Apparatus Having an Embedded 3D Hybrid Integration for Optoelectronic Interconnects
    9.
    发明申请
    Apparatus Having an Embedded 3D Hybrid Integration for Optoelectronic Interconnects 有权
    具有用于光电互连的嵌入式3D混合集成的装置

    公开(公告)号:US20100215314A1

    公开(公告)日:2010-08-26

    申请号:US12709279

    申请日:2010-02-19

    IPC分类号: G02B6/12 G02B6/42

    摘要: An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

    摘要翻译: 本文描述了一种光电子器件,包括发射器,接收器和光波导,所有这些都嵌入在PCB中。 发射机包括激光发生器和用于产生电信号和光信号的其它电路,其通过波导传输到接收器。 接收器包括用于检测和将光信号转换成电信号的电路和检测器。 发射器和接收器的电路和光学部件集成在3D混合芯片组中,其中芯片组件以3D结构堆叠。 由于所有电路和光学元件均嵌入在PCB中,因此该设备非常紧凑,适用于便携式产品。