摘要:
An apparatus for suppressing mid-frequency noise in an integrated circuit having multiple voltage islands is disclosed. Voltage rails powered at higher nominal voltages are selectively connected to voltage rails powered at lower nominal voltages via controlled gates. During operation, a voltage rail in which voltage has decreased below a pre-determined threshold is coupled to a voltage rail powered at a higher nominal voltage for a pre-selected time interval.
摘要:
A device may include a current source for connecting to a printed circuit board. The device may also include a first FET switch pack and a second FET switch pack for connecting to the surface mount connector of the printed circuit board. Additionally, the device may include a FET controller connected to the first FET switch pack and the second FET switch pack. The FET controller may be utilized for connecting a first FET and a second FET to the first region of the surface mount connector. The FET controller may be configured for supplying the current to the first region of the surface mount connector to produce at least one continuous heat signature characteristic of an improperly connected ground pin. A thermal monitoring module may be used to identify the improper physical connection.
摘要:
A device may include a current source for connecting to a printed circuit board. The device may also include a first FET switch pack and a second FET switch pack for connecting to the surface mount connector of the printed circuit board. Additionally, the device may include a FET controller connected to the first FET switch pack and the second FET switch pack. The FET controller may be utilized for connecting a first FET and a second FET to the first region of the surface mount connector. The FET controller may be configured for supplying the current to the first region of the surface mount connector to produce at least one continuous heat signature characteristic of an improperly connected ground pin. A thermal monitoring module may be used to identify the improper physical connection.
摘要:
A method of reducing crosstalk induced noise in a physical circuit wiring design constructs a spatial vector for each interconnect wire segment in the physical circuit wiring design. The method compares the spatial vectors of said physical circuit wiring design and identifies any of the spatial vectors that are parallel to each other and have opposite directions. The method may identify all drivers and receivers in the physical circuit wiring design, and trace each interconnect line, starting with its driver, to determine a routed length from the driver to each segment break point of the interconnect line. The method may construct the spatial vector by defining an origin in the physical circuit wiring design. The method determines a starting point and an ending point of the spatial vector with respect to the origin. The starting point of the spatial vector is the break point of the interconnect wire segment closer to the driver. The ending point of the spatial vector is the break point of the interconnect wire segment farther from the driver. The method may define a Cartesian coordinate system with respect to the origin. The Cartesian coordinate system may be orthogonal with the interconnect wire segments of the physical circuit wiring design. The method may define one or more geometry windows in the physical circuit wiring design and compare the spatial vectors in each geometry window.
摘要:
A method of reducing crosstalk induced noise in a physical circuit wiring design constructs a spatial vector for each interconnect wire segment in the physical circuit wiring design. The method compares the spatial vectors of said physical circuit wiring design and identifies any of the spatial vectors that are parallel to each other and have opposite directions. The method may identify all drivers and receivers in the physical circuit wiring design, and trace each interconnect line, starting with its driver, to determine a routed length from the driver to each segment break point of the interconnect line. The method may construct the spatial vector by defining an origin in the physical circuit wiring design. The method determines a starting point and an ending point of the spatial vector with respect to the origin. The starting point of the spatial vector is the break point of the interconnect wire segment closer to the driver. The ending point of the spatial vector is the break point of the interconnect wire segment farther from the driver. The method may define a Cartesian coordinate system with respect to the origin. The Cartesian coordinate system may be orthogonal with the interconnect wire segments of the physical circuit wiring design. The method may define one or more geometry windows in the physical circuit wiring design and compare the spatial vectors in each geometry window.
摘要:
A method, a system and a computer program product for reducing coupling noise in low loss on-module wires used for connecting module components in electrical circuits/devices. During the design stage, an Enhanced Crosstalk Reduction (ECR) utility identifies interconnect wires as driven/aggressor traces or receiver traces. The ECR utility substantially avoids forward crosstalk in a victim trace by specially arranging driver traces adjacent to the receiver victim trace in order to provide a lower level and saturated level of backward crosstalk. In particular, the ECR utility provided a configuration of wire/trace layers based on one or more of: (a) the crosstalk impact of a trace when positioned in a particular location; (b) the crosstalk impact of the trace upon remaining components based on placement in the particular location; and (c) system component specifications. In addition, the ECR utility reduces crosstalk by providing a configuration of receiver wires and transmitter wires without the use of isolation layers.
摘要:
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or below) signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. In order to provide increased routing density, signal paths are routed over the voids, but disruption of the signal paths by the voids is prevented by including a conductive strip through the voids that reduces the coupling to the signal-bearing PTHs and maintains the impedance of the signal path conductor.
摘要:
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only slightly. The transmission line reference plane defines voids above (or below) signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. In order to provide increased routing density, signal paths are routed over the voids, but disruption of the signal paths by the voids is prevented by including a conductive strip through the voids that reduces the coupling to the signal-bearing PTHs and maintains the impedance of the signal path conductor.
摘要:
A system and method for reducing noise in a multi-layer ceramic package are provided. With the system and method, additional shielding wires are inserted into the reference planes wherever there are no signal vias present. These additional lines in the reference planes force stronger signal interaction with the reference (vdd/gnd) thereby reducing the interaction between the signals in the signal layers. As a result, the noise present in the signals of the signal layers is reduced.
摘要:
An integrated circuit substrate is designed and fabricated with a selectively applied transmission line reference plane metal layer to achieve signal path shielding and isolation, while avoiding drops in impedance due to capacitance between large diameter vias and the transmission line reference plane metal layer. The transmission line reference plane defines voids above (or below) the signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. For voltage-plane bearing PTHs, no voids are introduced, so that signal path conductors can be routed above or adjacent to the voltage-plane bearing PTHs, with the transmission line reference plane preventing shunt capacitance between the signal path conductors and the PTHs.