和模拟，从而减少对过程进行更改所需的时间。
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公开(公告)号：US5520949A
公开(公告)日：1996-05-28
申请号：US401364
申请日：1995-03-09
申请人： Victor M. Lewis , David A. Lewis
发明人： Victor M. Lewis , David A. Lewis
摘要： The present invention relates to a whole grain preferably wheat product and a process of preparing same, said product being prepared by the steps of increasing the moisture content of the grain to about 20-45%; heating the hydrated grain at temperatures ranging between 100.degree.-130.degree. C. for 7-50 minutes; dehydrating the grain to a moisture content of about 18-30%; compressing the grains following a short tempering period; and rapidly drying the grains following compression.
摘要翻译： 本发明涉及全谷物优选小麦产品及其制备方法，所述产品通过以下步骤制备：将谷物的水分含量增加至约20-45％; 在100-130℃的温度范围内加热水合谷物7-50分钟; 将谷物脱水至约18-30％的含水量; 在短时间内压缩晶粒; 并在压缩后迅速干燥晶粒。
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公开(公告)号：US5220142A
公开(公告)日：1993-06-15
申请号：US647112
申请日：1991-01-29
申请人： Susan J. LaMaire , David A. Lewis
发明人： Susan J. LaMaire , David A. Lewis
CPC分类号： B65D81/3446 , B65D2581/3441 , B65D2581/3447 , B65D2581/3482
摘要： A control element positioned between an object being heated and a source of microwave radiation is employed to prevent a localized concentration of microwave energy resulting from a discontinuity in the object surface. Close control is provided for heating an object with a sensitive coating.
摘要翻译： 采用定位在被加热物体与微波辐射源之间的控制元件来防止由物体表面的不连续性引起的微波能量的局部浓度。 提供密封控制，用于加热带有敏感涂层的物体。
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公开(公告)号：US5191182A
公开(公告)日：1993-03-02
申请号：US799376
申请日：1991-11-27
申请人： Jeffrey D. Gelorme , David A. Lewis , Jane M. Shaw
发明人： Jeffrey D. Gelorme , David A. Lewis , Jane M. Shaw
CPC分类号： H05B6/705 , B01J19/126 , C08G73/1025 , G01N22/00 , H05B6/68 , B01J2219/00191 , H05K1/0346 , H05K3/4644 , Y02B40/143
摘要： Disclosed is a tuneable microwave apparatus useful in carrying out chemical and physical processes on a sample, particularly including polymerization. The apparatus includes a cavity in which the sample is disposed, a microwave supply, microwave power meter and sensor, means for sensing the temperature in the cavity, means for varying the volume of the chamber within the cavity wherein the sample is disposed, means for measuring microwave reflection from the sample, and computer-controlled means operatively associated with the foregoing to vary the microwave power and the size of the chamber. Openings are provided within the chamber to permit removal of vapor generated during expousre of the sample to the microwave radiation.
摘要翻译： 公开了可用于对样品进行化学和物理过程的可调谐微波装置，特别是包括聚合。 该装置包括其中设置样品的空腔，微波供应，微波功率计和传感器，用于感测空腔中的温度的装置，用于改变腔体内体积的装置，其中设置样品， 测量来自样品的微波反射，以及与上述操作相关联的计算机控制装置，以改变微波功率和室的尺寸。 在室内提供开口以允许将在样品暴露期间产生的蒸气除去到微波辐射。
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公开(公告)号：US4621976A
公开(公告)日：1986-11-11
申请号：US726260
申请日：1985-04-23
申请人： Larry A. Marshall , David A. Lewis
发明人： Larry A. Marshall , David A. Lewis
CPC分类号： F01D5/24 , F01D25/246 , Y10S416/50
摘要： An integrally cast stator is formed having an annular array of vanes connected at their outer ends to an outer shroud and connected at their inner ends to an inner shroud, said outer shrouds of adjacent cast stators having a snap fit, said inner shroud having an annular C-shaped channel integrally formed within its inner surface by an inwardly extending radial flange and rearwardly extending cylindrical flange. An annular spring damping device having an outer annular arm and an inner annular arm, said damping device being positioned in said annular C-shaped channel with said inner annular arm fixed in said C-shaped channel inwardly of said inner shroud and with said outer annular arm biased against said inner surface of said inner shroud. A modification has two annular C-shaped channels.
摘要翻译： 整体铸造的定子形成为具有环形阵列的叶片，其环形阵列的叶片在其外端处连接到外护罩并在其内端处连接到内护罩，相邻铸造定子的所述外护罩具有卡扣配合，所述内护罩具有环形 C形通道通过向内延伸的径向凸缘和向后延伸的圆柱形凸缘在其内表面内整体形成。 一种具有外部环形臂和内部环形臂的环形弹簧阻尼装置，所述阻尼装置定位在所述环形C形通道中，所述内部环形臂固定在所述内部护罩内部的所述C形通道中，并且所述外部环形 臂抵靠所述内护罩的内表面。 改型具有两个环形C形通道。
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9.发明授权
公开(公告)号：US5536921A
公开(公告)日：1996-07-16
申请号：US548262
申请日：1995-10-25
CPC分类号： H05B6/788
摘要： A microwave processing system is provided wherein the material to be processed is in the form of a web type quantity configuration with a thickness that is small in relation to the wavelength of a particular microwave frequency. The material is passed through the field associated with a plurality of microwave standing waves of the particular frequency, each adjacent standing wave being offset 1/4 wavelength along the direction of movement of the web. A carrier gas removes volatile solvents from the material surfaces. Control is provided for the interrelationship of temperature, rate of movement, flow of carrier gas, and microwave power.
摘要翻译： 提供了一种微波处理系统，其中待处理的材料是相对于特定微波频率的波长具有较小厚度的幅材类型数量构型的形式。 材料通过与特定频率的多个微波驻波相关联的场，每个相邻驻波沿着幅材的移动方向偏移1/4波长。 载气从材料表面除去挥发性溶剂。 提供温度，运动速率，载气流量和微波功率的相互关系的控制。
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公开(公告)号：US5495397A
公开(公告)日：1996-02-27
申请号：US54110
申请日：1993-04-27
CPC分类号： H05K3/4641 , H01L25/0652 , H05K1/145 , H01L2224/48091 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H05K1/053 , H05K1/056 , H05K2201/068 , H05K2201/09309 , H05K2201/09718 , H05K3/3436 , H05K3/4608 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926
摘要： A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection members to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection members can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.
摘要翻译： 描述了用于最终高性能计算机的三维封装架构及其制造方法。 该封装允许非常密集的多个集成电路芯片的封装，以实现计算机的最小通信距离和最大时钟速度。 包装结构由多个子组件形成。 每个子组件由至少一个侧面上至少有一个集成电路器件的衬底形成。 在相邻的子组件之间设置有第二衬底。 存在电互连构件以将子组件上的接触位置电互连到第二衬底上的接触位置。 电气互连构件可以是焊料堆，引线接合等。 第一基板在电子设备和每个子组件之间提供电信号互通。 第二基板提供对多个子组件的接地和功率分配。 可选地，结构的外表面可以设置成存储芯片的立方体。
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